Abstract: There is provided a plasma vessel in which a process gas is plasma-excited; a substrate process chamber which is in communication with the plasma vessel; a gas supply system supplying the process gas; and a coil installed to wind around an outer periphery of the plasma vessel and supplied with high-frequency power, wherein the coil is installed such that: a distance from an inner periphery of the coil to an inner periphery of the plasma vessel at a predetermined position on the coil is different from a distance from the inner periphery of the coil to the inner periphery of the plasma vessel at another position on the coil; and a distance from the inner periphery of the coil to the inner periphery of the plasma vessel at a position at which an amplitude of a standing wave of a voltage applied to the coil is maximized is maximized.

Abstract: Described herein is a technique capable of suppressing sputtering on an inner peripheral surface of a process vessel when a process gas is plasma-excited in the process vessel. According to one aspect thereof, a substrate processing apparatus includes: a process vessel accommodating a process chamber where a process gas is excited into plasma; a gas supplier supplying the process gas into the process chamber; a coil wound around an outer peripheral surface of the process vessel and spaced apart therefrom, wherein a high frequency power is supplied to the coil; and an electrostatic shield disposed between the outer peripheral surface and the coil, wherein the electrostatic shield includes: a partition extending in a circumferential direction to partition between a part of the coil and the outer peripheral surface; and an opening extending in the circumferential direction and opened between another part of the coil and the outer peripheral surface.

Abstract: The present invention provides a particle comprising pirfenidone and a lipid, particularly magnesium stearate, and having a mean particle diameter of 5 ?m or less, and a powder formulation comprising the particle and a carrier.

Abstract: The present invention provides a particle comprising pirfenidone and a lipid, particularly magnesium stearate, and having a mean particle diameter of 5 ?m or less, and a powder formulation comprising the particle and a carrier.

Abstract: A nitride semiconductor structure in which a first nitride semiconductor underlying layer is provided on a substrate having a recess portion and a projection portion provided between the recess portions at a surface thereof, the first nitride semiconductor underlying layer has at least 6 first oblique facet planes surrounding the projection portion on an outer side of the projection portion, and a second nitride semiconductor underlying layer buries the first oblique facet planes, a nitride semiconductor light emitting element, a nitride semiconductor transistor element, a method of manufacturing a nitride semiconductor structure, and a method of manufacturing a nitride semiconductor element are provided.

Abstract: A nitride semiconductor structure in which a first nitride semiconductor underlying layer is provided on a substrate having a recess portion and a projection portion provided between the recess portions at a surface thereof, the first nitride semiconductor underlying layer has at least 6 first oblique facet planes surrounding the projection portion on an outer side of the projection portion, and a second nitride semiconductor underlying layer buries the first oblique facet planes, a nitride semiconductor light emitting element, a nitride semiconductor transistor element, a method of manufacturing a nitride semiconductor structure, and a method of manufacturing a nitride semiconductor element are provided.

Abstract: The present invention relates to a method for production of a coated preparation, characterized by coating a core material with a coating solution, the core material comprising an active ingredient, the coating solution comprising a) a resin composition obtained by copolymerization of polyvinyl alcohol having an average polymerization degree of 1300 or less, and at least one polymerizable vinyl monomer in a weight ratio of 6:4 to 9:1, b) water, and c) an organic solvent. The method for production make it feasible to efficiently coat a preparation such as a tablet, a granule, and a fine granule, etc. (a pharmaceutical drug, an animal drug, an agricultural chemicals, a fertilizer, or a food product) with the coating solution comprising a) the composition comprising the polyvinyl alcohol copolymer as the main component, b) water, and c) the organic solvent.

Abstract: A film composition comprising (i) a resin obtained by copolymerizing polyvinyl alcohol and at least one or more polymerizable vinyl monomers; and (ii) a drug or a food component.

Abstract: A preparation which can improve solubility of a NPYY5 receptor antagonist in water, even when the NPYY5 receptor antagonist is contained in the preparation at a high content is provided. A solid preparation containing a NPYY5 receptor antagonist, an amorphous stabilizer, and optionally an amorphousization inducing agent. Particularly, when the amorphous stabilizer is hydroxypropylmethylcellulose phthalate and/or hydroxypropylmethylcellulose acetate succinate, and the amorphousization inducing agent is urea and/or saccharine sodium at an addition amount of less than 8% by weight, dissolution out property of a water-hardly soluble NPYY5 receptor antagonist could be improved.

Abstract: The present invention relates to a method for production of a coated preparation, characterized by coating a core material with a coating solution, the core material comprising an active ingredient, the coating solution comprising a) a resin composition obtained by copolymerization of polyvinyl alcohol having an average polymerization degree of 1300 or less, and at least one polymerizable vinyl monomer in a weight ratio of 6:4 to 9:1, b) water, and c) an organic solvent. The method for production make it feasible to efficiently coat a preparation such as a tablet, a granule, and a fine granule, etc. (a pharmaceutical drug, an animal drug, an agricultural chemicals, a fertilizer, or a food product) with the coating solution comprising a) the composition comprising the polyvinyl alcohol copolymer as the main component, b) water, and c) the organic solvent.

Abstract: The present invention provides a rubber product with a fiber reinforcing layer, which is enabled to bond a rubber layer and a fiber reinforcing layer by a formalin-free adhesive with an adhesive strength equal to or more than that of a formalin-containing RFL. The rubber product with the fiber reinforcing layer includes a rubber layer containing a nonpolar rubber or a diene-based rubber, and a fiber reinforcing layer containing a woven fiber cord having a polarity. The rubber layer and the fiber reinforcing layer are stacked and bonded with an adhesive containing a triazine thiol and a diene-based rubber.

Abstract: A substrate for use in a semiconductor package is fabricated by preparing a composite metal laminate consisting of a first metal layer, a second metal layer, and a carrier layer positioned in this order. The first metal layer has etching characteristics different to those of the second metal layer with respect to the same etchant. The first metal layer is selectively etched until the second metal layer is exposed, thereby forming pillar-like interconnections. The gap between the interconnections is then filled with a resin so as to form a resin base with interconnections. The carrier layer is removed from the second metal layer, and the second metal layer is selectively etched until the first metal layer or the resin base is exposed, thereby forming a conductive pattern on the resin base.

Abstract: A substrate for use in a semiconductor package is fabricated by preparing a composite metal laminate consisting of a first metal layer, a second metal layer, and a carrier layer positioned in this order. The first metal layer has etching characteristics different to those of the second metal layer with respect to the same etchant. The first metal layer is selectively etched until the second metal layer is exposed, thereby forming pillar-like interconnections. The gap between the interconnections is then filled with a resin so as to form a resin base with interconnections. The carrier layer is removed from the second metal layer, and the second metal layer is selectively etched until the first metal layer or the resin base is exposed, thereby forming a conductive pattern on the resin base.