Patents by Inventor Takeshi Eimura

Takeshi Eimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing multilayered printed-wiring-board
    Patent number: 5031308
    Abstract: A method of manufacturing a mutilayered printed-wiring-board comprises attaching conductive members on conductive layers, superimposing a plurality of printed-wiring boards, and electrically connecting the conductive layers with one another by the conductive members.
    Type: Grant
    Filed: December 26, 1989
    Date of Patent: July 16, 1991
    Assignee: Japan Radio Co., Ltd.
    Inventors: Kazuo Yamashita, Eiki Takahashi, Osamu Teshigawara, Masaki Kinoshita, Takeshi Eimura, Takao Ohiwa