Abstract: A process for treating the surface of a resin substrate with an ozone gas by bringing the ozone gas into contact with the surface includes the steps of: generating an ozone gas; humidifying the generated ozone gas; and exposing the surface of the resin substrate to the humidified ozone gas.

Abstract: A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistically operated to enable the formation of a plated coating having excellent adhesive strength by a short treatment. In addition, even by a long treatment, the adhesive strength can be restrained from lowering. Consequently, a plated coating having excellent adhesion can be formed without roughening the surface of the resin material by a short pretreatment.

Abstract: The present invention relates to a decorative film formed on the surface of a resin substrate positioned within a radar device path and a method for forming the same. The present invention provides a decorative film that can be formed with high yield and efficiency without highly accurate film thickness regulation and is excellent in terms of radiowave transmission performance and appearance design, with a metallic color tone, and to provide a method for forming the same. Such method is a method for forming a decorative film 10 on the surface of a resin substrate 101 positioned within a radar device path, wherein a decorative film 10 comprising an organic film 12 in which metal nanoparticles 11 are dispersed is formed by producing an organic material comprising a solvent in which metal nanoparticles 11 (to which organic molecules are coordinated) are dispersed, applying the organic material to the surface of a resin substrate 101, and volatilizing the solvent.

Abstract: A wire harness has a wiring film which includes an insulating substrate (10), a plurality of wires (20) arranged on a surface of the insulating substrate (10), and an insulating covering (30) that coats the surface of the insulating substrate (10) so as to cover the wires (20). The wire harness is shaped by winding the wiring film around a longitudinal axis of a core (C), which is paralleled to the longitudinal axis (L) of the wires.

Abstract: A production method of an electroless plating material of the present invention is a method for the production of an electroless plating material that has a surface to be plated by electroless plating, and includes an ozone treatment step in which a material body that is made of a resin is brought into contact with a solution that contains ozone to form a modified layer in a surface of the material body, and a superficial layer removal step in which, after the ozone treatment step, the surface of the material body is irradiated with ultraviolet rays to remove a superficial layer of the modified layer.

Abstract: A process for manufacturing workpiece whose surface is to be plated by means of electroless plating includes an ozone-processing step, and a superficial-layer removing step. In the ozone-processing step, a workpiece body including resin and having a surface is processed by means of an ozone treatment by brining the workpiece body into contact with a solution including ozone. Thus, a modified layer is formed on the surface of the workpiece body. Then, in the superficial-layer removing step, a superficial layer is removed from the resultant modified layer by applying energy onto the modified layer.

Abstract: According to the present invention, a circuit board having a further-microfabricated circuit pattern that can be manufactured in further simplified steps is obtained. For such purpose, a mold 10, which has protrusions 11 formed in a pattern corresponding to a circuit pattern, is used to apply a conductive material layer (metal paste) 13 to head portions of the protrusions 11 of the mold 10. The mold is heat- and pressure-welded to the surface of a substrate 20 that is made of a resin film or the like. Accordingly, a pattern comprising the protrusions 11 and the conductive material layer (metal paste) 13 are transferred to the substrate 20. After transfer, the resin substrate (resin molding 30) is immersed in a copper sulfate plating bath for electrolytic plating treatment. Copper ions in the plating bath were deposited inside each recess 31 while the conductive material layer 13 is used as a base material for the formation of a metal wiring 32.

Abstract: A resin-metal composite layer is formed by modifying a surface of a resin substrate to a modified layer, contacting the modified layer with a metal compound solution, and adsorbing at least either metal colloids or ions are adsorbed to the polar group, so that metal particles are dispersed into the modified layer. Because of the fineness of the metal particles in the resin-metal composite layer, high transparent can be achieved. The resin-metal composite layer functions as a transparent conductive layer and the like.

Abstract: After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C—OH bonds or C?O bonds, thereby activating the surface of the plating material, and since a surface active agent 1 is adsorbed thereon, a catalyst 2 is adsorbed on hydrophilic groups of the surface active agent 1 which has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.

Abstract: This invention provides an electrochemically active organic thin film capable of repeating reversible oxidation/reduction a number of times. Further, the invention provides a novel approach to so-called “molecular nanoelectronics” utilizing organic molecules as operating units, with the use of such organic thin film. Such electrochemically active organic thin film comprises a substrate, an organic molecular film comprising organic molecules having terminal amino groups chemically fixed on the surface of the substrate, and metal atoms or metal ions coordinately hound to the amino groups.

Abstract: A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect.

Abstract: A resin-metal composite layer is formed by modifying a surface of a resin substrate to a modified layer, contacting the modified layer with a metal compound solution, and adsorbing at least either metal colloids or ions are adsorbed to the polar group, so that metal particles are dispersed into the modified layer. Because of the fineness of the metal particles in the resin-metal composite layer, high transparent can be achieved. The resin-metal composite layer functions as a transparent conductive layer and the like.

Abstract: A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistically operated to enable the formation of a plated coating having excellent adhesive strength by a short treatment. In addition, even by a long treatment, the adhesive strength can be restrained from lowering. Consequently, a plated coating having excellent adhesion can be formed without roughening the surface of the resin material by a short pretreatment.

Abstract: This invention provides a method for plating a resin material that improves adhesion strength between a resin material and a plated metal layer and reduces the cost incurred by plating. This method comprises a step of treating a resin material with ozone water and a step of permitting the resin material to adsorb at least one metal catalyst selected from the group consisting of silver, cobalt, nickel, ruthenium, cerium, iron, manganese, and rhodium catalysts.

Abstract: After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C—OH bonds or C═O bonds, thereby activating the surface of the plating material, and since a surface active agent 1 is adsorbed thereon, a catalyst 2 is adsorbed on hydrophilic groups of the surface active agent 1 which has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.

Abstract: A passive platform stabilization system is disclosed which is suitable for antenna stabilization in maritime communication systems. The stabilization system of the present invention comprises a platform rotatable in a horizontal plane. At least two gyros are suspended from the platform by suspension means which are rotatable about a vertical axis independent of the rotation of the platform in order to avoid undesirable torque components which would result from precession of the gyros. The platform pivots about axes which are parallel to the pitch and roll axes of a vessel on which it is mounted.