Abstract: An ultrasound elasticity imaging apparatus includes an elastic data processing section which processes a received signal detected by an ultrasound probe and generates elastic frame data, a display evaluation section which evaluates a display value of the elastic frame data based on various data in the generation of the elastic frame data, a display processing section which performs image processing of the elastic frame data according to the evaluation result by the display evaluation section, and a display section which displays an elastic image based on the elastic frame data processed by the image processing section.

Abstract: An information processing system providing a composed service to a user device is provided. The system includes: a service acquisition unit configured to acquire descriptions defining raw services; a capability information acquisition unit configured to acquire capability information; a composition unit configured to compose the acquired descriptions to create a description which defines a composed service to be supported by the user device based on the acquired capability information; a presentation unit configured to present the created description to the user device; a request acquisition unit configured to acquire a request for the composed service from the user device; a specifying unit configured to specify raw services composing the requested composed service; a processing unit configured to gather responses from the specified raw services composing the requested composed service, and to create the composite response; and a response unit configured to respond the composite response to the user device.

Abstract: To carry out objective or definitive diagnosis on the basis of an elastic image regardless of experience and proficiency, a method of displaying an elastic image includes the steps of measuring ultrasound cross-section data of a cross-section region of a subject by applying pressuring to the subject, determining a physical value correlating with the elasticity of tissue in the cross-section region on the basis of the ultrasound cross-section data, generating an elastic image of the cross-section region on the basis of the physical value and displaying the elastic image on a display device, determine compression state information relating to the compression state of the cross-section region on the basis of the pressure applied to the subject, and displaying the compression state information together with the elastic image on the display device.

Abstract: The present invention generally relates to a gateway, a method for controlling the gateway, an application server, and a method for controlling the application server. The present invention particularly relates, but is not limited to, a technology that facilitates the formation of a single network from a plurality of local networks.

Abstract: A driving model generation device is provided that enables driving evaluation according to a traveling situation of a vehicle. A vehicle is provided with a vehicle state detector, which detects a vehicle state quantity that changes according to a driving operation by a driver. A model generator generates a driving model, which is a reference related to a specific driving operation, based on the vehicle state quantity at the time the driver starts the specific driving operation and the vehicle state quantity at the time the specific driving operation is finished. A driving evaluator evaluates the driving skill of the driver by comparing the driving operation of the driver presented by a detection result of the vehicle state detector to the driving model generated by the model generator.

Abstract: Disclosed is a drive assistance device capable of performing proper drive assistance by reducing unnecessary drive assistance operations. The drive assistance device performs drive assistance relative to stopping of a vehicle at an intersection. When the vehicle approaches the intersection where an arrow lamp device is installed at a traffic signal, if the necessity of drive assistance for stimulating a driver to stop at the signal according to lighting of the arrow lamp device differs depending on a route of the vehicle, the start timing of the drive assistance operation is delayed and drive assistance is executed. Therefore, an unnecessary drive assistance operation can be suppressed.

Abstract: A system for providing a user terminal with configurations of a local network is provided. The system includes an obtaining unit configured to obtain the configurations of the local network and a telephone number corresponding to the local network, a storage unit configured to store the obtained configurations and the obtained telephone number such that the obtained configurations and the obtained telephone number are associated with each other, a receiving unit configured to receive a request for the configurations from the user terminal, the request comprising the telephone number corresponding to the local network, a retrieving unit configured to retrieve the configurations associated with the received telephone number from the storage unit, and a response unit configured to respond the retrieved configurations to the user terminal.

Abstract: The invention was made to simplify the operation relating to the detection of an absolute pressure applied to a test body by an ultrasonic probe and thereby to enhance usability.

Abstract: An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer.

Abstract: The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.

Abstract: In order to provide a thermally-detachable sheet that detaches at higher temperatures, this thermally-detachable sheet has a shear bond strength with respect to a silicon wafer of 0.25 kg/5×5 mm or larger, at a temperature of 200° C., after said temperature has been maintained for one minute, and a shear bond strength with respect to a silicon wafer of 0.25 kg/less than 5×5 mm at any temperature in a range of over 200° C. to not more than 500° C., after said temperature has been maintained for three minutes.

Abstract: In an in-vehicle device which is carried on an automotive vehicle, an operation unit causes the vehicle to execute a predetermined operation in response to a remote control request from a user. A detection unit detects existence of a moving object in a passenger compartment of the vehicle or in areas surrounding the vehicle. An operation inhibition unit inhibits execution of the predetermined operation by the operation unit when existence of the moving object is detected by the detection unit.

Abstract: The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.

Abstract: A Femto base station which is arranged to connect to a wireless communication network and to generate a first cell for providing a wireless communication service to at least one user equipment existing within a coverage area of the first cell, comprising a transceiver comprising a transmitter and a receiver for the wireless communication with the user equipment and a controller, wherein the controller determines whether the Femto base station has entered an energy-saving mode or not, the controller disables the operation of the transmitter when it is determined that the base station has entered the energy-saving mode, and when the receiver detects a data transmission from the user equipment to a macro base station after disabling the operation of the transmitter, the controller reconfigures the transmitter. The macro base station generates a second cell with a broader coverage than the first cell and including the first cell.

Abstract: An object of embodiments of the present invention is to establish a secure connection from a device to a private network, to which the device belongs, when the device may be located remotely from the private network. This is achieved by locating a server in the private network while reusing existing authorization mechanisms in the network. A target resource is in this private network and a device located outside the private network can access the target resource by using the server and a proxy agent which intermediates a request from the device by using a one time session URL.

Abstract: A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.

Abstract: The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device.

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment.

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm.

Abstract: A pressing device for smoothly performing pressing operation, an ultrasonic probe, and an ultrasonic diagnostic apparatus are provided. The pressing device has a balloon installed on an ultrasonic transmission/reception surface of an ultrasonic probe and presses an object to be examined by the balloon. The balloon has a hollow pressing unit made of an elastic material, a tube for charging/discharging liquid to/from the pressing unit, and an attachment part contiguous to the peripheral edge of the pressing unit and attaching the pressing unit to the ultrasonic transmission/reception unit of the ultrasonic probe. The inner diameter of the attachment part or the pressing unit is set smaller than the outer diameter of the part of the ultrasonic probe on which the attachment part is attached. Because tension is applied to the pressing unit, pressing operation can be started with a less amount of initial injection, and this makes the pressing operation smooth.