Patents by Inventor Takeshi ISAYAMA

Takeshi ISAYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BONDING METHOD AND BONDED BODY
    Publication number: 20180082973
    Abstract: A bonding method of a first member and a second member includes: forming a first wire bonding bump (12) on a first electrode (14) arranged in the first member; forming a second wire bonding bump (22) on a second electrode 24 arranged in the second member; and flattening a tip section of the second wire bonding bump to form a bump flat surface (221). The tip section (120) of the first wire bonding bump and the bump flat surface (221) are pressure bonded to each other.
    Type: Application
    Filed: March 4, 2016
    Publication date: March 22, 2018
    Inventors: Masahiro KATO, Shota HARADA, Takeshi ISAYAMA, Mitsuteru FUJIEDA