Abstract: An apparatus and method for peeling, and an apparatus and method for laminating which are preferable to reduce the overall size of the apparatus are provided. When a transport means 8 transports a wafer W with glass plate G, and a holding roller 2, in synchronization with the transportation, rotates around its central axis, the holding roller 2 contacts the wafer W to peel it and hold it thereon, and after the peeling is completed, the transport means 8 transports a ring frame F in a direction opposite to the direction for peeling. In synchronization with the transportation, the holding roller 2 rotates around its central axis in a direction opposite to the direction for peeling, so that the holding roller 2 sticks the wafer W held on the holding roller to the ring frame F by means of a dicing tape T2.

Abstract: A fragile member processing system is provided to perform a series of processes such that, after mounting a semiconductor wafer W to one surface of which a glass plate P has been stuck onto a ring frame RF, the glass plate P is peeled off to transfer/adhere the semiconductor wafer W, and the double-faced adhesive sheet S remaining on the surface of the semiconductor wafer W is peeled off. A transferring/adhering device 20 is provided so that, after forming a peeling initiation portion 62 between the glass plate P and the semiconductor wafer W, the angle thereof can be changed in the direction of erecting the ring frame RF. The present invention is also applicable to an object in which only a protective sheet is stuck to the circuit surface of the semiconductor wafer W. In this case, the transferring/adhering device is applicable as a table in the middle position when transferring wafer.

Abstract: A transferring apparatus for a brittle member capable of peeling a hard member from the brittle member without applying a stress more than required to the brittle member and effectively preventing the brittle member from being damaged by erroneous peeling is provided. When the hard member is peeled off from a stuck structure formed by sticking the brittle member on the top surface of the hard member through a double-sided adhesive sheet to transfer the brittle member onto the adhesive sheet, the adhesive sheet is stuck on the brittle member of the stuck structure to form it integrally with a frame, the hard member side is positioned and fixed onto a table (8), and the frame (6) is raised diagonally upward with respect to the surface of the table with a predetermined torque by a torque control motor (12) with a rotary shaft (13) as a fulcrum. The hard member is peeled off from the brittle member with a force for raising the frame, namely, with the predetermined torque.

Abstract: An apparatus for peeling an adhesive tape is provided for enabling fragmented adhesive tapes to be readily and efficiently peeled from a plate-shaped member. The apparatus for peeling a surface protection tape (adhesive tape) 2a adhered on the surface of a wafer (plate-shaped member) W and fragmented into chip-size pieces from the wafer W comprises peeling tape supplying means 20 for feeding a peeling tape 3 to the wafer W set on a suction table 10; peeling tape adhering means for adhering the peeling tape 3 fed out by the peeling tape supplying means 20 over the entire surface of the surface protection tape 2a adhered on the surface of the wafer W; heating means for heating the peeling tape adhered over the entire surface of the adhesive tape by the peeling tape adhering means together with the adhesive tape; tape peeling means for peeling the adhesive tape sticking to the peeling tape through the heating by the heating means from the plate-shaped.