Patents by Inventor Takeshi HIKIMA

Takeshi HIKIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dispersion liquid used for forming porous film, porous film, power storage element, and method for producing porous film
    Patent number: 10301438
    Abstract: A dispersion liquid including a fiber material which is capable of forming a porous film having high porosity; a porous film formed using the dispersion liquid; a power storage element including the porous film; and a method for producing a porous film using the dispersion liquid. In the dispersion liquid including the fiber material and an organic solvent, which is used for forming a porous film by applying and drying, the fiber material contains a predetermined amount of a modified cellulose fiber including a carboxy group or a metal salt thereof, and the amount of water in the dispersion liquid is 5% by mass or less.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: May 28, 2019
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Teruhiro Uematsu, Takeshi Hikima
  • DISPERSION LIQUID USED FOR FORMING POROUS FILM, POROUS FILM, POWER STORAGE ELEMENT, AND METHOD FOR PRODUCING POROUS FILM
    Publication number: 20180298152
    Abstract: A dispersion liquid including a fiber material which is capable of forming a porous film having high porosity; a porous film formed using the dispersion liquid; a power storage element including the porous film; and a method for producing a porous film using the dispersion liquid. In the dispersion liquid including the fiber material and an organic solvent, which is used for forming a porous film by applying and drying, the fiber material contains a predetermined amount of a modified cellulose fiber including a carboxy group or a metal salt thereof, and the amount of water in the dispersion liquid is 5% by mass or less.
    Type: Application
    Filed: April 13, 2018
    Publication date: October 18, 2018
    Inventors: Teruhiro UEMATSU, Takeshi HIKIMA