Patents by Inventor Takeshi Moribayashi

Takeshi Moribayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging bag and method of using packing structure
    Patent number: 10703542
    Abstract: A large packaging bag includes a packaging bag body. The packaging bag body has a bag opening. The large packaging bag also includes an exposed zipper profile part. The exposed zipper profile part has a female engaging surface. The engaging surface is exposed outside when the bag opening is closed.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: July 7, 2020
    Assignee: JVCKENWOOD Corporation
    Inventor: Takeshi Moribayashi
  • PACKAGING BAG AND METHOD OF USING PACKING STRUCTURE
    Publication number: 20190127118
    Abstract: A large packaging bag includes a packaging bag body. The packaging bag body has a bag opening. The large packaging bag also includes an exposed zipper profile part. The exposed zipper profile part has a female engaging surface. The engaging surface is exposed outside when the bag opening is closed.
    Type: Application
    Filed: October 18, 2018
    Publication date: May 2, 2019
    Inventor: Takeshi MORIBAYASHI
  • Heat dissipating structure and electronic device
    Patent number: 10271419
    Abstract: A heat dissipating structure includes an integrated circuit; a bracket; a heat sink; a housing; a first fastening member that is inserted into a first fastening hole provided to the bracket, and is inserted into a fastening hole provided to the heat sink, and that assembles the integrated circuit to the bracket and the heat sink, while a surface of the integrated circuit contacts with the bracket, and another surface contacts with the heat sink; and a second fastening member that is inserted into a second fastening hole provided to the bracket, and into a fastening hole provided to the housing, and assembles the bracket to the housing. The heat sink includes one surface that contacts with the housing, the one surface being on a side opposite to a surface contact with the integrated circuit, and the one first fastening member is positioned spaced from the housing.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: April 23, 2019
    Assignees: JVC KENWOOD CORPORATION, DENSO CORPORATION
    Inventors: Takeshi Moribayashi, Tatsuo Saito, Kazuaki Yanagimura, Hiromi Sekito
  • HEAT DISSIPATING STRUCTURE AND ELECTRONIC DEVICE
    Publication number: 20180035530
    Abstract: A heat dissipating structure includes an integrated circuit; a bracket; a heat sink; a housing; a first fastening member that is inserted into a first fastening hole provided to the bracket, and is inserted into a fastening hole provided to the heat sink, and that assembles the integrated circuit to the bracket and the heat sink, while a surface of the integrated circuit contacts with the bracket, and another surface contacts with the heat sink; and a second fastening member that is inserted into a second fastening hole provided to the bracket, and into a fastening hole provided to the housing, and assembles the bracket to the housing. The heat sink includes one surface that contacts with the housing, the one surface being on a side opposite to a surface contact with the integrated circuit, and the one first fastening member is positioned spaced from the housing.
    Type: Application
    Filed: July 26, 2017
    Publication date: February 1, 2018
    Inventors: Takeshi Moribayashi, Tatsuo Saito, Kazuaki Yanagimura, Hiromi Sekito