Abstract: A curable resin composition contains (A) a polyphenylene ether resin in an amount of 100 parts by weight and (B) an allyl-containing compound represented by general formula (1) in an amount ranging from 1.5 to 6.0 parts by weight.

Abstract: A curable resin composition for obtaining a cured product having improved heat resistance contains a component (A), which is a polyphenylene ether resin, in an amount of 100 parts by weight, and a component (B), which is a diallyl ether compound represented by general formula (1), in an amount of 0.1 to 4.9 parts by weight: wherein R1 to R8 each independently represent a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms.

Abstract: An object is to provide a compound that can be a novel curing agent. The compound suppresses volatilization of the curing agent that can lead to a decrease in function of a prepreg, contamination of equipment for producing the prepreg, and in addition a decrease in production yield of the prepreg, and further contributes to improving dielectric properties. As a solution, a tris(allyl ether) compound represented by general formula (1) below is provided.