Abstract: An airbag apparatus includes: a cover that covers a vent hole which is formed on an airbag bag body from an inner part of the airbag bag body; a fixation part that supports the cover movably; and a strap that is connected to the cover, wherein a width of the strap is smaller than a diameter of the vent hole.

Abstract: A steering device 10 mounted on a vehicle includes: a steering body 12 having left and right sensors 22L and 22R installed in a rim 16 gripped by a driver to detect a driver's condition; and a detection circuit 14 configured to detect a driver's condition on the basis of a detection signal from at least the left and right sensors 22L and 22R, wherein a wire length Ll of a left harness 30L from the detection circuit 14 to the left sensor 22L is substantially equal to a wire length Lr of a right harness 30R from the detection circuit 14 to the right sensor 22R.

Abstract: An airbag apparatus includes: a cover that covers a vent hole which is formed on an airbag bag body from an inner part of the airbag bag body; a fixation part that supports the cover movably; and a strap that is connected to the cover, wherein a width of the strap is smaller than a diameter of the vent hole.

Abstract: A steering device 10 mounted on a vehicle includes: a steering body 12 having left and right sensors 22L and 22R installed in a rim 16 gripped by a driver to detect a driver's condition; and a detection circuit 14 configured to detect a driver's condition on the basis of a detection signal from at least the left and right sensors 22L and 22R, wherein a wire length Ll of a left harness 30L from the detection circuit 14 to the left sensor 22L is substantially equal to a wire length Lr of a right harness 30R from the detection circuit 14 to the right sensor 22R.

Abstract: A motor vehicle armrest includes an armrest body that is disposed on at least one side in a vehicle-width direction of a seat cushion so as to support of an arm of an occupant. The armrest body has an inflation portion that is inflated toward the occupant in the vehicle-width direction so as to support the occupant in the vehicle-width direction.

Abstract: A motor vehicle armrest includes an armrest body that is disposed on at least one side in a vehicle-width direction of a seat cushion so as to support of an arm of an occupant. The armrest body has an inflation portion that is inflated toward the occupant in the vehicle-width direction so as to support the occupant in the vehicle-width direction.

Abstract: A method for generating a pattern includes reading out an interconnect layout and a hole layout, the interconnect layout prescribing interconnect patterns, the hole layout prescribing hole patterns configured to connect to the interconnect patterns; extracting one of the hole patterns to be connected within the same interconnect layer level to one of the interconnect patterns in a pattern processing area; extracting a first processing area including the extracted hole pattern; calculating a first pattern density of the interconnect patterns included in the first processing area; and generating first additional patterns in the first processing area based on the first pattern density.

Abstract: An airbag device provided in a side of a vehicle seat, which device comprises a case for accommodating a folded airbag. The case has a lid and a wall. The lid has tear lines formed so as to rupture when the airbag deploys and separate the lid into a plurality of parts. A hinge is formed on a boundary between the lid and the wall.

Abstract: A method for generating a pattern includes reading out an interconnect layout and a hole layout, the interconnect layout prescribing interconnect patterns, the hole layout prescribing hole patterns configured to connect to the interconnect patterns; extracting one of the hole patterns to be connected within the same interconnect layer level to one of the interconnect patterns in a pattern processing area; extracting a first processing area including the extracted hole pattern; calculating a first pattern density of the interconnect patterns included in the first processing area; and generating first additional patterns in the first processing area based on the first pattern density.

Abstract: A method for generating a pattern includes reading out an interconnect layout and a hole layout, the interconnect layout prescribing interconnect patterns, the hole layout prescribing hole patterns configured to connect to the interconnect patterns; extracting one of the hole patterns to be connected within the same interconnect layer level to one of the interconnect patterns in a pattern processing area; extracting a first processing area including the extracted hole pattern; calculating a first pattern density of the interconnect patterns included in the first processing area; and generating first additional patterns in the first processing area based on the first pattern density.

Abstract: A rotatably supporting device for correcting balance of a rotating body includes a journal supporting part having a mandrel that rotatably supports the rotating body in a floating state about a vertical axis, a thrust supporting part that is provided at a lower end portion of the mandrel and supports a bottom part of the rotating body in the floating state, a first fluid supply passage that supplies a fluid for floating between the mandrel and a rotation support hole of the rotating body, an annular groove provided in the thrust supporting part so as to face the bottom part of the rotating body, and a second fluid supply passage that communicates with the annular groove to supply a fluid thereto for floating the rotating body.

Abstract: An airbag device provided in a side of a vehicle seat, which device comprises a case for accommodating a folded airbag. The case has a lid and a wall. The lid has tear lines formed so as to rupture when the airbag deploys and separate the lid into a plurality of parts. A hinge is formed on a boundary between the lid and the wall.

Abstract: Semiconductor elements composing a semiconductor device are formed on a semiconductor substrate. Wirings composed of copper or an alloy mainly composed of copper are formed in wiring layers through interlayer insulation films to connect the semiconductor elements to each other. When the wirings are formed, a temperature of the wirings is held in a first temperature zone covering ±40° C. of a temperature at which a stress migration is most accelerated.

Abstract: A rotatably supporting device for correcting balance of a rotating body includes a journal supporting part having a mandrel that rotatably supports the rotating body in a floating state about a vertical axis, a thrust supporting part that is provided at a lower end portion of the mandrel and supports a bottom part of the rotating body in the floating state, a first fluid supply passage that supplies a fluid for floating between the mandrel and a rotation support hole of the rotating body, an annular groove provided in the thrust supporting part so as to face the bottom part of the rotating body, and a second fluid supply passage that communicates with the annular groove to supply a fluid thereto for floating the rotating body.

Abstract: Semiconductor elements composing a semiconductor device are formed on a semiconductor substrate. Wirings composed of copper or an alloy mainly composed of copper are formed in wiring layers through interlayer insulation films to connect the semiconductor elements to each other. When the wirings are formed, a temperature of the wirings is held in a first temperature zone covering ±40° C. of a temperature at which a stress migration is most accelerated.

Abstract: Semiconductor elements composing a semiconductor device are formed on a semiconductor substrate. Wirings composed of copper or an alloy mainly composed of copper are formed in wiring layers through interlayer insulation films to connect the semiconductor elements to each other. When the wirings are formed, a temperature of the wirings is held in a first temperature zone covering ±40° C. of a temperature at which a stress migration is most accelerated.

Abstract: A semiconductor device having a multilevel interconnection encompasses (a) a subject level interconnect, (b) a subject interlevel insulator disposed on the subject level interconnect, (c) a connecting via-plug buried in the subject interlevel insulator, the bottom surface of the connecting via-plug is in contact with the subject level interconnect, (d) a dummy via-plug buried in the subject interlevel insulator, the top surface of the dummy via-plug is electrically open, and (e) an upper level interconnect of the subject level interconnect, disposed at the top surface of the subject interlevel insulator, being contact with the top surface of the connecting via-plug.

Abstract: A method for generating a pattern includes reading out an interconnect layout and a hole layout, the interconnect layout prescribing interconnect patterns, the hole layout prescribing hole patterns configured to connect to the interconnect patterns; extracting one of the hole patterns to be connected within the same interconnect layer level to one of the interconnect patterns in a pattern processing area; extracting a first processing area including the extracted hole pattern; calculating a first pattern density of the interconnect patterns included in the first processing area; and generating first additional patterns in the first processing area based on the first pattern density.

Abstract: A semiconductor device having a multilevel interconnection encompasses (a) a subject level interconnect, (b) a subject interlevel insulator disposed on the subject level interconnect, (c) a connecting via-plug buried in the subject interlevel insulator, the bottom surface of the connecting via-plug is in contact with the subject level interconnect, (d) a dummy via-plug buried in the subject interlevel insulator, the top surface of the dummy via-plug is electrically open, and (e) an upper level interconnect of the subject level interconnect, disposed at the top surface of the subject interlevel insulator, being contact with the top surface of the connecting via-plug.

Abstract: Semiconductor elements composing a semiconductor device are formed on a semiconductor substrate. Wirings composed of copper or an alloy mainly composed of copper are formed in wiring layers through interlayer insulation films to connect the semiconductor elements to each other. When the wirings are formed, a temperature of the wirings is held in a first temperature zone covering 40° C. of a temperature at which a stress migration is most accelerated.