Patents by Inventor Takeshi MINAMIRU
Takeshi MINAMIRU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210320479Abstract: A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.Type: ApplicationFiled: June 23, 2021Publication date: October 14, 2021Applicant: FUJIFILM BUSINESS INNOVATION CORP.Inventors: Takashi KONDO, Satoshi INADA, Takeshi MINAMIRU, Daisuke IGUCHI, Kazuhiro SAKAI, Tomoaki SAKITA, Michiaki MURATA
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Publication number: 20210313762Abstract: A light-emitting device includes: a wiring substrate; a base member that is mounted on the wiring substrate; a light source that is mounted on the base member; a drive unit that is mounted on the wiring substrate and drives the light source; a wiring pattern that is on the wiring substrate, is connected to the light source and extends from a back surface side of the base member toward the drive unit; and a circuit element that is provided in a region on the base member between the light source and the drive unit, the region overlapping the wiring pattern in a plan view.Type: ApplicationFiled: June 21, 2021Publication date: October 7, 2021Applicant: FUJIFILM BUSINESS INNOVATION CORP.Inventors: Takeshi MINAMIRU, Kazuhiro SAKAI, Daisuke IGUCHI
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Publication number: 20210313776Abstract: A light-emission device includes: a first light emitting element chip; a second light emitting element chip having a light output higher than a light output of the first light emitting element chip, the second light emitting element chip being configured to be driven independently from the first light emitting element chip and arranged side by side with the first light emitting element chip; and a light diffusion member including a first region provided on an emission path of the first light emitting element chip and a second region provided on an emission path of the second light emitting element chip, and having a diffusion angle at the second region larger than a diffusion angle at the first region.Type: ApplicationFiled: June 22, 2021Publication date: October 7, 2021Applicant: FUJIFILM BUSINESS INNOVATION CORP.Inventors: Takeshi MINAMIRU, Kenichi ONO, Satoshi INADA, Michiaki MURATA
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Publication number: 20210305773Abstract: A light-emitting device is provided with a light source and a controller. The light source includes multiple light-emitting elements and multiple driving elements that are provided in correspondence with the light-emitting elements and drive the light-emitting elements to light up by going to an ON state. The controller controls a switching between a successive lighting operation that causes the light-emitting elements to light up successively and a simultaneous lighting operation that causes the light-emitting elements to light up simultaneously in parallel. The light source includes a power supply line set to a reference potential or a power supply potential, a driving signal line that is connected to the power supply line and that supplies a driving signal to the driving elements, and a lighting signal line that supplies a lighting signal for causing the light-emitting elements to light up.Type: ApplicationFiled: December 13, 2020Publication date: September 30, 2021Applicant: FUJIFILM Business Innovation Corp.Inventors: Takashi KONDO, Satoshi INADA, Junichiro HAYAKAWA, Takeshi MINAMIRU, Takafumi HIGUCHI
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Publication number: 20210305774Abstract: A light-emitting device includes a laser element array having a quadrangular planar shape, a pair of capacitors that supply an electric current for light emission of the laser element array, and a driving unit that drives the laser element array by turning on and off the electric current for light emission of the laser element array. The pair of capacitors are disposed beside two sides of the laser element array that face each other so as to sandwich the laser element array, and the driving unit is disposed beside another side of the laser element array.Type: ApplicationFiled: December 2, 2020Publication date: September 30, 2021Applicant: FUJIFILM BUSINESS INNOVATION CORP.Inventors: Daisuke IGUCHI, Kazuhiro SAKAI, Takeshi MINAMIRU
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Publication number: 20210288193Abstract: An optical semiconductor element includes: a semiconductor substrate that is semi-insulating; a columnar body that is formed on a front surface-side of the semiconductor substrate and configured to emit or receive light from the front surface-side; a front surface-side electrode that is connected to the columnar body; a back surface-side electrode formed on a back surface-side of the semiconductor substrate; and an electrically conductive member that is formed to penetrate through the semiconductor substrate to connect the front surface-electrode and the back surface-side electrode, and has a protruding portion protruding on the front surface-side of the semiconductor substrate.Type: ApplicationFiled: June 1, 2021Publication date: September 16, 2021Applicant: FUJIFILM Business Innovation Corp.Inventors: Satoshi INADA, Kenichi ONO, Takeshi MINAMIRU, Akemi MURAKAMI, Junichiro HAYAKAWA, Tsutomu OTSUKA
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Light-emitting device, optical apparatus, optical measurement apparatus, and image forming apparatus
Patent number: 11050217Abstract: A light-emitting device includes a light-emitting unit. The light-emitting unit includes an array of multiple light-emitting element groups, each including multiple light-emitting elements. In the light-emitting unit, the multiple light-emitting element groups are sequentially driven along the array such that, for each of the multiple light-emitting element groups, the multiple light-emitting elements included in the light-emitting element group are concurrently set to a state of emitting light or a state of not emitting light.Type: GrantFiled: August 21, 2019Date of Patent: June 29, 2021Assignee: FUJIFILM Business Innovation Corp.Inventors: Takashi Kondo, Tsutomu Otsuka, Takeshi Minamiru, Kazuhiro Sakai -
LIGHT-EMITTING DEVICE, OPTICAL APPARATUS, OPTICAL MEASUREMENT APPARATUS, AND IMAGE FORMING APPARATUS
Publication number: 20210091535Abstract: A light-emitting device includes a light-emitting unit. The light-emitting unit includes an array of multiple light-emitting element groups, each including multiple light-emitting elements. In the light-emitting unit, the multiple light-emitting element groups are sequentially driven along the array such that, for each of the multiple light-emitting element groups, the multiple light-emitting elements included in the light-emitting element group are concurrently set to a state of emitting light or a state of not emitting light.Type: ApplicationFiled: December 9, 2020Publication date: March 25, 2021Applicant: FUJI XEROX CO., LTD.Inventors: Takashi KONDO, Tsutomu OTSUKA, Takeshi MINAMIRU, Kazuhiro SAKAI -
Publication number: 20200328576Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.Type: ApplicationFiled: December 18, 2019Publication date: October 15, 2020Applicant: FUJI XEROX CO., LTD.Inventors: Kazuhiro SAKAI, Daisuke IGUCHI, Takeshi MINAMIRU, Yoshinori SHIRAKAWA, Tomoaki SAKITA, Tsutomu OTSUKA
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Publication number: 20200285723Abstract: A light-emitting device includes a light diffusing member that diffuses light emitted from a light source so that an object to be measured is irradiated with the light; and a holding unit that is provided on plural wires connected to the light source and holds the light diffusing member.Type: ApplicationFiled: December 12, 2019Publication date: September 10, 2020Applicant: FUJI XEROX CO., LTD.Inventors: Kenichi ONO, Takeshi MINAMIRU, Satoshi INADA, Takafumi HIGUCHI, Tsutomu OTSUKA
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Publication number: 20200285833Abstract: A light-emitting device includes a light diffusing member that diffuses light emitted from a light source so that an object to be measured is irradiated with the light; and a holding unit that holds the light diffusing member and is provided on a wire connected to the light source so as to be located in an uncoated region of the wire.Type: ApplicationFiled: December 9, 2019Publication date: September 10, 2020Applicant: FUJI XEROX CO., LTD.Inventors: Takeshi MINAMIRU, Satoshi INADA, Kenichi ONO, Takafumi HIGUCHI, Tsutomu OTSUKA
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Publication number: 20200274320Abstract: A light emitter includes: a substrate; a capacitor provided on the substrate; a light source that is provided on the substrate and to which a driving current from electric charges accumulated in the capacitor is supplied; a cover section through which light emitted from the light source is transmitted and that is disposed in an optical axial direction of the light source; and a support section that is provided on a part of the substrate excluding a part between the capacitor and the light source and supports the cover section.Type: ApplicationFiled: July 16, 2019Publication date: August 27, 2020Applicant: FUJI XEROX CO., LTD.Inventors: Satoshi Inada, Kenichi Ono, Takeshi Minamiru, Tsutomu Otsuka, Takafumi Higuchi
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Publication number: 20200271760Abstract: A light emitter includes: a substrate; a driving section provided on the substrate; a light source that is provided on the substrate and is driven by the driving section; a cover section through which light emitted from the light source is transmitted and that is disposed in an optical axial direction of the light source; and a support section that is provided on a part of the substrate excluding a part between the driving section and the light source and supports the cover section.Type: ApplicationFiled: July 15, 2019Publication date: August 27, 2020Applicant: FUJI XEROX CO., LTD.Inventors: Satoshi INADA, Kenichi ONO, Takeshi MINAMIRU, Michiaki MURATA, Takafumi HIGUCHI
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Publication number: 20200249320Abstract: Provided is a light emitting device including: a base material mounted on a wiring substrate; a light emitting element array provided on the base material; a first conductive pattern provided on the surface of the base material, the first conductive pattern including a first facing region connected to the light emitting element array, the first facing region being along a side surface of the light emitting element array and facing to the light emitting element array, and a first extending region extended beyond the first facing region; and penetrating members penetrating the base material from the first conductive pattern to a back surface side of the base material, each penetrating member being connected to the first facing region or the first extending region.Type: ApplicationFiled: July 15, 2019Publication date: August 6, 2020Applicant: FUJI XEROX CO., LTD.Inventors: Tomoaki SAKITA, Satoshi INADA, Takeshi MINAMIRU, Daisuke IGUCHI, Kazuhiro SAKAI, Yoshinori SHIRAKAWA
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LIGHT-EMITTING DEVICE, OPTICAL APPARATUS, OPTICAL MEASUREMENT APPARATUS, AND IMAGE FORMING APPARATUS
Publication number: 20200244039Abstract: A light-emitting device includes a light-emitting unit. The light-emitting unit includes an array of multiple light-emitting element groups, each including multiple light-emitting elements. In the light-emitting unit, the multiple light-emitting element groups are sequentially driven along the array such that, for each of the multiple light-emitting element groups, the multiple light-emitting elements included in the light-emitting element group are concurrently set to a state of emitting light or a state of not emitting light.Type: ApplicationFiled: August 21, 2019Publication date: July 30, 2020Applicant: FUJI XEROX CO., LTD.Inventors: Takashi KONDO, Tsutomu OTSUKA, Takeshi MINAMIRU, Kazuhiro SAKAI -
Patent number: 9673351Abstract: A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the substrate as defined herein, and in manufacturing conditions in which a variation range of a top section of the cutting member having a tapered tip end shape with no top face in the groove width direction changes from a range included in the groove on the front face side to a range away from the groove on the front face side as wear of the cutting member advances, the use of the cutting member is stopped before the variation range changes from the range included in the groove on the front face side to the range away from the groove on the front face side.Type: GrantFiled: June 2, 2016Date of Patent: June 6, 2017Assignee: FUJI XEROX CO., LTD.Inventors: Takeshi Minamiru, Michiaki Murata, Kenji Yamazaki, Tsutomu Otsuka
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Patent number: 9633888Abstract: Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.Type: GrantFiled: February 17, 2016Date of Patent: April 25, 2017Assignee: FUJI XEROX CO., LTD.Inventors: Saori Nishizaki, Tomoki Umezawa, Hirokazu Matsuzaki, Takeshi Minamiru, Tatsumi Inomoto, Eitoku Sonoda, Kenji Yamazaki
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Patent number: 9508595Abstract: A design method includes a process of preparing plural cutting members having different degrees of taper in a tip portion thereof, a process of preparing plural grooves on a front surface side having the same shape, a process of confirming a breakage status when a groove on a rear surface side is formed by the plural cutting members, and a process of selecting, when it is confirmed that both of a cutting member that causes breakage and a cutting member that does not cause the breakage are included, the degree of taper of the cutting member that does not cause the breakage as a tip shape of a cutting member to be used in a mass production process.Type: GrantFiled: October 30, 2015Date of Patent: November 29, 2016Assignee: FUJI XEROX CO., LTD.Inventors: Takeshi Minamiru, Hiroaki Tezuka, Michiaki Murata, Kenji Yamazaki, Tsutomu Otsuka, Shuichi Yamada, Kenichi Ono
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Publication number: 20160293463Abstract: Provided is a semiconductor manufacturing device including an expanding unit that expands a holding member having an adhesive layer on which a substrate in a state of being diced into plural semiconductor chips is held, a detection unit that detects an adhesive state between one of the semiconductor chips and the holding member, in a state in which the holding member is expanded, and a pickup unit that picks up the semiconductor chip by changing an operation relevant to pickup of the semiconductor chip based on the detected adhesive state.Type: ApplicationFiled: February 17, 2016Publication date: October 6, 2016Applicant: FUJI XEROX CO., LTD.Inventors: Saori NISHIZAKI, Tomoki UMEZAWA, Hirokazu MATSUZAKI, Takeshi MINAMIRU, Tatsumi INOMOTO, Eitoku SONODA, Kenji YAMAZAKI
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Publication number: 20160276525Abstract: A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the substrate as defined herein, and in manufacturing conditions in which a variation range of a top section of the cutting member having a tapered tip end shape with no top face in the groove width direction changes from a range included in the groove on the front face side to a range away from the groove on the front face side as wear of the cutting member advances, the use of the cutting member is stopped before the variation range changes from the range included in the groove on the front face side to the range away from the groove on the front face side.Type: ApplicationFiled: June 2, 2016Publication date: September 22, 2016Applicant: FUJI XEROX CO., LTD.Inventors: Takeshi MINAMIRU, Michiaki MURATA, Kenji YAMAZAKI, Tsutomu OTSUKA