Patents by Inventor Takeshi Kusagaya

Takeshi Kusagaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7604755
    Abstract: An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: October 20, 2009
    Assignee: Japan Composite Co., Ltd.
    Inventors: Hiroya Okumura, Keizo Kimura, Shinji Tachibana, Takeshi Kusagaya
  • Publication number: 20060240303
    Abstract: An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.
    Type: Application
    Filed: February 13, 2004
    Publication date: October 26, 2006
    Applicant: JAPAN COMPOSITE CO., LTD.
    Inventors: Hiroya Okumura, Keizo Kimura, Shinji Tachibana, Takeshi Kusagaya