Abstract: Provided are a coating composition for producing an interlayer insulation film, the coating composition making it possible to produce an interlayer insulation film patterned and having a high Young’s modulus and a low relative dielectric constant in high throughput, a method for producing the interlayer insulation film, and a semiconductor element including the interlayer insulation film. Specifically, the coating composition for producing the interlayer insulation film includes: a polymerizable compound (A) being a polymerizable silicon compound having two or more polymerizable groups, at least one of the two or more polymerizable groups being a polymerizable group Q expressed by *-O-R-Y (wherein * represents a bond with a silicon atom, R represents a single bond, an unsubstituted or substituted alkylene group having 1 to 12 carbon atoms and optionally containing a heteroatom, or a phenylene group, and Y represents a polymerizable group); and a photopolymerization initiator (B).

Abstract: An object of the present invention is to provide an imprinting curable composition which includes a silicon-containing polymerizable compound such as polysiloxane, exhibits outstanding adhesion to a substrate and excellent demoldability from a fine pattern mold, and causes very little mold contamination. The object is attained by providing a photo-imprinting curable composition including a polymerizable compound (A) containing a silicon atom in the molecule, a photopolymerization initiator (B) and an additive (C), the additive (C) being a compound represented by the following formula (C1) or (C2): R1OC2H4OnX1??(C1) X2OC2H4OpC3H6OqC2H4OrX3??(C2) (In the formula (C1), R1 is a C12-30 alkyl group, X1 is a hydrogen atom or an acyl group, and n is an integer of 0 to 50. In the formula (C2), X2 and X3 are each independently a hydrogen atom or an acyl group, and p, q and r are each independently an integer of 1 to 50).

Abstract: There is provided a curable composition for imprinting containing a polymerizable compound, in which (a) the concentration of a polymerizable group in the polymerizable compound is in the range of 4.3 mmol/g to 7.5 mmol/g, (b) a polymerizable compound X whose Ohnishi parameter is 3.5 or less and ring parameter is 0.35 or greater is contained in the range of 40% by mass to 95% by mass with respect to all the polymerizable compounds, (c) a polymerizable compound C having three or more polymerizable groups is further contained in the range of 5% by mass to 20% by mass with respect to all the polymerizable compounds, and (d) the viscosity of the composition being at 25° C. and in a state of not containing a solvent is in the range of 3 mPa·s to 8,000 mPa·s.

Abstract: An object of the present invention is to provide an imprinting curable composition which includes a silicon-containing polymerizable compound such as polysiloxane, exhibits outstanding adhesion to a substrate and excellent demoldability from a fine pattern mold, and causes very little mold contamination. The object is attained by providing a photo-imprinting curable composition including a polymerizable compound (A) containing a silicon atom in the molecule, a photopolymerization initiator (B) and an additive (C), the additive (C) being a compound represented by the following formula (C1) or (C2): R1O?C2H4O?nX1??(C1) X2O?C2H4O?p?C3H6O?q?C2H4O?rX3??(C2) (In the formula (C1), R1 is a C12-30 alkyl group, X1 is a hydrogen atom or an acyl group, and n is an integer of 0 to 50. In the formula (C2), X2 and X3 are each independently a hydrogen atom or an acyl group, and p, q and r are each independently an integer of 1 to 50.

Abstract: A problem of The present invention is to provide a curable composition capable of forming a resist which can be easily washed after curing and which has high dry etching resistance and excellent precision of fine pattern transfer, also provide a resist film and a laminate each containing the curable composition, and further provide a pattern forming method using the resist film. The problem of the present invention can be solved by providing a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group and has at least one group Q having a polymerizable group represented by formula (1) below, the amount of silicon atoms in an nonvolatile content being 10 wt % or more.

Abstract: Provided is a photocurable resin composition that has a low viscosity and is capable of yielding a high refractive index. Specifically, a urethane (meth)acrylate resin (A) obtained by a reaction of an aromatic diisocyanate compound (a), a polyol compound (b), and a hydroxyl-group-containing (meth)acrylate compound (c) as essential raw material components is used. The urethane (meth)acrylate resin (A) contains a structural moiety (a-1) represented by structural formula (1) below: (where R1 represents a hydrogen atom or a methyl group) and a structural moiety (a-2) represented by structural formula (2) below: (where R1, R2, R3, X1, and X2 each independently represent a hydrogen atom or a methyl group) at a (a-1)/(a-2) molar ratio of 45/55 to 60/40. The polyol compound (b) has an aromatic hydrocarbon skeleton.

Abstract: A problem of The present invention is to provide a curable composition capable of forming a resist which can be easily washed after curing and which has high dry etching resistance and excellent precision of fine pattern transfer, also provide a resist film and a laminate each containing the curable composition, and further provide a pattern forming method using the resist film. The problem of the present invention can be solved by providing a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group and has at least one group Q having a polymerizable group represented by formula (1) below, the amount of silicon atoms in an nonvolatile content being 10 wt % or more.

Abstract: Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

Abstract: Provided is a photocurable resin composition that has a low viscosity and is capable of yielding a high refractive index. Specifically, a urethane (meth)acrylate resin (A) obtained by a reaction of an aromatic diisocyanate compound (a), a polyol compound (b), and a hydroxyl-group-containing (meth)acrylate compound (c) as essential raw material components is used. The urethane (meth)acrylate resin (A) contains a structural moiety (a-1) represented by structural formula (1) below: (where R1 represents a hydrogen atom or a methyl group) and a structural moiety (a-2) represented by structural formula (2) below: (where R1, R2, R3, X1, and X2 each independently represent a hydrogen atom or a methyl group) at a (a-1)/(a-2) molar ratio of 45/55 to 60/40. The polyol compound (b) has an aromatic hydrocarbon skeleton.

Abstract: Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

Abstract: There is provided a curable composition for imprinting containing a polymerizable compound, in which (a) the concentration of a polymerizable group in the polymerizable compound is in the range of 4.3 mmol/g to 7.5 mmol/g, (b) a polymerizable compound X whose Ohnishi parameter is 3.5 or less and ring parameter is 0.35 or greater is contained in the range of 40% by mass to 95% by mass with respect to all the polymerizable compounds, (c) a polymerizable compound C having three or more polymerizable groups is further contained in the range of 5% by mass to 20% by mass with respect to all the polymerizable compounds, and (d) the viscosity of the composition being at 25° C. and in a state of not containing a solvent is in the range of 3 mPa·s to 8,000 mPa·s.

Abstract: To provide an active-energy-ray-curable resin composition that exhibits high bonding strength even to plastic films that are difficult to bond such as untreated PET films, fluorine-based films, and polycarbonate films, which are referred to as difficult-to-bond films, and that can maintain the bonding strength even under wet heat conditions; an adhesive including the resin composition; and a laminate film obtained by using the adhesive. The essential components contained are a (meth)acrylate compound (A), a polyester resin (B), and a polymerization initiator (D), the (meth)acrylate compound (A) having a weight-average molecular weight (Mw) in a range of 5,000 to 30,000 and including, in a molecular structure, a (meth)acryloyl group and a polyester moiety, and the polyester resin (B) having an acid value in a range of 40 to 90 mgKOH/g.