Abstract: A resistor sheet input tablet comprising two rectangular resistor sheets each provided at two opposite edges thereof with electrodes, the rectangular resistor sheets being superposed such that the electrodes on one of the resistor sheets lie perpendicularly to those on the other resistor sheets, wherein the resistor sheets have a two resistor layer construction comprising (a) a main resistor layer consisting of a thin metal film deposited thereon which in turn is bonded to (b) an electrically insulating layer and (c) a protective resistor layer formed on the surface of the main resistor layer.

Abstract: A resistor sheet input tablet comprising two rectangular resistor sheets each provided at two opposite edges thereof with electrodes, the rectangular resistor sheets being superposed such that the electrodes on one of the resistor sheets lie perpendicularly to those on the other resistor sheets, wherein the resistor sheets have a two resistor layer construction comprising (a) a main resistor layer consisting of a thin metal film deposited thereon which in turn is bonded to (b) an electrically insulating layer and (c) a protective resistor layer formed on the surface of the main resistor layer.

Abstract: A part for a slide variable resistor provided on an insulated support thereof with a film resistive layer adapted for a slide terminal to be slid along the surface thereof, which part is characterized in that said film resistive layer comprises a main resistive layer pattern bound to the insulated support and a protective resistive layer pattern coated on said main resistive layer pattern, wherein the protective resistive layer pattern has a larger sheet resistivity than said main resistive layer pattern.

Abstract: In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced.

Abstract: An etching solution containing 0.1 mol/l or more phosphoric acid, 0.05 mol/l or more pyrophosphoric acid, 0.1 mol/l or more phosphorous acid, 0.1 mol/l or more of a mixture of phosphoric, pyrophosphoric and/or phosphorous acids, molten phosphoric acid, molten pyrophosphoric acid, molten phosphorous acid or a molten mixture of phosphoric, pyrophosphoric and/or phosphorous acids, for use in etching a tin-nickel alloy; and a process for etching the tin-nickel alloy with the etching solution.

Abstract: A printed circuit substrate with a resistance coat comprises an insulating support having provided at least on the one side thereof a highly conductive material layer interposed with a resistance coat. The resistance coat comprises tin-nickel alloy.

Abstract: In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced.