Patents by Inventor Takeshi Fukui

Takeshi Fukui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100296967
    Abstract: To provide a sterilization method of container-packaged food which has a high effect on mixture food of solid food/soup and a filling system where all processes and devices can be simplified, a pre-seal lid material (PS), that has been cut to a dimension covering the opening of a cup filled with solid food, e.g. a dimension corresponding to the outer circumference of the flange of the cup, is fixed to a cup holder (CH) at a position for covering the cup opening by means of a holding bolt (31a) without being fusion bonded to the cup flange portion (CF), while a ventilation state between the head space of the cup and the air in a sterilization chamber is maintained. Thereafter, steam sterilization to the cup is performed in the sterilization chamber and the cup is transported to a clean box, filled with sterilized soup.
    Type: Application
    Filed: December 3, 2008
    Publication date: November 25, 2010
    Inventors: Shinji Yamamoto, Takeshi Fukui, Makoto Sawada, Mitsuo Tanioka
  • Patent number: 7343166
    Abstract: A terminal unit is attached to a monitoring object. The terminal unit locates its position via a position-related signal from a satellite positioning system. The terminal unit acquires first-located position information first, and then second-located position information upon a lapse of a predetermined positioning interval after the first-located position information is acquired. When the first-located position is within a permissible moving zone and the second-located position is outside the permissible moving zone, the terminal unit acquires third-located position information before the predetermine positioning interval lapses. If the third-located position is still outside the permissible moving zone, then the terminal unit sends a reporting signal to a monitor apparatus. The monitor system reduces occurrences of inaccurate reporting signals.
    Type: Grant
    Filed: April 13, 2005
    Date of Patent: March 11, 2008
    Assignee: Seiko Epson Corporation
    Inventors: Takeshi Fukui, Tomoyuki Kurata
  • Publication number: 20050250517
    Abstract: A terminal unit is attached to a monitoring object. The terminal unit locates its position via a position-related signal from a satellite positioning system. The terminal unit acquires first-located position information first, and then second-located position information upon a lapse of a predetermined positioning interval after the first-located position information is acquired. When the first-located position is within a permissible moving zone and the second-located position is outside the permissible moving zone, the terminal unit acquires third-located position information before the predetermine positioning interval lapses. If the third-located position is still outside the permissible moving zone, then the terminal unit sends a reporting signal to a monitor apparatus. The monitor system reduces occurrences of inaccurate reporting signals.
    Type: Application
    Filed: April 13, 2005
    Publication date: November 10, 2005
    Applicant: Seiko Epson Corporation
    Inventors: Takeshi Fukui, Tomoyuki Kurata
  • Patent number: 6677625
    Abstract: The invention provides a bipolar transistor attaining large MSG and a method of fabricating the same. The bipolar transistor of this invention includes a collector layer; abase layer deposited on the collector layer; and a semiconductor layer deposited on the base layer in the shape of a ring along the outer circumference of the base layer, the semiconductor layer includes a ring-shaped emitter region functioning as an emitter, and the outer edge of the emitter region and the outer edge of the base layer are disposed in substantially the same plane position.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: January 13, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Manabu Yanagihara, Keiichi Murayama, Takeshi Fukui, Tsuyoshi Tanaka
  • Patent number: 6329262
    Abstract: A semiconductor integrated circuit includes a thermal resistor which is made of a tungsten silicon nitride containing at least about 5% by weight of silicon and formed on a semiconductor substrate directly or via an insulating film. The semiconductor integrated circuit is produced by a method including the steps of: forming a tungsten silicide nitride film on a semiconductor substrate; patterning the tungsten silicide nitride film in a predetermined pattern to form a thermal resistor; and forming a pair of electrodes to be connected to the thermal resistor.
    Type: Grant
    Filed: February 24, 1999
    Date of Patent: December 11, 2001
    Inventors: Takeshi Fukuda, Hiroshi Takenaka, Hidetoshi Furukawa, Takeshi Fukui, Daisuke Ueda
  • Publication number: 20010010388
    Abstract: The invention provides a bipolar transistor attaining large MSG and a method of fabricating the same. The bipolar transistor of this invention includes a collector layer; abase layer deposited on the collector layer; and a semiconductor layer deposited on the base layer in the shape of a ring along the outer circumference of the base layer, the semiconductor layer includes a ring-shaped emitter region functioning as an emitter, and the outer edge of the emitter region and the outer edge of the base layer are disposed in substantially the same plane position.
    Type: Application
    Filed: December 21, 2000
    Publication date: August 2, 2001
    Inventors: Manabu Yanagihara, Keiichi Murayama, Takeshi Fukui, Tsuyoshi Tanaka
  • Patent number: 6245628
    Abstract: A resistive area 7 is formed selectively on a semi-insulating substrate 1, and ohmic electrodes 10 are formed on both ends of the resistive area. Then a photo resist 14 having an opening 13 between the electrodes 10 is so formed as not completely across the resistive area 7. A desirable resistance value is thus obtained by removing the resistance area 7 by etching through the opening 13 gradually.
    Type: Grant
    Filed: February 26, 1998
    Date of Patent: June 12, 2001
    Assignee: Matsushita Electronics Corporation
    Inventors: Takeshi Fukui, Hidetoshi Furukawa, Daisuke Ueda
  • Patent number: 6230973
    Abstract: A method of inputting print-destined data in rewritable card read/write apparatuses of a card utilization system very conveniently. A message edited by a computer (20) for rewritable card users is stored in a memory (23) provided in association with a magnetic head energizing means (21; 5) of a rewritable card read/write apparatus by way of an external-input interface (6). A magnetic card having at least one magnetic track for storing the message is inserted in the above-mentioned rewritable card read/write apparatus to thereby create a message card carrying the message from the magnetic card.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: May 15, 2001
    Assignee: Tokyo Magnetic Printing Co., Ltd.
    Inventors: Takeshi Fukui, Hideaki Arakida, Yoshihiro Nabeshima
  • Patent number: 6064413
    Abstract: In a rewritable card read/write apparatus including a printing thermal head (11) for printing data thermally and a transporting mechanism for feeding a rewritable card (19) forwardly and backwardly so that the rewritable card (19) can pass by the thermal head (11), a method which allows the printed data to be erased within a short time with the thermal head (11) itself. A columnwise printed data erasing range (18) of a printed data area is designated for the card (19) inserted into the apparatus. The thermal head (11) is electrically energized successively at least in two serial cycles by changing over electric energy level at least from a first electric energy level in a first cycle to a second electric energy level in a second cycle.
    Type: Grant
    Filed: May 21, 1999
    Date of Patent: May 16, 2000
    Assignees: F Engineering Co., Ltd., Tokyo Magnetic Printing Co. Ltd.
    Inventors: Takeshi Fukui, Hideaki Arakida, Yoshihiro Nabeshima
  • Patent number: 6025632
    Abstract: A semiconductor integrated circuit includes a thermal resistor which is made of a tungsten silicon nitride containing at least about 5% by weight of silicon and formed on a semiconductor substrate directly or via an insulating film. The semiconductor integrated circuit is produced by a method including the steps of: forming a tungsten silicide nitride film on a semiconductor substrate; patterning the tungsten silicide nitride film in a predetermined pattern to form a thermal resistor; and forming a pair of electrodes to be connected to the thermal resistor.
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: February 15, 2000
    Assignee: Matsushita Electronics Corp.
    Inventors: Takeshi Fukuda, Hiroshi Takenaka, Hidetoshi Furukawa, Takeshi Fukui, Daisuke Ueda
  • Patent number: 5773145
    Abstract: A power cable is disclosed, which comprises a conductor having thereon an insulating layer which comprises a composition comprising from 25 to 35% by weight based on the total amount of the composition of an ethylene-vinyl acetate copolymer resin having a vinyl acetate content of from 25 to 33% by weight, and from 65 to 75% by weight based on the total amount of the composition of polyethylene, the polyethylene containing in the molecule thereof vinyltrimethoxysilane by copolymerization or graft polymerization, the composition containing an organo heavy metal compound as a cross-linking catalyst, the insulating layer is cross-linked by the cross-linking reaction of trimethoxysilane groups in the polyethylene in the presence of water.
    Type: Grant
    Filed: September 22, 1997
    Date of Patent: June 30, 1998
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yoshiyuki Inoue, Mineya Kuno, Takeshi Fukui, Shigeki Ohsawa
  • Patent number: 5258459
    Abstract: Disclosed are a resin composition (D) for coating obtained by reacting (A) an epoxy resin, (B) a butadiene-acrylonitrile copolymer having carboxyl groups or amino groups at both terminals of the molecule and (C) a bifunctional mononuclear phenolic compound, and an electrodeposition coating composition comprising the resin composition (D). The coating compositions have high adhesiveness to metal substrates and may form a high corrosion-resistance coat film having good flexibility, chipping-resistance and low temperature properties. The coating compositions are favorably used in car industrial field.
    Type: Grant
    Filed: August 30, 1991
    Date of Patent: November 2, 1993
    Assignee: Shinto Paint Co., Ltd.
    Inventors: Norihide Fujimoto, Shigeki Tanaka, Takeshi Fukui, Yuji Numashima
  • Patent number: 5192016
    Abstract: A method of manufacturing tubes filled with powdery and/or granular substances, such as flux-cored welding wires. A tube filled with a powdery and/or granular substance is continuously manufactured by forming a metal strip being fed in its longitudinal direction into an unwelded tube (1a) using forming rolls (2), feeding a powdery and/or granular substance (F) into the unwelded tube (1a) being formed through its opening, butt-welding together fringing edges of the opening, and reducing the diameter of the welded tube (1b). An allowable minimum heat input below which cold cracking occurs and a maximum allowable heat input above which spatters whose diameter is not smaller than 0.83 times the inside diameter of the finished tube are generated are determined in advance, and the butt welding is performed with a heat input larger than the allowable minimum heat input and smaller than the allowable maximum heat input.
    Type: Grant
    Filed: February 21, 1992
    Date of Patent: March 9, 1993
    Assignees: Nippon Steel Corporation, Nippon Steel Welding Products & Engineering Co., Ltd.
    Inventors: Nobuo Araki, Takeji Kagami, Yoji Chatani, Shunichi Kikuta, Iwao Yamada, Masao Kamada, Seiji Hashimoto, Shuichi Ueno, Takeshi Fukui, Takumi Nakamura, Nobuo Mizuhashi, Yasushi Ishikawa
  • Patent number: 5087114
    Abstract: An improved liquid crystal device is described. The distance between a pair of substrates is kept constant by means of spacers interposed therebetween. The material, the size and the distribution density of the spacers are chosen in order that the distance between the mated substrates just before the liquid crystal is disposed in the formation of the liquid crystal device is 0.77-0.87 of that after the disposing.
    Type: Grant
    Filed: December 11, 1989
    Date of Patent: February 11, 1992
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Takeshi Fukui, Toshio Watanabe
  • Patent number: 4625858
    Abstract: Two embodiments for a harness assembling apparatus having a conveyor system including a forward conveyor line and a backward conveyor line, and a plurality of pallets each having a deck carrying a plurality of jigs for laying the harness thereon. The pallets are adapted to run successively along the forward conveyor line and then along the backward conveyor line. The apparatus has a turning and shifting device. Each shifting device is adapted to shift successive pallets from one conveyor line to the other conveyor line one by one. The turning device turns the edge of the deck located at the lower side on the one conveyor line to the upper side when located on the other conveyor line. In one embodiment, the turning and shifting devices are combined into a single unit, while in the other embodiment, the turning device is a separate unit from the shifting device.
    Type: Grant
    Filed: February 22, 1985
    Date of Patent: December 2, 1986
    Assignee: Tokai Electric Wire Company Limited
    Inventor: Takeshi Fukui