Abstract: A lathe system includes a spindle capable of gripping a bar and moving back and forth in an axial direction of the bar and a tool post to which a first tool is attached. The lathe system can manufacture a plurality of products having an identical shape from the bar by repeating a machining of the bar, a cutting off of a machined portion of the bar, and a grip change by the spindle, the grip change by the spindle comprising releasing the bar, moving back, and re-gripping the bar at a predetermined gripping position. The lathe system further includes a gripping position selecting unit capable of selecting a special gripping position at which the spindle re-grips the bar when a state of the machine tool system meets a predetermined condition, the special gripping position being different from the predetermined gripping position.

Abstract: A second main surface of the copper plate is opposite a first main surface of the copper plate, and is bonded to a silicon nitride ceramic substrate by the bonding layer. A first portion and a second portion of an end surface of the copper plate form an angle of 135° to 165° on an outside of the copper plate. An extended plane of the first portion and the second main surface form an angle of 110° to 145° a side where the second portion is located. A distance from the second main surface to an intersection of the first portion and the second portion in a direction of a thickness of the copper plate is 10 to 100 ?m. The second main surface extends beyond the extended plane of the first portion by a distance of 10 ?m or more.

Abstract: Apparatuses and methods including a test circuit in a scribe region between chips are described. An example apparatus includes: a first semiconductor chip and a second semiconductor chip, adjacent to one another; a scribe region between the first and second semiconductor chips; test address pads in the scribe region; and an address decoder circuit in the scribe region. The test address pads receive address signals. The address decoder provides first signals responsive to the address signals from the test address pads.

Abstract: Apparatuses and methods including a test circuit in a scribe region between chips are described. An example apparatus includes: a first semiconductor chip and a second semiconductor chip, adjacent to one another; a scribe region between the first and second semiconductor chips; test address pads in the scribe region; and an address decoder circuit in the scribe region. The test address pads receive address signals. The address decoder provides first signals responsive to the address signals from the test address pads.

Abstract: The bonded substrate includes the silicon nitride ceramic substrate, a copper plate, the bonding layer, and penetrating regions. The copper plate and the bonding layer are patterned into a predetermined shape, and are disposed over a main surface of the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the main surface of the silicon nitride ceramic substrate. The penetrating regions each include one or more penetrating portions penetrating continuously from the main surface of the substrate into the silicon nitride ceramic substrate to a depth of 3 ?m or more and 20 ?m or less, and contain silver, and the number of penetrating regions present per square millimeter of the main surface of the substrate is one or more and 30 or less.

Abstract: A second main surface of the copper plate is opposite a first main surface of the copper plate, and is bonded to a silicon nitride ceramic substrate by the bonding layer. A first portion and a second portion of an end surface of the copper plate form an angle of 135° to 165° on an outside of the copper plate. An extended plane of the first portion and the second main surface form an angle of 110° to 145° a side where the second portion is located. A distance from the second main surface to an intersection of the first portion and the second portion in a direction of a thickness of the copper plate is 10 to 100 ?m. The second main surface extends beyond the extended plane of the first portion by a distance of 10 ?m or more.

Abstract: Provided is a bonded substrate mainly for mounting a power semiconductor in which the reliability to a thermal cycle has been enhanced as compared with a conventional one. In a bonded substrate in which a copper plate is bonded to one or both main surface(s) of a nitride ceramic substrate, a bonding layer consisting of TiN intervenes between the nitride ceramic substrate and the copper plate and is adjacent at least to the copper plate, and an Ag distribution region in which Ag atoms are distributed is set to be present in the copper plate. Preferably, an Ag-rich phase is set to be present discretely at an interface between the bonding layer and the copper plate.

Abstract: A piezoelectric device is a fired body including a body part 10 and external electrodes 21 and 22. A surface of the side electrode 22 is comprised only of a material for the side electrode 22. On a surface of the surface electrode 21 or a surface of a connection portion where the surface electrode 21 and the side electrode 22 are connected to each other, a protrusion h extending along a direction along which the connection portion extends and sticking out in a thickness direction of the surface electrode 21 is provided. A region, on the surface of the surface electrode 21, farther from the connection portion than the protrusion h is interspersed with a plurality of exposed portions in each of which a surface of a ceramic material having lower solder wettability than a material for the surface electrode 21 is exposed.

Abstract: Provided is a bonded substrate mainly for mounting a power semiconductor in which the reliability to a thermal cycle has been enhanced as compared with a conventional one. In a bonded substrate in which a copper plate is bonded to one or both main surface(s) of a nitride ceramic substrate, a bonding layer consisting of TiN intervenes between the nitride ceramic substrate and the copper plate and is adjacent at least to the copper plate, and an Ag distribution region in which Ag atoms are distributed is set to be present in the copper plate. Preferably, an Ag-rich phase is set to be present discretely at an interface between the bonding layer and the copper plate.

Abstract: Provided is a piezoelectric device which has high reliability for the joint between an external electrode and low-melting-point solder. This piezoelectric device is a fired body including a main body part and an external electrode. The external electrode includes a surface electrode that covers upper and lower surfaces of the main body part, and a side-surface electrode that covers a side surface of the main body part and makes a connection to the surface electrode. This piezoelectric device is obtained by co-firing all of constituent members. The surface electrode is configured to include platinum (Pt) or palladium (Pd). The side-surface electrode is also configured to include platinum (Pt) or palladium (Pd). In addition, the side-surface electrode contains gold (Au). The content ratio of gold in the side-surface electrode is preferably 3 to 20 weight %.

Abstract: A method for manufacturing a ceramic device is provided including fixing a ceramic substrate to a reinforcing plate via a sacrifice layer, forming a groove, which penetrates the ceramic substrate and the sacrifice layer and reaches the reinforcing plate, on an upper surface of the ceramic substrate to divide the ceramic substrate into plural ceramic substrates, and removing the sacrifice layer.

Abstract: A laminated body is provided that exhibits impact resistance, wear resistance and scratch resistance, and which enables a reduction in weight together with a reduction in the dielectric constant. The laminated body 100 includes a first tabular member 10 configured from a ceramic material and having a first thickness t1, and a second tabular member 20 configured from a polymer material and having a second thickness t2. The laminated body 100 withstands a falling-ball impact breaking test from a height that is higher than that exhibited by a single layer body that is configured from the ceramic material and of a thickness t3 that is the sum of the first thickness t1 and the second thickness t2.

Abstract: A piezoelectric device is a fired body including a body part 10 and external electrodes 21 and 22. A surface of the side electrode 22 is comprised only of a material for the side electrode 22. On a surface of the surface electrode 21 or a surface of a connection portion where the surface electrode 21 and the side electrode 22 are connected to each other, a protrusion h extending along a direction along which the connection portion extends and sticking out in a thickness direction of the surface electrode 21 is provided. A region, on the surface of the surface electrode 21, farther from the connection portion than the protrusion h is interspersed with a plurality of exposed portions in each of which a surface of a ceramic material having lower solder wettability than a material for the surface electrode 21 is exposed.

Abstract: A laminated body is provided that exhibits impact resistance, wear resistance and scratch resistance, and which enables a reduction in weight together with a reduction in the dielectric constant. The laminated body 100 includes a first tabular member 10 configured from a ceramic material and having a first thickness t1, and a second tabular member 20 configured from a polymer material and having a second thickness t2. The laminated body 100 withstands a falling-ball impact breaking test from a height that is higher than that exhibited by a single layer body that is configured from the ceramic material and of a thickness t3 that is the sum of the first thickness t1 and the second thickness t2.

Abstract: A provided method for manufacturing a ceramic device 62 includes fixing a ceramic substrate 10 to a reinforcing plate 20 via a sacrifice layer 30, forming a groove, which penetrates the ceramic substrate 10 and the sacrifice layer 30 and reaches the reinforcing plate 20, on an upper surface of the ceramic substrate 10 to divide the ceramic substrate 10 into plural ceramic substrates, and removing the sacrifice layer 30.