Patents by Inventor Takeshi Kataya
Takeshi Kataya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10373043Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.Type: GrantFiled: August 24, 2016Date of Patent: August 6, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
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Patent number: 9830552Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.Type: GrantFiled: August 12, 2013Date of Patent: November 28, 2017Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
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Publication number: 20170236049Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.Type: ApplicationFiled: May 5, 2017Publication date: August 17, 2017Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
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Publication number: 20160358064Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.Type: ApplicationFiled: August 24, 2016Publication date: December 8, 2016Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
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Patent number: 9460376Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.Type: GrantFiled: January 15, 2010Date of Patent: October 4, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
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Publication number: 20130334321Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.Type: ApplicationFiled: August 12, 2013Publication date: December 19, 2013Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
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Patent number: 8413907Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: May 10, 2012Date of Patent: April 9, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Patent number: 8400307Abstract: A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.Type: GrantFiled: December 3, 2010Date of Patent: March 19, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Takeshi Kataya, Noboru Kato, Satoshi Ishino, Nobuo Ikemoto, Ikuhei Kimura, Yuya Dokai
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Patent number: 8360325Abstract: A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.Type: GrantFiled: August 24, 2010Date of Patent: January 29, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Takeshi Kataya, Noboru Kato, Satoshi Ishino, Nobuo Ikemoto, Ikuhei Kimura, Koji Shiroki, Yuya Dokai
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Publication number: 20120217312Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: ApplicationFiled: May 10, 2012Publication date: August 30, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
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Patent number: 8191791Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: February 8, 2011Date of Patent: June 5, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Patent number: 7997501Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: July 15, 2009Date of Patent: August 16, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Publication number: 20110127337Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: ApplicationFiled: February 8, 2011Publication date: June 2, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
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Publication number: 20110074584Abstract: A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.Type: ApplicationFiled: December 3, 2010Publication date: March 31, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhel KIMURA, Yuya DOKAI
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Patent number: 7905421Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: July 15, 2009Date of Patent: March 15, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Publication number: 20100308118Abstract: A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.Type: ApplicationFiled: August 24, 2010Publication date: December 9, 2010Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhei KIMURA, Koji SHIROKI, Yuya DOKAI
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Patent number: 7830311Abstract: A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal. A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.Type: GrantFiled: September 7, 2007Date of Patent: November 9, 2010Assignee: Murata Manufacturing Co., Ltd.Inventors: Takeshi Kataya, Noboru Kato, Satoshi Ishino, Nobuo Ikemoto, Ikuhei Kimura
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Publication number: 20100103058Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.Type: ApplicationFiled: January 15, 2010Publication date: April 29, 2010Applicant: Murata Manufacturing Co., Ltd.Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
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Publication number: 20090266900Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: ApplicationFiled: July 15, 2009Publication date: October 29, 2009Applicant: Murata Manufacturing Co., Ltd.Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
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Publication number: 20090021446Abstract: A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal. A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.Type: ApplicationFiled: September 7, 2007Publication date: January 22, 2009Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhei KIMURA