Abstract: A switch device includes a plurality of communication ports; a switch unit configured to relay a frame, which has been transmitted from a function unit and to which information including an ID of a VLAN is added, to another function unit via a communication port; and a duplication unit configured to, when the diagnosis device is connected to another switch device, duplicate the frame to be relayed via a designated communication port among the plurality of communication ports, and generate a duplicate frame for diagnosis that is a frame obtained by adding, to a duplicate frame obtained through the duplication, specific information indicating that the duplicate frame for diagnosis should be transmitted to the diagnosis device. The switch unit outputs the duplicate frame for diagnosis generated by the duplication unit from a communication port corresponding to the other switch device.

Abstract: Provided is a work processing apparatus configured so that limitations on the contents of processing for a work piece or the type of work piece can be reduced and processing for a wider range of processing contents and work piece can be performed. In a work processing apparatus 100, a work table 101 is, through a table displacement mechanism 103, supported on a rotation base 120 to be rotatably driven by a table rotary drive motor 125, and a weight holding tool 110 is supported on the rotation base 120 through a weight displacement mechanism 114. The table displacement mechanism 103 includes a rack-and-pinion mechanism configured to displace the work table 101 in an X-axis direction as viewed in the figure. At the table displacement mechanism 103, a power inputter 108 configured to input drive force from a table displacement mechanism drive apparatus 130 is provided.

Abstract: An imaging module includes: a planar light emitter that includes a light-emitting face and a light-emitter terminal; a power supply cable that is connected to the light-emitter terminal and that supplies electric power to the planar light emitter; a solid-state image sensing device that captures an image of an illumination object that is irradiated with light emitted from the light-emitting face; a coaxial cable that is electrically connected to the solid-state image sensing device; a light shield that is disposed between the solid-state image sensing device and the planar light emitter; and a light guide that guides light emitted from the light-emitting face to an outside of the imaging module. The planar light emitter, the solid-state image sensing device, part of the light shield, and the light guide constitute a rigid portion of the imaging module.

Abstract: An imaging module includes: a planar light emitter that includes a light-emitting face and a light-emitter terminal; a power supply cable that is connected to the light-emitter terminal and that supplies electric power to the planar light emitter; a solid-state image sensing device that captures an image of an illumination object that is irradiated with light emitted from the light-emitting face; a coaxial cable that is electrically connected to the solid-state image sensing device; a light shield that is disposed between the solid-state image sensing device and the planar light emitter; and a light guide that guides light emitted from the light-emitting face to an outside of the imaging module. The planar light emitter, the solid-state image sensing device, part of the light shield, and the light guide constitute a rigid portion of the imaging module.

Abstract: An imaging module includes: a support substrate that includes a first surface, a second surface on an opposite side of the first surface, and a first mounting terminal disposed on the first surface; a planar light emitter including a light-emitting face, and a light-emitter terminal disposed on the first surface of the support substrate and connected to the first mounting terminal; and a solid-state image sensing device disposed adjacent to the planar light emitter and that includes a light-incident surface that has a quadrangular shape in plan view and that captures an image of an imaging object that is irradiated with light emitted from the light-emitting face.

Abstract: An imaging module of the invention includes: an imaging element; and a substrate positioned on a rear surface opposite to an imaging surface of the imaging element and provided to extend from the rear surface to a side opposite to the imaging surface. An electrode pad provided on the rear surface of the imaging element and a front end portion of an electrode pad provided on a main surface of the substrate at a position close to the imaging element are electrically connected via a conductive connecting material portion. A notch portion recessed from a distal end of the front end portion is formed at the front end portion of the electrode pad of the substrate.

Abstract: An imaging module includes: a support substrate that includes a first surface, a second surface on an opposite side of the first surface, and a first mounting terminal disposed on the first surface; a planar light emitter including a light-emitting face, and a light-emitter terminal disposed on the first surface of the support substrate and connected to the first mounting terminal; and a solid-state image sensing device disposed adjacent to the planar light emitter and that includes a light-incident surface that has a quadrangular shape in plan view and that captures an image of an imaging object that is irradiated with light emitted from the light-emitting face.

Abstract: An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.

Abstract: The imaging module includes: an image-sensing device, circuit substrate, fixing member, signal cable, and electroconductive member. The image-sensing device includes: a connection electrode. The circuit substrate includes: a substrate main body, electrode terminal, cable terminal, and connection wiring. The substrate main body has two surfaces and is an insulating member. The electrode terminal is on the first surface and is electrically connected to the connection electrode. The cable terminal is on the second surface. Inside the substrate main body, the connection wiring electrically connects the electrode terminal to the cable terminal. The fixing member has a through hole and a substrate connection face opposite the second surface. The signal cable is inserted into the through hole and is fixed by the fixing member. The electroconductive member connects the second surface to the substrate connection face and electrically connects the conductor end face to the cable terminal.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.

Abstract: An imaging module of the invention includes: a connector including: a first implanted conductor; a second implanted conductor longer than the first implanted conductor; a first groove that includes a second mounting terminal constituting part of the first implanted conductor; a second groove that includes a third mounting terminal constituting part of the second implanted conductor; and a third groove that is located between the first groove and the second groove; and a coaxial cable including: an internal conductor that is provided in the first groove and is electrically connected to the second mounting terminal; a sheath conductor that is provided in the second groove and is electrically connected to the third mounting terminal; and a coated portion that is provided in the third groove.

Abstract: The imaging module includes: an image-sensing device, circuit substrate, fixing member, signal cable, and electroconductive member. The image-sensing device includes: a connection electrode. The circuit substrate includes: a substrate main body, electrode terminal, cable terminal, and connection wiring. The substrate main body has two surfaces and is an insulating member. The electrode terminal is on the first surface and is electrically connected to the connection electrode. The cable terminal is on the second surface. Inside the substrate main body, the connection wiring electrically connects the electrode terminal to the cable terminal. The fixing member has a through hole and a substrate connection face opposite the second surface. The signal cable is inserted into the through hole and is fixed by the fixing member. The electroconductive member connects the second surface to the substrate connection face and electrically connects the conductor end face to the cable terminal.

Abstract: An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plaurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.