Patents by Inventor Takeshi Kataya

Takeshi Kataya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10373043
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: August 6, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
  • Patent number: 9830552
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: November 28, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
  • Publication number: 20170236049
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Application
    Filed: May 5, 2017
    Publication date: August 17, 2017
    Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
  • Publication number: 20160358064
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Application
    Filed: August 24, 2016
    Publication date: December 8, 2016
    Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
  • Patent number: 9460376
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: October 4, 2016
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
  • Publication number: 20130334321
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Application
    Filed: August 12, 2013
    Publication date: December 19, 2013
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
  • Patent number: 8413907
    Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: April 9, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
  • Patent number: 8400307
    Abstract: A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: March 19, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takeshi Kataya, Noboru Kato, Satoshi Ishino, Nobuo Ikemoto, Ikuhei Kimura, Yuya Dokai
  • Patent number: 8360325
    Abstract: A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: January 29, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takeshi Kataya, Noboru Kato, Satoshi Ishino, Nobuo Ikemoto, Ikuhei Kimura, Koji Shiroki, Yuya Dokai
  • Publication number: 20120217312
    Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
    Type: Application
    Filed: May 10, 2012
    Publication date: August 30, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
  • Patent number: 8191791
    Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: June 5, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
  • Patent number: 7997501
    Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: August 16, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
  • Publication number: 20110127337
    Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
    Type: Application
    Filed: February 8, 2011
    Publication date: June 2, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
  • Publication number: 20110074584
    Abstract: A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.
    Type: Application
    Filed: December 3, 2010
    Publication date: March 31, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhel KIMURA, Yuya DOKAI
  • Patent number: 7905421
    Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: March 15, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
  • Publication number: 20100308118
    Abstract: A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.
    Type: Application
    Filed: August 24, 2010
    Publication date: December 9, 2010
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhei KIMURA, Koji SHIROKI, Yuya DOKAI
  • Patent number: 7830311
    Abstract: A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal. A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: November 9, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takeshi Kataya, Noboru Kato, Satoshi Ishino, Nobuo Ikemoto, Ikuhei Kimura
  • Publication number: 20100103058
    Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
    Type: Application
    Filed: January 15, 2010
    Publication date: April 29, 2010
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Noboru KATO, Satoshi ISHINO, Takeshi KATAYA, Ikuhei KIMURA, Nobuo IKEMOTO, Yuya DOKAI
  • Publication number: 20090266900
    Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
    Type: Application
    Filed: July 15, 2009
    Publication date: October 29, 2009
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
  • Publication number: 20090021446
    Abstract: A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal. A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.
    Type: Application
    Filed: September 7, 2007
    Publication date: January 22, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Takeshi KATAYA, Noboru KATO, Satoshi ISHINO, Nobuo IKEMOTO, Ikuhei KIMURA