Patents by Inventor Takeshi Nakao

Takeshi Nakao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6879225
    Abstract: A surface acoustic wave device includes a Y-cut, X-propagation LiTaO3 substrate, at least one interdigital transducer provided on the LiTaO3 substrate and made of Al or a metal containing Al as a major component, and an SiO2 film provided on the surface of the LiTaO3 substrate so as to cover the interdigital transducer, wherein the thickness Hs of the SiO2 film normalized by the wavelength ? of a surface acoustic wave and the cut angle ? of the LiTaO3 substrate are set to be in any one of the ranges represented by formulae (1) to (8): in the case of 0.00<Hs?0.05, 30°<?<36°??(1) in the case of 0.05<Hs?0.10, 29°<?<36°??(2) in the case of 0.10<Hs?0.15, 28°<?<36°??(3) in the case of 0.15<Hs?0.20, 27°<?<36°??(4) in the case of 0.20<Hs?0.25, 26°<?<36°??(5) in the case of 0.25<Hs?0.30, 25°<?<35°??(6) in the case of 0.30<Hs?0.35, 23°<?<34°??(7) in the case of 0.35<Hs?0.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: April 12, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Michio Kadota, Hideya Horiuchi, Takeshi Nakao, Yasuhiro Kuratani, Masakazu Mimura, Junya Ago
  • Patent number: 6865786
    Abstract: In a method of manufacturing a surface acoustic wave device using a Shear Horizontal type surface acoustic wave, at least one interdigital transducer (IDT) is made of a material having a larger mass-load effect than that of aluminum. The metallization ratio of the IDT and the normalization film thickness h/? of the IDT are controlled such that ripple caused by a transversal mode wave is about 1.5 dB or less, where “h” indicates the film thickness of the electrodes and “h” indicates the wavelength of a surface acoustic wave.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: March 15, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takeshi Nakao, Koji Fujimoto, Michio Kadota, Toshimaro Yoneda
  • Patent number: 6836196
    Abstract: A surface acoustic wave apparatus has an improved frequency temperature characteristic due to an arrangement of a SiO2 film on an IDT such that cracks in the SiO2 film surface are prevented from occurring, desired characteristics are reliably achieved, the electromechanical coefficient is increased, and the attenuation constant &agr; is reduced. The surface acoustic wave apparatus includes at least one IDT primarily including Cu and arranged on a 23° to 46°-rotated Y plate LiTaO3 substrate. The SiO2 film is arranged on the LiTaO3 substrate so as to cover the at least one IDT.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: December 28, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Michio Kadota, Takeshi Nakao
  • Publication number: 20040256950
    Abstract: A surface acoustic wave device includes a piezoelectric substrate and interdigital electrodes disposed on the piezoelectric substrate, wherein each of the interdigital electrodes includes a main electrode layer made of Cu or an alloy that has Cu as its main component. The surface acoustic wave device also includes a tightly adhering layer which is disposed between the main electrode layer and the piezoelectric substrate and whose main component is NiCr, or a tightly adhering layer whose main component is Ti and whose film thickness is within a range of about 18 nm to about 60 nm.
    Type: Application
    Filed: April 29, 2004
    Publication date: December 23, 2004
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takuo Hada, Takeshi Nakao, Michio Kadota, Osamu Nakagawara
  • Publication number: 20040256949
    Abstract: A surface acoustic wave device includes a piezoelectric substrate and interdigital electrodes disposed on the piezoelectric substrate, wherein each of the interdigital electrodes includes a main electrode layer made of Cu or an alloy that has Cu as its main component. The surface acoustic wave device also includes a tightly adhering layer which is disposed between the main electrode layer and the piezoelectric substrate and whose main component is NiCr, or a tightly adhering layer whose main component is Ti and whose film thickness is within a range of about 18 nm to about 60 nm.
    Type: Application
    Filed: June 20, 2003
    Publication date: December 23, 2004
    Inventors: Takuo Hada, Takeshi Nakao, Michio Kadota
  • Patent number: 6826815
    Abstract: A surface acoustic wave device includes a piezoelectric plate and at least one interdigital electrode provided on the piezoelectric plate. The interdigital electrode includes a first metallic thin film and a second metallic thin film laminated on the first metallic thin film and containing tantalum as a principal component, and at least a portion of the tantalum of the second metallic thin film is &agr;-tantalum.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: December 7, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masatoshi Nakagawa, Makoto Tose, Yoshihiro Koshido, Michio Kadota, Toshimaro Yoneda, Takeshi Nakao
  • Patent number: 6806796
    Abstract: An end-surface reflection type surface acoustic wave filter is capable of increasing an attenuation amount outside a pass band while insertion loss characteristics are not seriously deteriorated. The filter is a longitudinally coupled resonator type surface acoustic wave filter using an SH type surface acoustic wave, which has first and second grooves formed in a piezoelectric substrate at the top surface thereof so as to be substantially parallel to each other and spaced from each other by a predetermined distance. In addition, IDTs which are provided between the grooves for defining the longitudinally coupled resonator type surface acoustic wave filter, reflection end-surfaces disposed on side surfaces of the first and the second grooves at the IDT sides, and one of a resin-coating layer and a protective layer made of SiO2, are provided on the top surface of the piezoelectric substrate.
    Type: Grant
    Filed: December 2, 2003
    Date of Patent: October 19, 2004
    Assignee: Murata Manfacturing Co., Ltd.
    Inventors: Michio Kadota, Hideya Horiuchi, Junya Ago, Takeshi Nakao, Yasuhiro Kuratani
  • Publication number: 20040190427
    Abstract: In an optical head for writing and reading data on optical discs (mainly CDs and DVDs) with various specifications using different light source wavelengths, the effective light beam size for the light from each light source differs. This leads to a drop in optical efficiency for the light of a narrower effective beam size. This problem is overcome by providing a dichroic beam expander between the light sources and an objective lens, the dichroic beam expander comprising a substrate with an N-stage step- or sawtooth-shaped blazed diffraction grating formed on both sides thereof. The size of the light beams from the two light sources with different wavelengths is increased or decreased in a wavelength-selective manner, so that the light from each light source can be utilized at high efficiencies.
    Type: Application
    Filed: August 18, 2003
    Publication date: September 30, 2004
    Inventors: Tatsuro Ide, Takeshi Shimano, Takeshi Nakao, Kazuo Shigematsu
  • Patent number: 6784764
    Abstract: An end-surface reflection type surface acoustic wave filter is capable of increasing an attenuation amount outside a pass band while insertion loss characteristics are not seriously deteriorated. The filter is a longitudinally coupled resonator type surface acoustic wave filter using an SH type surface acoustic wave, which has first and second grooves formed in a piezoelectric substrate at the top surface thereof so as to be substantially parallel to each other and spaced from each other by a predetermined distance. In addition, IDTs which are provided between the grooves for defining the longitudinally coupled resonator type surface acoustic wave filter, reflection end-surfaces disposed on side surfaces of the first and the second grooves at the IDT sides, and one of a resin-coating layer and a protective layer made of SiO2, are provided on the top surface of the piezoelectric substrate.
    Type: Grant
    Filed: August 14, 2002
    Date of Patent: August 31, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Michio Kadota, Hideya Horiuchi, Junya Ago, Takeshi Nakao, Yasuhiro Kuratani
  • Publication number: 20040164644
    Abstract: In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO3 substrate. By using a resist pattern used for forming an IDT electrode, the first insulating layer in which the IDT electrode is to be formed is removed. An electrode film made of a metal having a density higher than Al or an alloy primarily including such a metal is disposed in the area in which the first insulating layer is removed so as to form the IDT electrode. The resist pattern remaining on the first insulating layer is removed. A second insulating layer is formed to cover the first insulating layer and the IDT electrode.
    Type: Application
    Filed: May 30, 2003
    Publication date: August 26, 2004
    Inventors: Kenji Nishiyama, Takeshi Nakao, Michio Kadota
  • Publication number: 20040145431
    Abstract: In a surface acoustic wave device, electrode films constituting at least one IDT are disposed on a piezoelectric substrate, and an SiO2 film is arranged on the piezoelectric substrate so as to cover the electrode films. The film-thickness of the electrode films is in the range of about 1% to about 3% of the wavelength of an excited surface acoustic wave.
    Type: Application
    Filed: January 13, 2004
    Publication date: July 29, 2004
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takeshi Nakao, Masakazu Mimura, Michio Kadota
  • Publication number: 20040140734
    Abstract: A surface acoustic wave device with improved reflection characteristics, in which an insulating film is formed so as to cover an electrode film, and the electrode film is made from Al or an Al alloy, includes a piezoelectric substrate, an electrode film which is formed of Al or an alloy including Al as a major component on the piezoelectric substrate and which defines at least one interdigital transducer, and an insulating film arranged on the piezoelectric substrate so as to cover the electrode film, the average density of the electrode film is less than or equal to about 1.5 times the density of the insulating film, wherein the top surface of the insulating film is planarized.
    Type: Application
    Filed: December 15, 2003
    Publication date: July 22, 2004
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takeshi Nakao, Kenji Nishiyama, Tetsuya Kimura, Michio Kadota
  • Publication number: 20040108791
    Abstract: An end-surface reflection type surface acoustic wave filter is capable of increasing an attenuation amount outside a pass band while insertion loss characteristics are not seriously deteriorated. The filter is a longitudinally coupled resonator type surface acoustic wave filter using an SH type surface acoustic wave, which has first and second grooves formed in a piezoelectric substrate at the top surface thereof so as to be substantially parallel to each other and spaced from each other by a predetermined distance. In addition, IDTs which are provided between the grooves for defining the longitudinally coupled resonator type surface acoustic wave filter, reflection end-surfaces disposed on side surfaces of the first and the second grooves at the IDT sides, and one of a resin-coating layer and a protective layer made of SiO2, are provided on the top surface of the piezoelectric substrate.
    Type: Application
    Filed: December 2, 2003
    Publication date: June 10, 2004
    Applicant: Murata Manufacturing Co., Ltd
    Inventors: Michio Kadota, Hideya Horiuchi, Junya Ago, Takeshi Nakao, Yasuhiro Kuratani
  • Publication number: 20040093705
    Abstract: In a surface acoustic wave device using a Shear Horizontal type surface acoustic wave, at least one interdigital transducer (IDT) is made of a material having a larger mass-load effect than that of aluminum. The metallization ratio of the IDT and the normalization film thickness h/&lgr; of the IDT are controlled such that ripple caused by a transversal mode wave is about 0.5 dB or less, where “h” indicates the film thickness of the electrodes and “&lgr;” indicates the wavelength of a surface acoustic wave.
    Type: Application
    Filed: July 7, 2003
    Publication date: May 20, 2004
    Applicant: Murata Manufacturing Co.
    Inventors: Takeshi Nakao, Koji Fujimoto, Michio Kadota, Toshimaro Yoneda
  • Publication number: 20040090850
    Abstract: The magnetoresistance effect element is of a multilayered structure having at least magnetic layers and an intermediate layer of an insulating material, a semiconductor or an antiferromagnetic material against the magnetic layers, and the magnetoresistance effect element has terminals formed at least on the opposite magnetic layers, respectively, so that a current flows in the intermediate layer. The film surfaces of all the magnetic layers constituting the magnetoresistance effect element are opposed substantially at right angles to the recording surface of a magnetic recording medium. Therefore, the area of the magnetic layers facing the recording surface of the magnetic recording medium can be extremely reduced, and thus the magnetic field from a very narrow region of the high-density recorded magnetic recording medium can be detected by the current which has a tunneling characteristic and passes through the intermediate layer.
    Type: Application
    Filed: November 5, 2003
    Publication date: May 13, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Ryoichi Nakatani, Masahiro Kitada, Naoki Koyama, Isamu Yuito, Hisashi Takano, Eijin Moriwaki, Mikio Suzuki, Masaaki Futamoto, Fumio Kugiya, Yoshibumi Matsuda, Kazuo Shiiki, Yoshinori Miyamura, Kyo Akagi, Takeshi Nakao, Hirotsugu Fukuoka, Takayuki Munemoto, Tokuho Takagaki, Toshio Kobayashi, Hideo Tanabe, Noboru Shimizu
  • Patent number: 6725513
    Abstract: A method for manufacturing a surface acoustic wave apparatus decreases a specific resistance of an electrode film by removing hydrogen occluded in the electrode film that is primarily composed of tantalum, so that the device properties are stabilized. An electrode film primarily composed of tantalum is formed on a piezoelectric substrate. Subsequently, this electrode film is heat-treated in a vacuum at a temperature of about 200° C. to about 700° C. for several hours. Thereafter, the electrode film is patterned so as to produce an interdigital electrode transducer.
    Type: Grant
    Filed: June 6, 2001
    Date of Patent: April 27, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masatoshi Nakagawa, Makoto Tose, Yoshihiro Koshido, Koji Fujimoto, Takeshi Nakao
  • Publication number: 20040061574
    Abstract: A surface acoustic wave device includes a Y-cut, X-propagation LiTaO3 substrate, at least one interdigital transducer provided on the LiTaO3 substrate and made of Al or a metal containing Al as a major component, and an SiO2 film provided on the surface of the LiTaO3 substrate so as to cover the interdigital transducer, wherein the thickness Hs of the SiO2 film normalized by the wavelength &lgr; of a surface acoustic wave and the cut angle &thgr; of the LiTaO3 substrate are set to be in any one of the ranges represented by formulae (1) to (8):
    Type: Application
    Filed: July 1, 2003
    Publication date: April 1, 2004
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Michio Kadota, Hideya Horiuchi, Takeshi Nakao, Yasuhiro Kuratani, Masakazu Mimura, Junya Ago
  • Publication number: 20040021530
    Abstract: A surface acoustic wave device has first and second surface acoustic wave filter elements which are arranged on a surface acoustic wave substrate so as to define a filter device having a two-stage configuration. A free surface portion is provided by forming a perforation in an inter-stage connecting portion connecting the first and second surface acoustic wave filter elements.
    Type: Application
    Filed: June 13, 2003
    Publication date: February 5, 2004
    Inventors: Daisuke Tamazaki, Takeshi Nakao, Toshimaro Yoneda
  • Patent number: 6687099
    Abstract: The magnetoresistance effect element is of a multilayered structure having at least magnetic layers and an intermediate layer of an insulating material, a semiconductor or an antiferromagnetic material against the magnetic layers, and the magnetoresistance effect element has terminals formed at least on the opposite magnetic layers, respectively, so that a all the magnetic layers constituting the magnetoresistance effect element are opposed substantially at right angles to the recording surface of a magnetic recording medium. Therefore, the area of the magnetic layers facing the recording surface of the magnetic recording medium can be extremely reduced, and thus the magnetic field from a very narrow region of the high-density recorded magnetic recording medium can be detected by the current which has a tunneling characteristic and passes through the intermediate layer.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: February 3, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Ryoichi Nakatani, Masahiro Kitada, Naoki Koyama, Isamu Yuito, Hisashi Takano, Eijin Moriwaki, Mikio Suzuki, Masaaki Futamoto, Fumio Kugiya, Yoshibumi Matsuda, Kazuo Shiiki, Yoshinori Miyamura, Kyo Akagi, Takeshi Nakao, Hirotsugu Fukuoka, Takayuki Munemoto, Tokuho Takagaki, Toshio Kobayashi, Hideo Tanabe, Noboru Shimizu
  • Patent number: 6617752
    Abstract: In a surface acoustic wave device using a Shear Horizontal type surface acoustic wave, at least one interdigital transducer (IDT) is made of a material having a larger mass-load effect than that of aluminum. The metallization ratio of the IDT and the normalization film thickness h/&lgr; of the IDT are controlled such that ripple caused by a transversal mode wave is about 0.5 dB or less, where “h” indicates the film thickness of the electrodes and “&lgr;” indicates the wavelength of a surface acoustic wave.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: September 9, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takeshi Nakao, Koji Fujimoto, Michio Kadota, Toshimaro Yoneda