Abstract: To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper post composed of metallic copper to thereby electrically connect the front and rear surfaces of the double-sided wiring glass substrate. The filling with the copper post is performed by first sealing, with copper, one opening part of the through-hole using an electrolytic plating method and then further plating copper from the one sealed opening part to the other opening part. As a result, the front and rear surfaces of the double-sided wiring glass substrate can be surely electrically connected as well as high thermal resistance of the whole double-sided wiring glass substrate can be secured.

Abstract: To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper film layer composed of metallic copper for electrically connecting the front and rear surfaces of the double-sided wiring glass substrate. The copper film layer is formed by first forming an electroless plating copper layer and then forming an electrolytic plating copper layer on a sidewall of the through-hole. As a result, the front and rear surfaces of the double-sided wiring glass substrate can be surely electrically connected as well as high thermal resistance of the whole double-sided wiring glass substrate can be secured.

Abstract: A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal expansion close to that of a copper film as a core substrate, a through hole is formed in the photosensitive glass by photolithography, a sputtering silicon oxide layer and a sputtering silicon nitride layer are formed to prevent leak of alkali metal ions from the photosensitive glass, a sputtering chromium layer, a sputtering chromium-copper layer and a sputtering copper layer are formed to enhance the adhesion strength between the copper film and the sputtering silicon oxide layer, and a copper film of 1 to 20 ?m thick is formed. With resin filled into the interior of the through hole, a wiring layer is patterned by etching, an insulating layer is formed, and the surface is covered with a surface treatment layer and a cover coat.

Abstract: To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper post composed of metallic copper to thereby electrically connect the front and rear surfaces of the double-sided wiring glass substrate. The filling with the copper post is performed by first sealing, with copper, one opening part of the through-hole using an electrolytic plating method and then further plating copper from the one sealed opening part to the other opening part. As a result, the front and rear surfaces of the double-sided wiring glass substrate can be surely electrically connected as well as high thermal resistance of the whole double-sided wiring glass substrate can be secured.

Abstract: To improve thermal resistance of a double-sided wiring glass substrate. A through-hole is filled with a copper film layer composed of metallic copper for electrically connecting the front and rear surfaces of the double-sided wiring glass substrate. The copper film layer is formed by first forming an electroless plating copper layer and then forming an electrolytic plating copper layer on a sidewall of the through-hole. As a result, the front and rear surfaces of the double-sided wiring glass substrate can be surely electrically connected as well as high thermal resistance of the whole double-sided wiring glass substrate can be secured.

Abstract: A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal expansion close to that of a copper film as a core substrate, a through hole is formed in the photosensitive glass by photolithography, a sputtering silicon oxide layer and a sputtering silicon nitride layer are formed to prevent leak of alkali metal ions from the photosensitive glass, a sputtering chromium layer, a sputtering chromium-copper layer and a sputtering copper layer are formed to enhance the adhesion strength between the copper film and the sputtering silicon oxide layer, and a copper film of 1 to 20 ?m thick is formed. With resin filled into the interior of the through hole, a wiring layer is patterned by etching, an insulating layer is formed, and the surface is covered with a surface treatment layer and a cover coat.

Abstract: A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal expansion close to that of a copper film as a core substrate, a through hole is formed in the photosensitive glass by photolithography, a sputtering silicon oxide layer and a sputtering silicon nitride layer are formed to prevent leak of alkali metal ions from the photosensitive glass, a sputtering chromium layer, a sputtering chromium-copper layer and a sputtering copper layer are formed to enhance the adhesion strength between the copper film and the sputtering silicon oxide layer, and a copper film of 1 to 20 ?m thick is formed. With resin filled into the interior of the through hole, a wiring layer is patterned by etching, an insulating layer is formed, and the surface is covered with a surface treatment layer and a cover coat.

Abstract: A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal expansion close to that of a copper film as a core substrate, a through hole is formed in the photosensitive glass by photolithography, a sputtering silicon oxide layer and a sputtering silicon nitride layer are formed to prevent leak of alkali metal ions from the photosensitive glass, a sputtering chromium layer, a sputtering chromium-copper layer and a sputtering copper layer are formed to enhance the adhesion strength between the copper film and the sputtering silicon oxide layer, and a copper film of 1 to 20 &mgr;m thick is formed. With resin filled into the interior of the through hole, a wiring layer is patterned by etching, an insulating layer is formed, and the surface is covered with a surface treatment layer and a cover coat.

Abstract: A multilayer printed wiring board which permits the formation of fine wiring patterns, thereby increasing the density of wiring patterns. Using photosensitive glass having a coefficient of thermal expansion close to that of a copper film as a core substrate, a through hole is formed in the photosensitive glass by photolithography, a sputtering silicon oxide layer and a sputtering silicon nitride layer are formed to prevent leak of alkali metal ions from the photosensitive glass, a sputtering chromium layer, a sputtering chromium-copper layer and a sputtering copper layer are formed to enhance the adhesion strength between the copper film and the sputtering silicon oxide layer, and a copper film of 1 to 20 &mgr;m thick is formed. With resin filled into the interior of the through hole, a wiring layer is patterned by etching, an insulating layer is formed, and the surface is covered with a surface treatment layer and a cover coat.