Patents by Inventor Takeshi Endo

Takeshi Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230296799
    Abstract: A method, article and system are provided for processing and interpreting acoustic data. The method and system includes providing a number of acoustic processing elements, each element being associated with an acoustic mode of a number of acoustic modes of a sonic measurement tool adapted to acquire data representing acoustic measurements in a borehole. In addition the method and system includes providing a user interface to organize a processing chain of the number of acoustic processing elements such that the acoustic processing elements process the acquired data according to a predefined workflow.
    Type: Application
    Filed: April 6, 2023
    Publication date: September 21, 2023
    Inventors: Henri-Pierre Valero, Takeshi Endo, Hrvoje Markovic, Yoshisuke Fukagawa, Yuta Okabe, Shinichi Sunaga, Mitsuko Kitazawa, Ryoko Hayashi, Ivayla Gueorguieva
  • Publication number: 20230268100
    Abstract: Provided is a method of manufacturing an electrically conductive film laminate 1 including a substrate to be laminated 10, an adhesive layer 20 formed on a surface of the substrate to be laminated 10, and an electrically conductive carbon film 30 formed on a surface of the adhesive layer 20, the method including: a first laminate manufacturing step for manufacturing a first laminate 110 including a forming substrate 40 for forming the electrically conductive carbon film 30 on a surface thereof, the electrically conductive carbon film 30 formed on a surface of the forming substrate 40, and the adhesive layer 20 formed on a surface of the electrically conductive carbon film 30; a thermocompression bonding step for manufacturing a second laminate 120 by bringing the adhesive layer 20 of the first laminate 110 into contact with the substrate to be laminated 10, and then performing heating and pressure bonding; and an etching step for manufacturing the electrically conductive film laminate 1 by etching the forming
    Type: Application
    Filed: February 24, 2023
    Publication date: August 24, 2023
    Inventors: Kazuyuki ENDO, Shinji KOH, Takeshi WATANABE, Sho KUROMATSU
  • Publication number: 20230221453
    Abstract: Embodiments provide for a method that utilizes the azimuthally spaced receivers of a sonic logging tool. Signals from monopole and dipole sources are reflected from the geologic interfaces and recorded by arrays of receivers of the same tool. For the incident P-waves from the monopole source, phase arrival times for the azimuthal receivers are compensated for stacking using properties of wave propagation in the borehole, and for the incident SH-waves from the dipole source, signs of waveforms for the receivers are changed for specified azimuths.
    Type: Application
    Filed: March 30, 2021
    Publication date: July 13, 2023
    Inventors: Nobuyasu Hirabayashi, Yevgeniy Karpekin, Nicholas Norman Bennett, John Adam Donald, Asbjoern Lund Johansen, Takeshi Endo
  • Publication number: 20230215894
    Abstract: An apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor, and a second substrate including a peripheral circuit portion are placed upon each other. The first substrate does not include a high-melting-metal compound layer, and the second substrate includes a high-melting-metal compound layer.
    Type: Application
    Filed: March 15, 2023
    Publication date: July 6, 2023
    Inventors: Nobuyuki Endo, Tetsuya Itano, Kazuo Yamazaki, Kyouhei Watanabe, Takeshi Ichikawa
  • Publication number: 20230158519
    Abstract: A rectifying member capable of improving a collision force of a jet fluid, and a nozzle. A rectifying member includes rectifying elements each having a tubular casing and a division wall structure formed in the casing; the division wall structure includes partition walls, and has a circumferential division wall group being adjacent in a circumferential direction of an inner wall of the casing and having an extending partition wall, and an inside division wall group in an inside region of the fluid flow path.
    Type: Application
    Filed: July 12, 2021
    Publication date: May 25, 2023
    Applicant: KYORITSU GOKIN CO., LTD.
    Inventors: Hiroyuki ENDO, Tsuyoshi CHIMOTO, Takeshi SAITO
  • Patent number: 11644588
    Abstract: A method, article and system are provided for processing and interpreting acoustic data. The method and system includes providing a number of acoustic processing elements, each element being associated with an acoustic mode of a number of acoustic modes of a sonic measurement tool adapted to acquire data representing acoustic measurements in a borehole. In addition the method and system includes providing a user interface to organize a processing chain of the number of acoustic processing elements such that the acoustic processing elements process the acquired data according to a predefined workflow.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 9, 2023
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Henri-Pierre Valero, Takeshi Endo, Hrvoje Markovic, Yoshisuke Fukagawa, Yuta Okabe, Shinichi Sunaga, Mitsuko Kitazawa, Ryoko Hayashi, Ivayla Gueorguieva
  • Publication number: 20230106733
    Abstract: A semiconductor device includes: an active region having a semiconductor element and a surface electrode provided by a wiring electrode material and connected to the semiconductor element on a side adjacent to a surface of a semiconductor chip; and a pad arrangement region having a pad provided by the wiring electrode material. The pad arrangement region overlaps the active region in a direction normal to the surface of the semiconductor chip. In a part where the pad arrangement region and the active region overlap, the pad is disposed on the surface electrode through an isolation insulating film so that the wiring electrode material is in two layers to provide a double-layer wiring electrode structure. In a part of the active region without overlapping the pad arrangement region, the surface electrode has a single-layer wiring electrode structure composed of a single layer of the wiring electrode material.
    Type: Application
    Filed: September 16, 2022
    Publication date: April 6, 2023
    Inventors: Masato NOBORIO, Yoshitaka KATO, Takeshi ENDO
  • Publication number: 20230105437
    Abstract: Provided is a curable resin composition exhibiting reduced or controlled shrinkage on curing. The composition includes (A) an epoxy resin, (B) a latent curing agent, and (C) a compound represented by formula (1): wherein X is an oxygen atom or a sulfur atom; R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an aryl group; and R3 and R4 each independently represent a hydrogen atom, an alkyl group, or an aryl group, or R3 and R4 are connected to each other to represent a divalent group to form a ring.
    Type: Application
    Filed: March 16, 2021
    Publication date: April 6, 2023
    Inventors: Takeshi ENDO, Junji UEYAMA, Ryo OGAWA
  • Publication number: 20230001482
    Abstract: A method of producing silver fine particles includes continuously reducing silver ions contained in a silver compound to precipitate silver fine particles by introducing at least two fluids from separate flow paths and mixing the fluids, wherein one fluid of the at least two fluids contains the silver compound, and another fluid contains a reducing agent, and at least one fluid of the at least two fluids contains an amino acid. With this method, silver fine particles can be produced with sufficient continuous productivity and quality uniformity, without problems of deterioration of working environment and generation of explosive fulminating silver due to the use of a large amount of ammonia.
    Type: Application
    Filed: November 28, 2019
    Publication date: January 5, 2023
    Applicant: M. Technique Co., Ltd.
    Inventors: Kazutaka TAKEDA, Takeshi ENDO
  • Publication number: 20230005726
    Abstract: An ion detector includes: a first electron multiplier for detecting first ions having a first polarity; a second electron multiplier for detecting second ions having a second polarity different from the first polarity; a first anode for capturing electrons emitted from the first electron multiplier; a second anode for capturing electrons emitted from the second electron multiplier; and a switching circuit including a first input terminal electrically connected to the first anode, a second input terminal electrically connected to the second anode, and an output terminal, the switching circuit selectively connecting one of the first input terminal and the second input terminal to the output terminal.
    Type: Application
    Filed: May 13, 2022
    Publication date: January 5, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi ENDO, Hiroshi KOBAYASHI
  • Patent number: 11532534
    Abstract: A semiconductor module includes a power element, a signal wiring, and a heat sink. The signal wiring is connected to a signal pad of the power element. The heat sink cools the power element. The power element has an active area provided by a portion where the signal pad is formed. The signal pad is thermally connected to the heat sink via the signal wiring.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: December 20, 2022
    Assignee: DENSO CORPORATION
    Inventors: Yoshitaka Kato, Takeshi Endo
  • Publication number: 20220392828
    Abstract: A semiconductor device includes a power module, a circuit package, and a joint portion joining the power module and the circuit package. The circuit package includes a semiconductor element, a wiring layer electrically connected with the semiconductor element, a heat conductive member, and a second mold resin portion sealing the semiconductor element and the heat conductive member. The wiring layer includes a connecting portion connected with the heat conductive member. One of the connecting portion or the heat conductive member is joined with a signal wire in the power module via the joint portion. The heat conductive member penetrates the second mold resin portion in a thickness direction of the semiconductor element. The heat conductive member and the connecting portion are arranged in a straight line in the thickness direction of the semiconductor element.
    Type: Application
    Filed: May 25, 2022
    Publication date: December 8, 2022
    Inventors: YOSHITAKA KATO, TAKESHI ENDO, KAZUHIRO TSURUTA
  • Publication number: 20220366700
    Abstract: Provided is an object recognition device capable of accurately estimating a distance from an own vehicle to an object such as a pedestrian.
    Type: Application
    Filed: September 8, 2020
    Publication date: November 17, 2022
    Applicant: HITACHI ASTEMO, LTD.
    Inventors: Takeshi ENDO, Haruki MATONO, Takeshi NAGASAKI
  • Publication number: 20220359229
    Abstract: Joining a second supporting member to one surface of a semiconductor chip through an upper layer joining portion includes: forming, on the one surface, a pre-joining layer by pressure-sintering a first constituent member containing a sintering material on the one surface such that spaces between the plurality of protrusions are filled with the pre-joining layer and the pre-joining layer has a flat surface on a side of the pre-joining layer away from the semiconductor chip; arranging, on the flat surface, the second supporting member through a second constituent member containing a sintering material; and heating and pressurizing the second constituent member. Thereby, an upper layer joining portion is formed by the second constituent member and the pre-joining layer.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Inventors: Tomohito IWASHIGE, Takeshi ENDO
  • Patent number: 11417505
    Abstract: A CEM and an ion detector of one embodiment have a structure for enabling ion detection with higher sensitivity than the prior art. A channel electron multiplier includes a channel body, an input-side conductive layer, an output-side conductive layer, and an electrode. The channel body includes a channel, and a resistance layer and an electron emission layer formed on the channel's inner wall surface. The input-side conductive layer is provided on the channel body, and a part thereof extends into the tapered opening. The output-side conductive layer is provided on the tapered opening. The electrode has openings through which charged particles pass, and is disposed on an opposite side of the output end face to the input end face. The electrode and the input-side conductive layer are set to the same potential to eliminate the influence of an external electric field in the tapered opening.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: August 16, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi Endo, Hiroshi Kobayashi
  • Publication number: 20220246417
    Abstract: The present embodiment relates to an ion detector and the like that can reduce a dark current serving as a noise component. An ion detector having an electron multiplier includes a shield structure confining a potential gradient spreading in all directions starting from an input electrode into a limited space including the input electrode, and an input cable having one end electrically connected to the input electrode. The shield structure has a structure surrounding at least the input electrode, and includes one or more members. Each of the members is comprised of a metal material or an insulating material. Further, a part of the shield structure is constituted by a metal mesh window. An outer peripheral surface of the input cable is covered with an insulating coating in order to block the arrival of unnecessary ions and electrons generated inside and outside the shield structure.
    Type: Application
    Filed: December 6, 2019
    Publication date: August 4, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi ENDO, Hiroshi KOBAYASHI
  • Publication number: 20220212173
    Abstract: Provided are an exhaust gas purifying catalyst structure that inhibits foil elongation and improves structural durability and a production method therefor. The exhaust gas purifying catalyst structure has a metal support configured by using an mantle and a metal foil provided in the mantle and forming an exhaust gas flow path, and a catalyst layer provided on a surface forming the flow path of the metal foil, wherein the catalyst layer contains a noble metal, an OSC material containing cerium and a rare earth element other than cerium (non-Ce rare earth element), and alumina, and a content of the non-Ce rare earth element with respect to 100% by mass of the catalyst layer is 2.52% by mass or more and 4.62% by mass or less in terms of an oxide.
    Type: Application
    Filed: May 13, 2020
    Publication date: July 7, 2022
    Inventors: Toshiaki KIMURA, Koji UENO, Takeshi ENDO, Akiko IWASA, Shumpei SUZUKI, Toshiharu MORIYA, Ohki HOUSHITO, Yunosuke NAKAHARA
  • Publication number: 20220056004
    Abstract: Provided is a method for producing an organic compound, the method making it possible to ensure an adequate reaction time and obtain a targeted substance at a high yield even in an organic reaction that requires a relatively long time to complete the reaction.
    Type: Application
    Filed: December 26, 2019
    Publication date: February 24, 2022
    Applicant: M. Technique Co., Ltd.
    Inventors: Masakazu ENOMURA, Takeshi ENDO, Kazutaka TAKEDA
  • Publication number: 20220020579
    Abstract: A CEM and an ion detector of one embodiment have a structure for enabling ion detection with higher sensitivity than the prior art. A channel electron multiplier includes a channel body, an input-side conductive layer, an output-side conductive layer, and an electrode. The channel body includes a channel, and a resistance layer and an electron emission layer formed on the channel's inner wall surface. The input-side conductive layer is provided on the channel body, and a part thereof extends into the tapered opening. The output-side conductive layer is provided on the tapered opening. The electrode has openings through which charged particles pass, and is disposed on an opposite side of the output end face to the input end face. The electrode and the input-side conductive layer are set to the same potential to eliminate the influence of an external electric field in the tapered opening.
    Type: Application
    Filed: May 27, 2021
    Publication date: January 20, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi ENDO, Hiroshi KOBAYASHI
  • Patent number: 11101246
    Abstract: In a semiconductor device, a first semiconductor chip and a second semiconductor chip are disposed between a first support member and a second support member. A first underlayer bonding material is disposed between the first semiconductor chip and the first support member. A second underlayer bonding material is disposed between the second semiconductor chip and the first support member. A first upper layer bonding material is disposed between the first semiconductor chip and the second support member. A second upper layer bonding material is disposed between the second semiconductor chip and the second support member.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: August 24, 2021
    Assignee: DENSO CORPORATION
    Inventors: Tomohito Iwashige, Takeshi Endo, Kazuhiko Sugiura