Patents by Inventor Takeshi Hizono

Takeshi Hizono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170338448
    Abstract: A prismatic secondary battery includes a battery case in a prismatic shape and a battery cover which seals up an opening part of the battery case. The battery cover has a convex part which projects toward the inside of the battery case, faces an inner surface of a side wall part of the battery case, and extends continuously along the entire periphery of the side wall part. Cover thickness of a contact part of the battery cover which is in contact with the upper end of the side wall part of the battery case at a position outside the convex part is greater than ½ of cover thickness of a blockage part blocking up an opening part at a position inside the convex part and is less than the cover thickness of the blockage part.
    Type: Application
    Filed: August 8, 2017
    Publication date: November 23, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Kouichi KAJIWARA, Hayato KOGUCHI, Takeshi HIZONO, Hiroaki EGAWA
  • Patent number: 9812676
    Abstract: A prismatic secondary battery includes a battery case in a prismatic shape and a battery cover which seals up an opening part of the battery case. The battery cover has a convex part which projects toward the inside of the battery case, faces an inner surface of a side wall part of the battery case, and extends continuously along the entire periphery of the side wall part. Cover thickness of a contact part of the battery cover which is in contact with the upper end of the side wall part of the battery case at a position outside the convex part is greater than ½ of cover thickness of a blockage part blocking up an opening part at a position inside the convex part and is less than the cover thickness of the blockage part.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: November 7, 2017
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Kouichi Kajiwara, Hayato Koguchi, Takeshi Hizono, Hiroaki Egawa
  • Publication number: 20150228936
    Abstract: A prismatic secondary battery includes a battery case in a prismatic shape and a battery cover which seals up an opening part of the battery case. The battery cover has a convex part which projects toward the inside of the battery case, faces an inner surface of a side wall part of the battery case, and extends continuously along the entire periphery of the side wall part. Cover thickness of a contact part of the battery cover which is in contact with the upper end of the side wall part of the battery case at a position outside the convex part is greater than ½ of cover thickness of a blockage part blocking up an opening part at a position inside the convex part and is less than the cover thickness of the blockage part.
    Type: Application
    Filed: August 31, 2012
    Publication date: August 13, 2015
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Kouichi Kajiwara, Hayato Koguchi, Takeshi Hizono, Hiroaki Egawa
  • Patent number: 8223454
    Abstract: An electronic apparatus 1 in which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold frame 9 for holding the electronic unit, a first heat-conducting member 11 for transmitting heat generated by the first heat-generating section, a second heat-conducting member 11 for transmitting heat generated by the second heat-generating section, and a cooling unit 8 for releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting member 11 is heat-connected to the cooling unit 8, and the second heat-conducting member 11 is heat-connected to the cooling unit 8 via the hold frame 9.
    Type: Grant
    Filed: June 11, 2008
    Date of Patent: July 17, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Kazuaki Tanaka, Takeshi Hizono, Hironori Oikawa
  • Publication number: 20090133852
    Abstract: A cooling apparatus for use in electronic equipment, being small in sizes and simple in the structures thereof, for achieving an increasing cooling capacity, comprises: a heat receiving member, which is thermally connected with a heat generating body, and which is configured to receive heat by means of a coolant flowing within an inside thereof; and a heat radiating member, which is configured to radiate the heat received within the heat receiving member, wherein the heat receiving member has a plate-like heat receiving base body, which is thermally connected with the heat generating body, and a heat receiving case body, which covers over the heat receiving base body, wherein the body members are joined with, so as to define a sealed space for running the coolant therein.
    Type: Application
    Filed: October 29, 2008
    Publication date: May 28, 2009
    Inventors: Kenji Ogiro, Nobuo Masuoka, Takeshi Hizono, Kenichi Shiode
  • Publication number: 20090040654
    Abstract: An electronic apparatus 1 in which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold frame 9 for holding the electronic unit, a first heat-conducting member 11 for transmitting heat generated by the first heat-generating section, a second heat-conducting member 11 for transmitting heat generated by the second heat-generating section, and a cooling unit 8 for releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting member 11 is heat-connected to the cooling unit 8, and the second heat-conducting member 11 is heat-connected to the cooling unit 8 via the hold frame 9.
    Type: Application
    Filed: June 11, 2008
    Publication date: February 12, 2009
    Inventors: Kazuaki Tanaka, Takeshi Hizono, Hironori Oikawa
  • Publication number: 20070012423
    Abstract: A heat receiving jacket in a liquid cooling device for electronic equipment, for transferring a heat from a heating portion in the electronic equipment to liquid refrigerant, is composed of a fin piece having a base portion formed thereon with thin fins which rise up from one surface of the base portion, being curved, and a casing accommodating therein the fin piece in its center part so as to cause the liquid refrigerant to flow between the thin fins. Further, the cooling device includes a plurality of heat receiving jackets and a plurality of heat radiating portions which are alternately connected so as to constitute a passage for the liquid refrigerant, a part of the passage being connected with a circulation pump so as to constitute a closed circulation passage for the liquid refrigerant. With this configuration, it is possible to provide a liquid cooling device capable of decreasing the temperature rise of a heating element such as a CPU, having a high performance and being excellent in costs.
    Type: Application
    Filed: April 28, 2006
    Publication date: January 18, 2007
    Inventors: Koichiro Kinoshita, Hironori Oikawa, Shigeo Ohashi, Koichi Takahashi, Takeshi Hizono, Masato Nakanishi
  • Patent number: 6778394
    Abstract: In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving member is attached to a heat generating component installed in a housing, a fan for discharging air within the housing out of the housing is attached on a part of a wall of the housing, a heat sink having a base and fins arranged on the base is attached opposite the fan on an outer face of the wall of the housing or protruding out of the wall with the fins facing the housing, and the heat sink and the heat receiving member are connected by heat transport means.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: August 17, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Hironori Oikawa, Takeshi Hizono, Katsuya Sato
  • Publication number: 20040070949
    Abstract: In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving member is attached to a heat generating component installed in a housing, a fan for discharging air within the housing out of the housing is attached on a part of a wall of the housing, a heat sink having a base and fins arranged on the base is attached opposite the fan on an outer face of the wall of the housing or protruding out of the wall with the fins facing the housing, and the heat sink and the heat receiving member are connected by heat transport means.
    Type: Application
    Filed: April 16, 2003
    Publication date: April 15, 2004
    Inventors: Hironori Oikawa, Takeshi Hizono, Katsuya Sato
  • Patent number: 6639797
    Abstract: In an information processing apparatus with a cooling structure using a heat transport measure such as a heat pipe and a liquid-cooling system, a heat radiation unit has reduced thickness and noise and an improved efficiency. Heat generated by a CPU is transmitted through a heat receiving header and a flexible tube to the heat radiation unit by liquid coolant transported by a pump. The heat radiation unit comprises a propeller, a wall surface in contact with the propeller, and a cooling pipe spirally wound around a propeller shaft in a plane perpendicular to the propeller shaft. Hot coolant is circulated so as to enter the central portion of the cooling pipe and to be discharged from the outer peripheral portion of the pipe. The cooling air from the propeller is made to flow from the central portion of the cooling pipe toward its peripheral portion. The cooling pipe is thermally connected to the wall surface so that the wall surface works as a heat spreader.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: October 28, 2003
    Assignee: Hitachi Ltd.
    Inventors: Masayuki Saeki, Hironori Oikawa, Takeshi Hizono
  • Publication number: 20030184972
    Abstract: In an information processing apparatus with a cooling structure using a heat transport measure such as a heat pipe and a liquid-cooling system, a heat radiation unit has reduced thickness and noise and an improved efficiency. Heat generated by a CPU is transmitted through a heat receiving header and a flexible tube to the heat radiation unit by liquid coolant transported by a pump. The heat radiation unit comprises a propeller, a wall surface in contact with the propeller, and a cooling pipe spirally wound around a propeller shaft in a plane perpendicular to the propeller shaft. Hot coolant is circulated so as to enter the central portion of the cooling pipe and to be discharged from the outer peripheral portion of the pipe. The cooling air from the propeller is made to flow from the central portion of the cooling pipe toward its peripheral portion. The cooling pipe is thermally connected to the wall surface so that the wall surface works as a heat spreader.
    Type: Application
    Filed: July 17, 2002
    Publication date: October 2, 2003
    Inventors: Masayuki Saeki, Hironori Oikawa, Takeshi Hizono