Abstract: In a common chamber (102) for distributing, to respective pressure chambers (211), an ink supplied from the ink inlet (101), resistant walls (111) are provided in areas that are located ahead and behind of the flow of the ink, i.e., areas around inlets of flow channels (221) that lead to respective pressure chambers (211), and any resistance against the flow of the ink is generated according to the heights of the resistant walls (111), thereby capturing a solid ingredient (150) included in the ink. In this case, by adjusting the heights of the resistant walls (111) to control capabilities of introducing the solid ingredient (150), it becomes possible to dispense desired amounts of the solid ingredient (150) to the respective pressure chamber (211).

Abstract: An inkjet head, includes: a pressure chamber communicating with an ink flow channel; a diaphragm linked to the pressure chamber; a piezoelectric element linked to the diaphragm; a nozzle communicating with the pressure chamber; and a vibrating mechanism placed in the ink flow channel and vibrates a supplied ink. Further provided is an inkjet device, including: the above inkjet head; a holding unit that holds a coating object; a moving mechanism that causes relative movement between the inkjet head and the holding unit; and a control unit that controls the inkjet head, the holding unit, and the moving mechanism.

Abstract: A connection method includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

Abstract: An inkjet head, includes: a pressure chamber communicating with an ink flow channel; a diaphragm linked to the pressure chamber; a piezoelectric element linked to the diaphragm; a nozzle communicating with the pressure chamber; and a vibrating mechanism placed in the ink flow channel and vibrates a supplied ink. Further provided is an inkjet device, including: the above inkjet head; a holding unit that holds a coating object; a moving mechanism that causes relative movement between the inkjet head and the holding unit; and a control unit that controls the inkjet head, the holding unit, and the moving mechanism.

Abstract: In a common chamber (102) for distributing, to respective pressure chambers (211), an ink supplied from the ink inlet (101), resistant walls (111) are provided in areas that are located ahead and behind of the flow of the ink, i.e., areas around inlets of flow channels (221) that lead to respective pressure chambers (211), and any resistance against the flow of the ink is generated according to the heights of the resistant walls (111), thereby capturing a solid ingredient (150) included in the ink. In this case, by adjusting the heights of the resistant walls (111) to control capabilities of introducing the solid ingredient (150), it becomes possible to dispense desired amounts of the solid ingredient (150) to the respective pressure chamber (211).

Abstract: A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

Abstract: A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

Abstract: A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

Abstract: A semiconductor element is provided that includes a semiconductor substrate, a circuit element disposed on the substrate, and a through-hole formed in the substrate having a stripe-like concavo-convex structure on its sidewall with stripes formed in the direction of the thickness of the semiconductor substrate.

Abstract: An electrode on a first surface of a semiconductor substrate and a second surface of the semiconductor substrate are connected with each other by a through electrode. A through hole is formed through the semiconductor substrate from the second surface of the semiconductor substrate to an interlayer insulating film on the first surface, and an insulating film is formed on a side surface and a bottom surface of the through hole as well as on the second surface of the semiconductor substrate, so that by simultaneously etching the insulating film on the bottom surface of the through hole and the interlayer insulating film, thus formed, the through hole is formed so as to reach the electrode on the first surface of the semiconductor substrate.

Abstract: Silicon carbide-based fine particles containing an electrically conducting inorganic substance and a electromagnetic wave absorbing material, which are fine particles comprising a particle inner portion of a silicon carbide-based material and a surface layer formed of an electrically conducting inorganic substance mainly comprising carbon, wherein a gradient layer with the compositional ratio of the electrically conducting inorganic substance gradiently increasing toward the particle surface is present and the thickness of the electrically conducting inorganic substance gradient layer is from 1 to 500 nm. The electromagnetic wave absorbing material of the present invention can selectively absorb a electromagnetic wave of 1 to 300 GHz in a wide band.

Abstract: A semiconductor element is provided that includes a semiconductor substrate, a circuit element disposed on the substrate, and a through-hole formed in the substrate having a stripe-like concavo-convex structure on its sidewall with stripes formed in the direction of the thickness of the semiconductor substrate.

Abstract: Silicon carbide-based fine particles containing an electrically conducting inorganic substance and a electromagnetic wave absorbing material, which are fine particles comprising a particle inner portion of a silicon carbide-based material and a surface layer formed of an electrically conducting inorganic substance mainly comprising carbon, wherein a gradient layer with the compositional ratio of the electrically conducting inorganic substance gradiently increasing toward the particle surface is present and the thickness of the electrically conducting inorganic substance gradient layer is from 1 to 500 nm. The electromagnetic wave absorbing material of the present invention can selectively absorb a electromagnetic wave of 1 to 300 GHz in a wide band.

Abstract: Resin tubes having thick walled portions and thin walled portions are formed by providing a specially configured orifice on an extruder and varying the rate at which the extruded resin tube is pulled from the extruder. The orifice is shaped to form a thin tubular opening and a thick tubular opening communicating with one another, the thick tubular opening being adjacent and down-stream of the thin opening. When the extruded resin tube is pulled at a high speed the thin tubular opening is filled with resin that passes through but does not fill the thick tubular opening. At the slow pulling speed the resin fills at least the open-end portion of the thick tubular opening thereby forming a thick walled portion of the resin tube.

Abstract: In a process for forming a resin body, the thickness of the body is altered by altering the feed rate of raw material to an extruder and the screw rate of the extruder screw in such a relationship to alter the quantity extrusion rate without altering the amount of resin within the extruder.

Abstract: Resin tubes having thick walled portions and thin walled portions are formed by providing a specially configured orifice on an extruder and varying the rate at which the extruded resin tube is pulled from the extruder. The orifice is shaped to form a thin tubular opening and a thick tubular opening communicating with one another, the thick tubular opening being adjacent and down-stream of the thin opening. When the extruded resin tube is pulled at a high speed the thin tubular opening is filled with resin that passes through but does not fill the thick tubular opening. At the slow pulling speed the resin fills at least the open-end portion of the thick tubular opening thereby forming a thick walled portion of the resin tube.