Patents by Inventor Takeshi Ishitsuka
Takeshi Ishitsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240291009Abstract: A method for purifying a treatment target solution which can remove a compound having an aliphatic hydrocarbon group which has at least one ionic group and a fluorine atom efficiently is provided. The method for purifying a treatment target solution of the present invention comprises bringing a treatment target solution containing a compound having an aliphatic hydrocarbon group which has at least one ionic group selected from the group consisting of a carboxylic acid group and a sulfonic acid group, and a fluorine atom and may contain an oxygen atom, at least one acid selected from the group consisting of HF and H2SO4 and water, into contact with a resin having a tertiary amino group to remove the compound having an aliphatic hydrocarbon group from the treatment target solution.Type: ApplicationFiled: April 11, 2024Publication date: August 29, 2024Applicant: AGC INC.Inventors: Takeshi SHIONO, Takeshi HIRAI, Yuko ARINAMI, Kana TANABE, Kei ISHITSUKA
-
Patent number: 10008436Abstract: A semiconductor device includes: a semiconductor substrate; a wiring layer provided on a front-surface side of the semiconductor substrate; a through-via that penetrates through the semiconductor substrate from a back-surface side of the semiconductor substrate and is coupled to a wire included in the wiring layer; and a stress relaxation part that protrudes toward a through-via side and is disposed on a section in the wire and coupled to the through-via, the stress relaxation part including at least one insulating portion containing an insulating material having a smaller thermal expansion coefficient than a material of the through-via.Type: GrantFiled: March 25, 2016Date of Patent: June 26, 2018Assignee: FUJITSU LIMITEDInventors: Aki Dote, Takeshi Ishitsuka, Hideki Kitada
-
Publication number: 20170053914Abstract: A semiconductor device includes a semiconductor substrate, a stress generation source that is provided on the semiconductor substrate and generates stress in the semiconductor substrate, and a first field-effect transistor and a second field-effect transistor provided on the semiconductor substrate. The first field-effect transistor and the semiconductor substrate are disposed such that channel directions from a source toward a drain are different from each other in response to positions with respect to the stress generation source.Type: ApplicationFiled: June 27, 2016Publication date: February 23, 2017Applicant: FUJITSU LIMITEDInventors: Hiroko TASHIRO, Takeshi ISHITSUKA
-
Publication number: 20160351474Abstract: A semiconductor device includes: a semiconductor substrate; a wiring layer provided on a front-surface side of the semiconductor substrate; a through-via that penetrates through the semiconductor substrate from a back-surface side of the semiconductor substrate and is coupled to a wire included in the wiring layer; and a stress relaxation part that protrudes toward a through-via side and is disposed on a section in the wire and coupled to the through-via, the stress relaxation part including at least one insulating portion containing an insulating material having a smaller thermal expansion coefficient than a material of the through-via.Type: ApplicationFiled: March 25, 2016Publication date: December 1, 2016Applicant: FUJITSU LIMITEDInventors: Aki Dote, Takeshi ISHITSUKA, Hideki Kitada
-
Patent number: 8314339Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.Type: GrantFiled: July 1, 2009Date of Patent: November 20, 2012Assignee: Fujitsu LimitedInventors: Masayuki Kitajima, Takeshi Ishitsuka, Satoshi Emoto
-
Publication number: 20100244274Abstract: A wiring board includes a first conductor constituting a signal line, a second conductor constituting a ground conductor or a power conductor, a dielectric layer disposed between and separately the first and second conductors, and a third conductor arranged between the first and second conductor, the third conductor being connected to the second conductor, and having a width narrower than that of the first conductor, the third conductor entirely opposing the first conductor, the entire portion of the third conductor being covered by the first conductor.Type: ApplicationFiled: March 19, 2010Publication date: September 30, 2010Applicant: FUJITSU LIMITEDInventors: Takeshi ISHITSUKA, Tomoyuki Akahoshi
-
Publication number: 20100006325Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.Type: ApplicationFiled: July 1, 2009Publication date: January 14, 2010Inventors: Masayuki KITAJIMA, Takeshi Ishitsuka, Satoshi Emoto
-
Publication number: 20090044972Abstract: When manufacturing a circuit board, a wiring pattern is printed on a substrate with a conductive paste formed of metal powder and thermoplastic resin, and then the conductive paste is subjected to a heating treatment and a pressing treatment.Type: ApplicationFiled: May 30, 2008Publication date: February 19, 2009Inventors: Masayuki Kitajima, Takeshi Ishitsuka, Satoshi Emoto, Yutaka Noda, Seiichi Shimoura
-
Patent number: 6916539Abstract: A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.Type: GrantFiled: August 9, 2002Date of Patent: July 12, 2005Assignee: Fujitsu LimitedInventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
-
Patent number: 6846549Abstract: A multilayer printed wiring board includes a core member having a plurality of glass clothes impregnated with a resin. Each of the glass clothes is woven with glass yarns each of which includes a bundle of glass filaments. One or more buildup layers are laminated on one or each surface of the core member. The core member has an elastic modulus which is no less than 100 times that of the buildup layer at 240° C.Type: GrantFiled: September 26, 2001Date of Patent: January 25, 2005Assignee: Fujitsu LimitedInventors: Motoaki Tani, Nobuyuki Hayashi, Hiroyuki Machida, Takeshi Ishitsuka, Yasuo Yamagishi
-
Patent number: 6693736Abstract: An optical circuit system which takes out at least a portion of the light of a light power source corresponding to at least one type of output voltage of an IC, board, multichip module, electronic element, or opto-electronic element and produces an optical signal, wherein the light power source is an optical waveguide into which light has been introduced, a waveguide laser, or a waveguide optical amplifier, light reflecting portions are provided at its ends and/or middle, a signal transmission waveguide is formed in contact with the side surface and/or top or bottom surface of the optical waveguide or in proximity to the same at a certain distance, and the optical signal corresponding to at least one type of output voltage of the IC, board, multichip module, electronic element, or opto-electronic element is made to propagate to the signal transmission waveguide, which optical circuit system is rich in flexibility and enables complicated optical interconnections to be handled, and components of the same.Type: GrantFiled: October 17, 2000Date of Patent: February 17, 2004Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Takeshi Ishitsuka, Katsusada Motoyoshi, Satoshi Tatsuura, Wataru Sotoyama, Koji Tsukamoto, Yasuhiro Yoneda, Tomoaki Hayano, Azuma Matsuura
-
Publication number: 20030211328Abstract: A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.Type: ApplicationFiled: August 9, 2002Publication date: November 13, 2003Applicant: Fujitsu LimitedInventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
-
Publication number: 20020182958Abstract: A multilayer printed wiring board includes a core member including a plurality of glass clothes impregnated with a resin. Each of the glass clothes is woven with glass yarns each of which includes a bundle of glass filaments. One or more buildup layers are laminated on one or each surface of the core member. The core member has an elastic modulus which is no less than 100 times that of the buildup layer at 240° C.Type: ApplicationFiled: September 26, 2001Publication date: December 5, 2002Applicant: Fujitsu LimitedInventors: Motoaki Tani, Nobuyuki Hayashi, Hiroyuki Machida, Takeshi Ishitsuka, Yasuo Yamagishi
-
Patent number: 6486235Abstract: A halogen-tree, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.Type: GrantFiled: December 7, 2000Date of Patent: November 26, 2002Assignee: Fujitsu LimitedInventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
-
Patent number: 6338975Abstract: An optical circuit device is manufactured by forming an organic film formed on a substrate, and giving this organic film non-linear optical properties. An optical circuit device is formed containing an organic film formed on a substrate, wherein said film is either selectively formed on a portion of the region on a substrate or said film being formed over the entire region on a substrate, and a portion of a region of that film is either selectively formed to a thickness differing from other regions or selectively having a different structure. This optical circuit device can be manufactured to have various constitutions, and allows the formation of a multilayer optical circuit.Type: GrantFiled: February 25, 1999Date of Patent: January 15, 2002Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Satoshi Tatsuura, Wataru Sotoyama, Yasuhiro Yoneda, Katsusada Motoyoshi, Koji Tsukamoto, Takeshi Ishitsuka
-
Publication number: 20010049009Abstract: A halogen-tree, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.Type: ApplicationFiled: December 7, 2000Publication date: December 6, 2001Inventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
-
Patent number: 6215585Abstract: An optical circuit system which takes out at least a portion of the light of a light power source corresponding to at least one type of output voltage of an IC, board, multichip module, electronic element, or opto-electronic element and produces an optical signal, wherein the light power source is an optical waveguide into which light has been introduced, a waveguide laser, or a waveguide optical amplifier, light reflecting portions are provided at its ends and/or middle, a signal transmission waveguide is formed in contact with the side surface and/or top or bottom surface of the optical waveguide or in proximity to the same at a certain distance, and the optical signal corresponding to at least one type of output voltage of the IC, board, multichip module, electronic element, or opto-electronic element is made to propagate to the signal transmission waveguide, which optical circuit system is rich in flexibility and enables complicated optical interconnections to be handled, and components of the same.Type: GrantFiled: February 6, 1998Date of Patent: April 10, 2001Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Takeshi Ishitsuka, Katsusada Motoyoshi, Satoshi Tatsuura, Wataru Sotoyama, Koji Tsukamoto
-
Patent number: 6081632Abstract: A method of forming waveguides, refractive index distributions and optical couplings automatically by light incidence, and devices obtained thereby. A non-linear optical material which has excellent properties of a large degree of freedom for an optical circuit substrate composition, etc. is used for optical circuit devices and optical circuit substrates. A photoelectric device containing an organic conjugated polymer film is deposited on a substrate by vapor deposition polymerization as at least one function layer. An optical network is provided with optical wiring for exchanging signals between processing elements selected from electronic elements, electronic apparatuses, electrooptical elements and electrooptical apparatuses.Type: GrantFiled: October 16, 1997Date of Patent: June 27, 2000Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Wataru Sotoyama, Katsusada Motoyoshi, Takeshi Ishitsuka, Koji Tsukamoto, Shigenori Aoki, Yasuhiro Yoneda, Satoshi Tatsuura, Haruhisa Soda, Tsuyoshi Yamamoto
-
Patent number: 6017681Abstract: A method of coupling optical parts including bonding the optical coupling faces of two optical waveguides by butting and fusing them. Also, a method for forming a refractive-index distribution having the focusing lens effect by setting the interval between the optical coupling faces of two optical parts to 0.1 mm or more, feeding a refractive-index imaging material also serving as an adhesive into the gap between the faces, and applying light to the refractive-index imaging material from the optical coupling face of at least one of the optical parts.Type: GrantFiled: November 7, 1995Date of Patent: January 25, 2000Assignee: Fujitsu LimitedInventors: Koji Tsukamoto, Takeshi Ishitsuka, Tetsuzo Yoshimura, Katsusada Motoyoshi, Yasuhiro Yoneda
-
Patent number: 5917980Abstract: An optical circuit device is manufactured by forming an organic film formed on a substrate, and giving this organic film non-linear optical properties. An optical circuit device is formed containing an organic film formed on a substrate, wherein said film is either selectively formed on a portion of the region on a substrate or said film being formed over the entire region on a substrate, and a portion of a region of that film is either selectively formed to a thickness differing from other regions or selectively having a different structure. This optical circuit device can be manufactured to have various constitutions, and allows the formation of a multilayer optical circuit.Type: GrantFiled: March 8, 1993Date of Patent: June 29, 1999Assignee: Fujitsu LimitedInventors: Tetsuzo Yoshimura, Satoshi Tatsuura, Wataru Sotoyama, Yasuhiro Yoneda, Katsusada Motoyoshi, Koji Tsukamoto, Takeshi Ishitsuka