Patents by Inventor Takeshi Hongo
Takeshi Hongo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220377004Abstract: Provided is acquiring communication information via communication or directly from an engineering DB (corresponding to one example “database”) in which the communication information related to communication devices constituting a plant network is defined; storing the acquired communication information; calculating, based on the stored communication information, a total communication amount of each of the communication devices supposed in communication executed in corresponding one of the communication devices; estimating, based on the total communication amount, an actual communication amount of each of the communication devices according to an arbitrary estimation condition specified by a user; determining at least presence/absence of a communication device whose actual communication amount exceeds communication capability of the communication device; and outputting a determined determination result to the user.Type: ApplicationFiled: May 2, 2022Publication date: November 24, 2022Applicant: YOKOGAWA ELECTRIC CORPORATIONInventors: Hiroya Enomoto, Takeshi Hongo, Hiroaki Nakajima
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Patent number: 10678592Abstract: A process control system includes a PC that is to be connected to a redundant network. The PC comprises a virtualization unit, and a real-time communication unit configured to operate as a separate process independent of the virtualization unit.Type: GrantFiled: March 17, 2016Date of Patent: June 9, 2020Assignee: Yokogawa Electric CorporationInventors: Hiroya Enomoto, Toshiyuki Emori, Masanobu Tsuchiya, Takeshi Hongo
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Patent number: 10268484Abstract: A redundant PC system includes a plurality of redundant PCs which is to be connected through a network. Each of the redundant PCs includes hardware on which an interface for connection to the network is mounted and a host OS configured to operate on the hardware. The host OS is provided with a virtualization unit, and a redundant unit and a real-time communication unit, the redundant unit and the real-time communication unit being configured to operate as separate processes independent of the virtualization unit. The redundant unit is configured to perform a control monitoring for making a PC redundant via a universal interface.Type: GrantFiled: March 16, 2016Date of Patent: April 23, 2019Assignee: Yokogawa Electric CorporationInventors: Hiroya Enomoto, Toshiyuki Emori, Masanobu Tsuchiya, Takeshi Hongo
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Publication number: 20160283251Abstract: A redundant PC system includes a plurality of redundant PCs which is to be connected through a network. Each of the redundant PCs includes hardware on which an interface for connection to the network is mounted and a host OS configured to operate on the hardware. The host OS is provided with a virtualization unit, and a redundant unit and a real-time communication unit, the redundant unit and the real-time communication unit being configured to operate as separate processes independent of the virtualization unit. The redundant unit is configured to perform a control monitoring for making a PC redundant via a universal interface.Type: ApplicationFiled: March 16, 2016Publication date: September 29, 2016Applicant: Yokogawa Electric CorporationInventors: Hiroya ENOMOTO, Toshiyuki EMORI, Masanobu TSUCHIYA, Takeshi HONGO
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Publication number: 20160283276Abstract: A process control system includes a PC that is to be connected to a redundant network. The PC comprises a virtualization unit, and a real-time communication unit configured to operate as a separate process independent of the virtualization unit.Type: ApplicationFiled: March 17, 2016Publication date: September 29, 2016Applicant: Yokogawa Electric CorporationInventors: Hiroya ENOMOTO, Toshiyuki EMORI, Masanobu TSUCHIYA, Takeshi HONGO
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Patent number: 8493737Abstract: According to one embodiment, a pressing member includes: a band-like pressing portion placed on a heat receiving block arranged on an element mounted on a substrate, the pressing portion configured to press the heat receiving block against the element; a first arm, one end of the first arm being connected to one longitudinal end of the pressing portion, other end of the first arm being connected to the substrate; and a second arm, one end of the second arm being connected to other longitudinal end of the pressing portion, other end of the second arm being connected to the substrate, wherein the first arm and the second arm are connected to the pressing portion in a bent shape as seen in a planar view from above a surface of the substrate.Type: GrantFiled: July 23, 2010Date of Patent: July 23, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Koji Abe, Takeshi Hongo
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Patent number: 8400769Abstract: According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.Type: GrantFiled: September 30, 2010Date of Patent: March 19, 2013Assignee: Kabushiki Kaisha ToshibaInventors: Kentaro Tomioka, Takeshi Hongo, Yukihiko Hata
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Patent number: 8281177Abstract: There is provided a distributed control system including a plurality of field controllers which are connected through a control network. Each of the field controllers includes: a control clock that defines a control timing of the field controller; and an adjustment unit that adjusts a control time of the control clock depending on a network time obtained through the control network.Type: GrantFiled: February 4, 2010Date of Patent: October 2, 2012Assignee: Yokogawa Electric CorporationInventors: Hideharu Yajima, Satoshi Kitamura, Senji Watanabe, Masafumi Kisa, Kazushi Sakamoto, Hiroyuki Takizawa, Kuniharu Akabane, Yoshinori Kobayashi, Kenji Habaguchi, Kiyotaka Kozakai, Mitsuhiro Kurono, Hiroaki Nakajima, Takeshi Hongo
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Patent number: 8270157Abstract: According to one embodiment, the electronic device includes: a heating element that has: a first electronic part; and a plurality of connection terminals provided around the first electronic part; a first circuit board that has: a first surface; a second surface opposite to the first surface; an opening; and a plurality of pads provided around the opening at the first surface to be electrically connected with the connection terminals, respectively; a heat receiving member that has a heat receiving portion faced to the heating element and that is thermally connected to the heating element; a pressing member that presses the heat receiving member toward the first circuit board; and a support member that supports the first circuit board at a periphery of the opening from the second surface.Type: GrantFiled: September 29, 2010Date of Patent: September 18, 2012Assignee: Kabushiki Kaisha ToshibaInventor: Takeshi Hongo
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Patent number: 8199503Abstract: According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.Type: GrantFiled: July 28, 2010Date of Patent: June 12, 2012Assignee: Kabushiki Kaisha ToshibaInventors: Kentaro Tomioka, Takeshi Hongo
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Patent number: 8130636Abstract: A communication control system is provided that performs communications satisfying a request for industrial applications and a request for open protocol communications at the same time. To this end, in the invention, a high-priority communication section performing critical communications to provide real time property and reliability, and a low-priority communication section performing communications based on an open standard protocol coexist in a same communication station.Type: GrantFiled: August 11, 2004Date of Patent: March 6, 2012Assignee: Yokogawa Electric CorporationInventors: Koji Demachi, Hiromichi Ebashi, Kuniharu Akabane, Takeshi Nakajima, Kenji Habaguchi, Masayuki Murakami, Toyoaki Yokoi, Takeshi Hongo, Akinori Ishii, Sadatoshi Sogo
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Patent number: 8054850Abstract: A communication control system is provided that satisfies the needs of industrial applications in terms of real time properties, scalability and flexibility. For this purpose, the invention causes a communication station performing communications in accordance with a standard protocol to perform multiplex communications based on time division of a communication band. Communication is performed by dividing a communication cycle into time slots, and assigning a set of communication stations and a type of a communication section to each of the time slots.Type: GrantFiled: August 11, 2004Date of Patent: November 8, 2011Assignee: Yokogawa Electric CorporationInventors: Koji Demachi, Hiromichi Ebashi, Kuniharu Akabane, Takeshi Nakajima, Takeshi Hongo, Toyoaki Yokoi, Kenji Habaguchi, Masayuki Murakami
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Patent number: 8045327Abstract: According to one embodiment, an electronic apparatus includes a housing, a partition, a first cooling fan, and a second cooling fan. The partition partitions an inside of the housing into a first chamber and a second chamber. The first chamber communicates with a first inlet, a third inlet, and a first outlet. The second chamber communicates with a second inlet and a second outlet. The first cooling fan locates above the third inlet in the first chamber, and includes a first intake configured to draw air in the first chamber, and a second intake configured to draw air outside the housing through the third inlet, the first cooling fan being configured to discharge the air to a heat sink. The second cooling fan locates in the second chamber and is configured to draw air in the second chamber, and to discharge the air to the second outlet.Type: GrantFiled: August 20, 2010Date of Patent: October 25, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Kentaro Tomioka, Takeshi Hongo
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Patent number: 8031469Abstract: According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.Type: GrantFiled: May 25, 2010Date of Patent: October 4, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Kentaro Tomioka, Takeshi Hongo
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Publication number: 20110157832Abstract: According to one embodiment, the electronic device includes: a heating element that has: a first electronic part; and a plurality of connection terminals provided around the first electronic part; a first circuit board that has: a first surface; a second surface opposite to the first surface; an opening; and a plurality of pads provided around the opening at the first surface to be electrically connected with the connection terminals, respectively; a heat receiving member that has a heat receiving portion faced to the heating element and that is thermally connected to the heating element; a pressing member that presses the heat receiving member toward the first circuit board; and a support member that supports the first circuit board at a periphery of the opening from the second surface.Type: ApplicationFiled: September 29, 2010Publication date: June 30, 2011Inventor: Takeshi HONGO
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Patent number: 7961467Abstract: An electronic apparatus including: a body; a circuit board housed in the body; a heating body mounted on the circuit board; a heat pipe having: an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion; and an extension that extends toward the circuit board.Type: GrantFiled: November 20, 2009Date of Patent: June 14, 2011Assignee: Kabushiki Kaisha ToshibaInventor: Takeshi Hongo
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Publication number: 20110075370Abstract: According to one embodiment, a pressing member includes: a band-like pressing portion placed on a heat receiving block arranged on an element mounted on a substrate, the pressing portion configured to press the heat receiving block against the element; a first arm, one end of the first arm being connected to one longitudinal end of the pressing portion, other end of the first arm being connected to the substrate; and a second arm, one end of the second arm being connected to other longitudinal end of the pressing portion, other end of the second arm being connected to the substrate, wherein the first arm and the second arm are connected to the pressing portion in a bent shape as seen in a planar view from above a surface of the substrate.Type: ApplicationFiled: July 23, 2010Publication date: March 31, 2011Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Koji Abe, Takeshi Hongo
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Publication number: 20110075360Abstract: According to one embodiment, an electronic apparatus includes a housing, a heat dissipating member disposed inside the housing, a first heat generating element mounted on the circuit board, a second heat generating element mounted on the circuit board, a first heat pipe, and a second heat pipe. The first heat pipe includes a first heat receiving portion thermally connected to the first heat generating element, and a first heat releasing portion thermally connected to the heat dissipating member. The second heat pipe includes a second heat receiving portion thermally connected to the second heat generating element, a second heat releasing portion thermally connected to the heat dissipating member, and a fluid capturing structure configured to temporarily hold a working fluid enclosed inside the second heat pipe.Type: ApplicationFiled: July 16, 2010Publication date: March 31, 2011Inventors: Kentaro Tomioka, Takeshi Hongo, Yukihiko Hata
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Publication number: 20110075371Abstract: According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first end and a second end, a second heat pipe including a third end, a fourth end, and an intermediate portion, and a cutout section provided on the first heat receiving block. The second heat generator is mounted on the circuit board at a position farther from the thermally radiative section than the first heat generator is. The first heat receiving block is provided with a cutout section and is thermally connected to the first heat generator. The second heat receiving block is thermally connected to the second heat generator. The intermediate portion of the second heat pipe passes through the cutout section.Type: ApplicationFiled: July 28, 2010Publication date: March 31, 2011Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kentaro Tomioka, Takeshi Hongo
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Publication number: 20110075362Abstract: According to one embodiment, the electronic device includes a housing, the first to third printed circuit boards, and a fan unit. The first printed circuit board includes the first heat-generating part secured to the first wiring board. The second printed circuit board includes the second and third heat-generating parts, has an amount of heat generation larger than that of the first printed circuit board, and is located between the first printed circuit board and the second wall. The third printed circuit board includes the fourth heat-generating part, has an amount of heat generation smaller than that of the first printed circuit board, and is located between the first printed circuit board and the first wall.Type: ApplicationFiled: May 25, 2010Publication date: March 31, 2011Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kentaro Tomioka, Takeshi HONGO