Patents by Inventor Takeshi Kodai

Takeshi Kodai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220135265
    Abstract: Provided is a film thermoforming device of a blister packaging machine in which molding can be carried out without extreme reduction in a sheet thickness of a top surface portion of a pocket, and without warpage, which allows stacking, and stable molding can be performed at a high rate. This film thermoforming device comprises a compressed air blowing mechanism that is disposed at a forming mold 5A and that has a compressed air blowing pore 53a which is open at an inner bottom portion of a pocket hole 52 of the forming mold 5A, and a compressed air blowing pore 53b which is open around the pocket hole 52 of the forming mold 5A.
    Type: Application
    Filed: March 13, 2019
    Publication date: May 5, 2022
    Inventors: Takeshi KODAI, Kensuke IKEUCHI
  • Patent number: 10420704
    Abstract: A PTP sheet for pharmaceutical packaging has a first sheet in which pockets each capable of housing a solid pharmaceutical are projected to the side of a first surface which is one of a back surface and a front surface and a second sheet which is pasted to a second surface opposite to the first surface in the first sheet and covers an opening of the pocket. The second sheet has a first region having mesh-shaped grooves having a first depth in a third surface opposite to the surface to be pasted to the second surface and a second region having mesh-shaped grooves having a second depth smaller than the first depth or not having a groove.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: September 24, 2019
    Assignee: Nipro Corporation
    Inventors: Kazuaki Uetake, Takeshi Kodai
  • Patent number: 6748721
    Abstract: The present provides a thermoforming system for film on blister packing machines that forms pockets without any extreme reduction of thickness of the sheet at the top face portion of the pocket and enables sheets to be placed one upon another without warping. The thermoforming system for film for blister packaging machines pinches and heats a film, fed intermittently in synchronization with an open/close drive of a pair of dies on a thermoforming system, between the dies of the thermoforming system, and partially extends the heated film along an inner circumferential face of the pocket holes of the forming die to form pockets. The dies of the thermoforming system are constructed with a forming die provided with pocket holes, a heating die provided with a plugs for locally heating only the pocket forming portion of the film F disposed facing the pocket holes of the forming die, and injecting mechanisms that inject compressed air disposed on the forming die side and the heating die side, respectively.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: June 15, 2004
    Assignee: Mutual Corporation
    Inventor: Takeshi Kodai
  • Publication number: 20030051443
    Abstract: The present invention, intended for providing a thermoforming system for film on blister packing machines realized in such a way as to form pockets without any extreme reduction of thickness of the sheet at the top face portion of the pocket, and enable to place the sheets one upon another without warping, is a thermoforming system for film for blister packaging machines, realized in such a way as to pinch and heat a film F, fed intermittently in synchronization with the open/close drive of the dies 5A, 5B on a thermoforming system, between the dies 5A, 5B of the thermoforming system, and partially extend said heated film F along the inner circumferential face of the pocket holes 52 of the forming die 5A to form pockets, characterized in that the dies of the thermoforming system are constructed with a forming die 5A provided with pocket holes 52, a heating die 5B provided with a plug 58 for locally heating only the pocket forming portion of the film F disposed facing the pocket hole 52 of the forming die 5A,
    Type: Application
    Filed: August 30, 2002
    Publication date: March 20, 2003
    Inventor: Takeshi Kodai