Abstract: A structural body (2, 2A to 2E) according to the present disclosure includes a base (10, 10D, 10E), a first electrode layer (111), a second electrode layer (112), a first via conductor (131), a second via conductor (132), and a connection conductor (133). The base (10, 10D, 10E) is composed of a ceramic. The first electrode layer (111) and the second electrode layer (112) are located inside the base (10, 10D, 10E). The first via conductor (131) and the second via conductor (132) are located inside the base (10, 10D, 10E) and connect the first electrode layer (111) and the second electrode layer (112). The connection conductor is located inside the base (10, 10D, 10E), and connects the first via conductor and the second via conductor.

Abstract: A planar coil (10) of the present disclosure includes a base (1) including a first surface (1a), a metal layer (2) located on the first surface (1a) and including a through hole (2a) and a plurality of voids (3), and a first fixing tool (8) inserted through the through hole (2a) and fixing the metal layer (2) to the first surface (1a) side of the base (1).

Abstract: A heater includes a base, a resistive heating body, and a terminal portion. The base is formed of ceramic and has a plate shape. The resistive heating body is located in the base. The terminal portion is electrically connected to the resistive heating body. The base includes a protruding portion surrounding the terminal portion, on a lower surface side. The protruding portion is formed of a ceramic member, and the terminal portion passes through a through hole formed in the ceramic member. The ceramic member is bonded to at least one of the lower surface of the base or the terminal portion.

Abstract: A heat exchanger includes a plurality of first members, and a plurality of second members located between adjacent first members of the plurality of first members. The plurality of first members each include a plurality of openings and a first flow path connected to the plurality of openings. The plurality of second members each include a second flow path connected to the openings of the adjacent first members. The plurality of openings and the first flow path of the first member, and the second flow path of the second member define a flow path for a first fluid. A region between the adjacent first members defines a flow path for a second fluid. The heat exchanger further includes a third member extending toward the region on the first member.

Abstract: In a manufacturing method for a member for a semiconductor manufacturing device, a metal terminal and a ceramic member are joined by using a paste that contains a resin and a metal particle(s), and a metal fine particle(s) that has/have a particle size(s) of 100 nm or less in the metal particle(s) account(s) for 1% by mass or more of 100% by mass of the metal particle(s). A member for a semiconductor manufacturing device includes a metal terminal, a ceramic member, and a joining part that connects the metal terminal and the ceramic member. The joining part contains a metal particle(s).

Abstract: A planar coil (10) of the present disclosure includes a base (1) having a first surface (1a) and including a magnet material, and a first metal layer (2a) located on the first surface (1a) and having voids (3).

Abstract: A circuit base of the present disclosure includes a base made of ceramic, a joint layer located on the base, and a metal layer located on the joint layer. The metal layer contains copper. The joint layer contains aluminum, silicon, and oxygen.

Abstract: A heat dissipation member according to the present disclosure includes a first wall part with insulating properties; a second wall part located opposite the first wall part; a third wall part located between the first wall part and the second wall part; a flow path surrounded by the first wall part, the second wall part, and the third wall part; a conductive layer located on an outer surface of the first wall part; and a first metal layer located on an inner surface of the first wall part, the first metal layer including gaps. Furthermore, an electronic device of the present disclosure includes the heat dissipation member with the configuration described above and an electronic component located on the conductive layer of the heat dissipation member.

Abstract: A heater according to the present disclosure includes: a substrate (1) that includes a first surface, the substrate being made of a ceramic; and a first electric conductor (2a) that is arranged on the first surface, the first electric conductor including gaps (9).

Abstract: A heater includes a base body and an internal conductor. The base body is made of ceramic. The internal conductor is located inside the base body and includes a connection portion. The base body includes a space extending from the connection portion to a lower surface of the base body. The space includes a first space and a second space. The first space contacts with the connection portion. The second space connects the first space and an outer side of the lower surface of the base body, and is smaller than the first space in a planar perspective of the lower surface of the base body.

Abstract: A planar coil in the present disclosure includes a substrate that is composed of a ceramic(s) and includes a first surface, and a first metal layer that is positioned on the first surface and includes a void.

Abstract: A board-like structure includes a base body, an internal conductor, a connection conductor, and a terminal member. The base body is an insulating member including an upper surface and a lower surface on an opposite side to the upper surface. The internal conductor runs along the upper surface and the lower surface inside the base body. The connection conductor is connected to the internal conductor inside the base body. The terminal member is connected to the connection conductor inside the base body and is exposed to an external portion of the base body at the lower surface. The connection conductor is longer in length in a vertical direction than a thickness of the internal conductor in the vertical direction. In the terminal member, at least a side surface is connected to the side surface of the connection conductor.

Abstract: In a manufacturing method for a member for a semiconductor manufacturing device, a metal terminal and a ceramic member are joined by using a paste that contains a resin and a metal particle(s), and a metal fine particle(s) that has/have a particle size(s) of 100 nm or less in the metal particle(s) account(s) for 1% by mass or more of 100% by mass of the metal particle(s). A member for a semiconductor manufacturing device includes a metal terminal, a ceramic member, and a joining part that connects the metal terminal and the ceramic member. The joining part contains a metal particle(s).

Abstract: A heater system may include a ceramic heater and a drive device. The ceramic heater may include a ceramic substrate and a resistance heating element. The ceramic substrate may include an upper surface. The resistance heating element may extend in an internal portion or on a surface of the ceramic substrate along the upper surface of the ceramic substrate. The drive device may include a main driving part, which supplies the main power to the entirety of the resistance heating element, and an additional driving part, which supplies additional power to a divided region that is a portion of the resistance heating element, by superimposing it on the main power.

Abstract: A focus-ring conveying member includes a substrate; and a first electrode for electrostatic attraction arranged in the substrate. The plasma processing device according to the present disclosure includes the above-mentioned focus-ring conveying member; a pedestal including a placement surface on which an object to be treated is placed; a focus ring that is arranged to surround the placement surface; and a support member that supports the focus ring. The support member includes a second electrode for electrostatic attraction which is arranged in the support member.

Abstract: A semiconductor device may include a cooling unit, the cooling unit including a circuit unit, a first flow path member comprised of an insulating material, and a second flow path member comprised of an insulating material. The circuit unit may include a heat sink layer, a wiring layer, and a semiconductor element that is disposed between the heat sink layer and the wiring layer. The circuit unit is disposed between the first flow path member and the second flow path member. The wiring layer may face the first flow path member or the second flow path member.

Abstract: A heater includes a base body, a first resistance heating element, and a plurality of second resistance heating elements. The base body is an insulating member which includes a first surface and a second surface facing the first surface. The first resistance heating element extends along the first surface in an internal portion or on a surface of the base body. The second resistance heating elements are located on the first surface side or on the second surface side relative to the first resistance heating element and extend along the first surface in the internal portion or on the surface of the base body.

Abstract: A flow path member may include silicon nitride ceramics. The flow path member may have an inlet port, an outlet port, and a flow path connected to the inlet port and the outlet port inside the flow path member. A plurality of needle-shaped crystals may be arranged on a surface of the flow path where the needle-shaped crystals intersect each other.

Abstract: A heat exchanger includes a plurality of first members, and a plurality of second members located between adjacent first members of the plurality of first members. The plurality of first members each include a plurality of openings and a first flow path connected to the plurality of openings. The plurality of second members each include a second flow path connected to the openings of the adjacent first members. The plurality of openings and the first flow path of the first member, and the second flow path of the second member define a flow path for a first fluid. A region between the adjacent first members defines a flow path for a second fluid. The heat exchanger further includes a third member extending toward the region on the first member.

Abstract: A heater system may include a ceramic heater and a drive device. The ceramic heater may include a ceramic substrate and a resistance heating element. The ceramic substrate may include an upper surface. The resistance heating element may extend in an internal portion or on a surface of the ceramic substrate along the upper surface of the ceramic substrate. The drive device may include a main driving part, which supplies the main power to the entirety of the resistance heating element, and an additional driving part, which supplies additional power to a divided region that is a portion of the resistance heating element, by superimposing it on the main power.