Patents by Inventor Takeshi Ishitsuka

Takeshi Ishitsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240291009
    Abstract: A method for purifying a treatment target solution which can remove a compound having an aliphatic hydrocarbon group which has at least one ionic group and a fluorine atom efficiently is provided. The method for purifying a treatment target solution of the present invention comprises bringing a treatment target solution containing a compound having an aliphatic hydrocarbon group which has at least one ionic group selected from the group consisting of a carboxylic acid group and a sulfonic acid group, and a fluorine atom and may contain an oxygen atom, at least one acid selected from the group consisting of HF and H2SO4 and water, into contact with a resin having a tertiary amino group to remove the compound having an aliphatic hydrocarbon group from the treatment target solution.
    Type: Application
    Filed: April 11, 2024
    Publication date: August 29, 2024
    Applicant: AGC INC.
    Inventors: Takeshi SHIONO, Takeshi HIRAI, Yuko ARINAMI, Kana TANABE, Kei ISHITSUKA
  • Patent number: 10008436
    Abstract: A semiconductor device includes: a semiconductor substrate; a wiring layer provided on a front-surface side of the semiconductor substrate; a through-via that penetrates through the semiconductor substrate from a back-surface side of the semiconductor substrate and is coupled to a wire included in the wiring layer; and a stress relaxation part that protrudes toward a through-via side and is disposed on a section in the wire and coupled to the through-via, the stress relaxation part including at least one insulating portion containing an insulating material having a smaller thermal expansion coefficient than a material of the through-via.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: June 26, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Aki Dote, Takeshi Ishitsuka, Hideki Kitada
  • Publication number: 20170053914
    Abstract: A semiconductor device includes a semiconductor substrate, a stress generation source that is provided on the semiconductor substrate and generates stress in the semiconductor substrate, and a first field-effect transistor and a second field-effect transistor provided on the semiconductor substrate. The first field-effect transistor and the semiconductor substrate are disposed such that channel directions from a source toward a drain are different from each other in response to positions with respect to the stress generation source.
    Type: Application
    Filed: June 27, 2016
    Publication date: February 23, 2017
    Applicant: FUJITSU LIMITED
    Inventors: Hiroko TASHIRO, Takeshi ISHITSUKA
  • Publication number: 20160351474
    Abstract: A semiconductor device includes: a semiconductor substrate; a wiring layer provided on a front-surface side of the semiconductor substrate; a through-via that penetrates through the semiconductor substrate from a back-surface side of the semiconductor substrate and is coupled to a wire included in the wiring layer; and a stress relaxation part that protrudes toward a through-via side and is disposed on a section in the wire and coupled to the through-via, the stress relaxation part including at least one insulating portion containing an insulating material having a smaller thermal expansion coefficient than a material of the through-via.
    Type: Application
    Filed: March 25, 2016
    Publication date: December 1, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Aki Dote, Takeshi ISHITSUKA, Hideki Kitada
  • Patent number: 8314339
    Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.
    Type: Grant
    Filed: July 1, 2009
    Date of Patent: November 20, 2012
    Assignee: Fujitsu Limited
    Inventors: Masayuki Kitajima, Takeshi Ishitsuka, Satoshi Emoto
  • Publication number: 20100244274
    Abstract: A wiring board includes a first conductor constituting a signal line, a second conductor constituting a ground conductor or a power conductor, a dielectric layer disposed between and separately the first and second conductors, and a third conductor arranged between the first and second conductor, the third conductor being connected to the second conductor, and having a width narrower than that of the first conductor, the third conductor entirely opposing the first conductor, the entire portion of the third conductor being covered by the first conductor.
    Type: Application
    Filed: March 19, 2010
    Publication date: September 30, 2010
    Applicant: FUJITSU LIMITED
    Inventors: Takeshi ISHITSUKA, Tomoyuki Akahoshi
  • Publication number: 20100006325
    Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.
    Type: Application
    Filed: July 1, 2009
    Publication date: January 14, 2010
    Inventors: Masayuki KITAJIMA, Takeshi Ishitsuka, Satoshi Emoto
  • Publication number: 20090044972
    Abstract: When manufacturing a circuit board, a wiring pattern is printed on a substrate with a conductive paste formed of metal powder and thermoplastic resin, and then the conductive paste is subjected to a heating treatment and a pressing treatment.
    Type: Application
    Filed: May 30, 2008
    Publication date: February 19, 2009
    Inventors: Masayuki Kitajima, Takeshi Ishitsuka, Satoshi Emoto, Yutaka Noda, Seiichi Shimoura
  • Patent number: 6916539
    Abstract: A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.
    Type: Grant
    Filed: August 9, 2002
    Date of Patent: July 12, 2005
    Assignee: Fujitsu Limited
    Inventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
  • Patent number: 6846549
    Abstract: A multilayer printed wiring board includes a core member having a plurality of glass clothes impregnated with a resin. Each of the glass clothes is woven with glass yarns each of which includes a bundle of glass filaments. One or more buildup layers are laminated on one or each surface of the core member. The core member has an elastic modulus which is no less than 100 times that of the buildup layer at 240° C.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: January 25, 2005
    Assignee: Fujitsu Limited
    Inventors: Motoaki Tani, Nobuyuki Hayashi, Hiroyuki Machida, Takeshi Ishitsuka, Yasuo Yamagishi
  • Patent number: 6693736
    Abstract: An optical circuit system which takes out at least a portion of the light of a light power source corresponding to at least one type of output voltage of an IC, board, multichip module, electronic element, or opto-electronic element and produces an optical signal, wherein the light power source is an optical waveguide into which light has been introduced, a waveguide laser, or a waveguide optical amplifier, light reflecting portions are provided at its ends and/or middle, a signal transmission waveguide is formed in contact with the side surface and/or top or bottom surface of the optical waveguide or in proximity to the same at a certain distance, and the optical signal corresponding to at least one type of output voltage of the IC, board, multichip module, electronic element, or opto-electronic element is made to propagate to the signal transmission waveguide, which optical circuit system is rich in flexibility and enables complicated optical interconnections to be handled, and components of the same.
    Type: Grant
    Filed: October 17, 2000
    Date of Patent: February 17, 2004
    Assignee: Fujitsu Limited
    Inventors: Tetsuzo Yoshimura, Takeshi Ishitsuka, Katsusada Motoyoshi, Satoshi Tatsuura, Wataru Sotoyama, Koji Tsukamoto, Yasuhiro Yoneda, Tomoaki Hayano, Azuma Matsuura
  • Publication number: 20030211328
    Abstract: A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.
    Type: Application
    Filed: August 9, 2002
    Publication date: November 13, 2003
    Applicant: Fujitsu Limited
    Inventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
  • Publication number: 20020182958
    Abstract: A multilayer printed wiring board includes a core member including a plurality of glass clothes impregnated with a resin. Each of the glass clothes is woven with glass yarns each of which includes a bundle of glass filaments. One or more buildup layers are laminated on one or each surface of the core member. The core member has an elastic modulus which is no less than 100 times that of the buildup layer at 240° C.
    Type: Application
    Filed: September 26, 2001
    Publication date: December 5, 2002
    Applicant: Fujitsu Limited
    Inventors: Motoaki Tani, Nobuyuki Hayashi, Hiroyuki Machida, Takeshi Ishitsuka, Yasuo Yamagishi
  • Patent number: 6486235
    Abstract: A halogen-tree, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: November 26, 2002
    Assignee: Fujitsu Limited
    Inventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
  • Patent number: 6338975
    Abstract: An optical circuit device is manufactured by forming an organic film formed on a substrate, and giving this organic film non-linear optical properties. An optical circuit device is formed containing an organic film formed on a substrate, wherein said film is either selectively formed on a portion of the region on a substrate or said film being formed over the entire region on a substrate, and a portion of a region of that film is either selectively formed to a thickness differing from other regions or selectively having a different structure. This optical circuit device can be manufactured to have various constitutions, and allows the formation of a multilayer optical circuit.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: January 15, 2002
    Assignee: Fujitsu Limited
    Inventors: Tetsuzo Yoshimura, Satoshi Tatsuura, Wataru Sotoyama, Yasuhiro Yoneda, Katsusada Motoyoshi, Koji Tsukamoto, Takeshi Ishitsuka
  • Publication number: 20010049009
    Abstract: A halogen-tree, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.
    Type: Application
    Filed: December 7, 2000
    Publication date: December 6, 2001
    Inventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
  • Patent number: 6215585
    Abstract: An optical circuit system which takes out at least a portion of the light of a light power source corresponding to at least one type of output voltage of an IC, board, multichip module, electronic element, or opto-electronic element and produces an optical signal, wherein the light power source is an optical waveguide into which light has been introduced, a waveguide laser, or a waveguide optical amplifier, light reflecting portions are provided at its ends and/or middle, a signal transmission waveguide is formed in contact with the side surface and/or top or bottom surface of the optical waveguide or in proximity to the same at a certain distance, and the optical signal corresponding to at least one type of output voltage of the IC, board, multichip module, electronic element, or opto-electronic element is made to propagate to the signal transmission waveguide, which optical circuit system is rich in flexibility and enables complicated optical interconnections to be handled, and components of the same.
    Type: Grant
    Filed: February 6, 1998
    Date of Patent: April 10, 2001
    Assignee: Fujitsu Limited
    Inventors: Tetsuzo Yoshimura, Takeshi Ishitsuka, Katsusada Motoyoshi, Satoshi Tatsuura, Wataru Sotoyama, Koji Tsukamoto
  • Patent number: 6081632
    Abstract: A method of forming waveguides, refractive index distributions and optical couplings automatically by light incidence, and devices obtained thereby. A non-linear optical material which has excellent properties of a large degree of freedom for an optical circuit substrate composition, etc. is used for optical circuit devices and optical circuit substrates. A photoelectric device containing an organic conjugated polymer film is deposited on a substrate by vapor deposition polymerization as at least one function layer. An optical network is provided with optical wiring for exchanging signals between processing elements selected from electronic elements, electronic apparatuses, electrooptical elements and electrooptical apparatuses.
    Type: Grant
    Filed: October 16, 1997
    Date of Patent: June 27, 2000
    Assignee: Fujitsu Limited
    Inventors: Tetsuzo Yoshimura, Wataru Sotoyama, Katsusada Motoyoshi, Takeshi Ishitsuka, Koji Tsukamoto, Shigenori Aoki, Yasuhiro Yoneda, Satoshi Tatsuura, Haruhisa Soda, Tsuyoshi Yamamoto
  • Patent number: 6017681
    Abstract: A method of coupling optical parts including bonding the optical coupling faces of two optical waveguides by butting and fusing them. Also, a method for forming a refractive-index distribution having the focusing lens effect by setting the interval between the optical coupling faces of two optical parts to 0.1 mm or more, feeding a refractive-index imaging material also serving as an adhesive into the gap between the faces, and applying light to the refractive-index imaging material from the optical coupling face of at least one of the optical parts.
    Type: Grant
    Filed: November 7, 1995
    Date of Patent: January 25, 2000
    Assignee: Fujitsu Limited
    Inventors: Koji Tsukamoto, Takeshi Ishitsuka, Tetsuzo Yoshimura, Katsusada Motoyoshi, Yasuhiro Yoneda
  • Patent number: 5917980
    Abstract: An optical circuit device is manufactured by forming an organic film formed on a substrate, and giving this organic film non-linear optical properties. An optical circuit device is formed containing an organic film formed on a substrate, wherein said film is either selectively formed on a portion of the region on a substrate or said film being formed over the entire region on a substrate, and a portion of a region of that film is either selectively formed to a thickness differing from other regions or selectively having a different structure. This optical circuit device can be manufactured to have various constitutions, and allows the formation of a multilayer optical circuit.
    Type: Grant
    Filed: March 8, 1993
    Date of Patent: June 29, 1999
    Assignee: Fujitsu Limited
    Inventors: Tetsuzo Yoshimura, Satoshi Tatsuura, Wataru Sotoyama, Yasuhiro Yoneda, Katsusada Motoyoshi, Koji Tsukamoto, Takeshi Ishitsuka