Patents by Inventor Takeshi KAN

Takeshi KAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948713
    Abstract: Disclosed are a magnetic coating material, a magnetic sheet, and a metal compatible tag that have excellent magnetic shielding characteristics against radio waves in the UHF band and do not interfere with a distribution process. A magnetic coating material includes a magnetic filler and a binder resin, wherein the magnetic filler is an Fe—Cr alloy, and wherein in a magnetic sheet formed from the magnetic coating material, complex relative permeability in 860 MHz to 960 MHz has a loss factor tan ? of 0.3 or less and a real part ?? of 5 or more. Also, a magnetic coating material includes a magnetic filler and a binder resin, wherein the magnetic filler is an Fe—Cr alloy, and wherein a mass ratio of the magnetic filler to a solid content of the binder (mass of the magnetic filler/mass of the solid content of the binder) is from 70/30 to 95/5.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: April 2, 2024
    Assignee: FUJIKURA KASEI CO., LTD.
    Inventor: Takeshi Kan
  • Publication number: 20230039179
    Abstract: Disclosed are a magnetic coating material, a magnetic sheet, and a metal compatible tag that have excellent magnetic shielding characteristics against radio waves in the UHF band and do not interfere with a distribution process. A magnetic coating material includes a magnetic filler and a binder resin, wherein the magnetic filler is an Fe—Cr alloy, and wherein in a magnetic sheet formed from the magnetic coating material, complex relative permeability in 860 MHz to 960 MHz has a loss factor tan ? of 0.3 or less and a real part ?? of 5 or more. Also, a magnetic coating material includes a magnetic filler and a binder resin, wherein the magnetic filler is an Fe—Cr alloy, and wherein a mass ratio of the magnetic filler to a solid content of the binder (mass of the magnetic filler/mass of the solid content of the binder) is from 70/30 to 95/5.
    Type: Application
    Filed: November 6, 2020
    Publication date: February 9, 2023
    Applicant: FUJIKURA KASEI CO., LTD.
    Inventor: Takeshi KAN
  • Patent number: 9807889
    Abstract: An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: October 31, 2017
    Assignees: OSAKA UNIVERSITY, SENJU METAL INDUSTRY CO., LTD.
    Inventors: Kozo Fujimoto, Shinji Fukumoto, Michiya Matsushima, Satoshi Watanabe, Takeshi Kan, Minoru Ueshima, Takeshi Sakamoto, Shu Inoue
  • Patent number: 9577262
    Abstract: A positive electrode material for a lithium ion secondary cell, includes: a binding agent in which an active material formed from a lithium metal oxide are dispersed together with barium titanate and conductive carbon.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: February 21, 2017
    Assignee: Fujikura Kasei Co., Ltd.
    Inventor: Takeshi Kan
  • Publication number: 20140154570
    Abstract: A positive electrode material for a lithium ion secondary cell, includes: a binding agent in which an active material formed from a lithium metal oxide are dispersed together with barium titanate and conductive carbon.
    Type: Application
    Filed: September 12, 2012
    Publication date: June 5, 2014
    Applicant: FUJIKURA KASEI CO., LTD.
    Inventor: Takeshi Kan
  • Publication number: 20140029224
    Abstract: An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.
    Type: Application
    Filed: July 29, 2013
    Publication date: January 30, 2014
    Applicants: SENJU METAL INDUSTRY CO., LTD., OSAKA UNIVERSITY
    Inventors: Kozo FUJIMOTO, Shinji FUKUMOTO, Michiya MATSUSHIMA, Satoshi WATANABE, Takeshi KAN, Minoru UESHIMA, Takeshi SAKAMOTO, Shu INOUE