Abstract: A lighting system has light-emitting diodes as light sources mounted on a circuit board, in which the light-emitting diodes include a red light-emitting diode, blue light-emitting diode and a green light-emitting diode, the light-emitting diodes are constituted of one single unit including one for each of the red, blue and green light-emitting diodes, and the one single unit is repeatedly arranged as plural pieces on the same circuit board, and each of the red, blue and green light-emitting diodes is individually connected electrically to emit a light.

Abstract: A liquid crystal display has a liquid crystal panel, a gate chip on film (COF) disposed at a side of a side surface of the liquid crystal panel, side-edge-type backlights having a light emitting diode disposed on left and right side surfaces of the liquid crystal panel, and a cover and a frame that hold the liquid crystal panel and the backlights, the frame has an opening disposed at a position corresponding to the position of the gate COF into which the gate COF is inserted, and a lid for covering the gate COF inserted in the opening is connected to the frame in such a manner that the lid is capable of being opened and closed.

Abstract: There is provided a slim liquid crystal display unit having a large screen by providing a slim structure capable of sufficiently radiating the heat from a light source. The liquid crystal display unit according to the present invention includes: a liquid crystal panel; an optical guiding board installed on a rear face thereof; a pair of light source-mounted substrate disposed, opposing right and left side faces thereof; a light source mounted on the light source-mounted substrate; a metal frame connected on the opposite side to the optical guiding board of the light source-mounted substrate; a chassis member for supporting the optical guiding board and a reflection sheet group; and a thermal diffusion member fixed onto the metal frame along with the chassis member. The chassis member has a stepped portion in the vicinity of the light source. Between the stepped portion and the reflection sheet group, a thermal insulation member is attached.

Abstract: The present invention provides a simply usable shield cover capable of enhancing the mechanical strength of a set even if a display device is decreased in thickness. In a video display apparatus including a base chassis on a front surface of which a displaying member is arranged and on a back surface of which a unit for driving and controlling the display device is arranged, and a plurality of frames arranged on the back surface of the base chassis in parallel with each other, a shield cover is attached to the plurality of frames to extend over those to form a crosslink structure.

Abstract: There is provided a slim liquid crystal display unit having a large screen by providing a slim structure capable of sufficiently radiating the heat from a light source. The liquid crystal display unit according to the present invention includes: a liquid crystal panel; an optical guiding board installed on a rear face thereof; a pair of light source-mounted substrate disposed, opposing right and left side faces thereof; a light source mounted on the light source-mounted substrate; a metal frame connected on the opposite side to the optical guiding board of the light source-mounted substrate; a chassis member for supporting the optical guiding board and a reflection sheet group; and a thermal diffusion member fixed onto the metal frame along with the chassis member. The chassis member has a stepped portion in the vicinity of the light source. Between the stepped portion and the reflection sheet group, a thermal insulation member is attached.

Abstract: A liquid crystal display has a liquid crystal panel, a gate chip on film (COF) disposed at a side of a side surface of the liquid crystal panel, side-edge-type backlights having a light emitting diode disposed on left and right side surfaces of the liquid crystal panel, and a cover and a frame that hold the liquid crystal panel and the backlights, the frame has an opening disposed at a position corresponding to the position of the gate COF into which the gate COF is inserted, and a lid for covering the gate COF inserted in the opening is connected to the frame in such a manner that the lid is capable of being opened and closed.

Abstract: A lighting system has light-emitting diodes as light sources mounted on a circuit board, in which the light-emitting diodes include a red light-emitting diode, blue light-emitting diode and a green light-emitting diode, the light-emitting diodes are constituted of one single unit including one for each of the red, blue and green light-emitting diodes, and the one single unit is repeatedly arranged as plural pieces on the same circuit board, and each of the red, blue and green light-emitting diodes is individually connected electrically to emit a light.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

Abstract: A solder-removing apparatus includes a heating portion for heating the object having the solder adhered thereto, a measuring portion for measuring the distance from the measuring portion to the object, a solder-drawing portion for drawing the molten solder on the object by suction, an X-Y moving portion for moving the object in an X-direction or a Y-direction, a Z moving portion for moving the object relative to the solder-drawing portion in a Z-direction, and a control portion for controlling the X-Y moving portion and the Z moving portion. During the time when the molten solder on the object is drawn by the solder-drawing portion, the control portion causes the X-Y moving portion to move the object, and also causes the Z moving portion to move the object relative to the solder-drawing portion in accordance with the distance, measured by the measuring portion, so that the distance between the solder-drawing portion and the object can be kept constant.

Abstract: A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.