Patents by Inventor Takeshi Nobukuni
Takeshi Nobukuni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230098357Abstract: [Problem] Provided is a resin composition, resin sheet, prepreg and printed wiring board capable of obtaining excellent low permittivity, low dielectric loss tangent, flexibility and peel strength. [Solution Means] A resin composition containing (A) a maleimide compound exhibiting a relative permittivity of lower than 2.7, (B) a polyphenylene ether compound represented by general formula (1) below and having a number-average molecular weight of 1000 to 7000, and (C) a block copolymer with a styrene skeleton. In general formula (1), X represents an aryl group, —(Y—O)n2- represents a polyphenylene ether portion, R1, R2 and R3 each independently represent a hydrogen atom or an alkyl, alkenyl or alkynyl group, n2 represents an integer of 1 to 100, n1 represents an integer of 1 to 6 and n3 represents an integer of 1 to 4.Type: ApplicationFiled: January 20, 2021Publication date: March 30, 2023Applicants: Mitsubishi Gas Chemical Company, Inc., MGC Electrotechno Co., Ltd.Inventors: Shunsuke Hirano, Yoshihiro Kato, Meguru Ito, Takeshi Nobukuni, Noriaki Sugimoto, Takashi Kubo, Shouta Koga, Yoshitaka Ueno
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Patent number: 9512329Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.Type: GrantFiled: May 23, 2012Date of Patent: December 6, 2016Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takeshi Nobukuni, Yoshihiro Kato, Meguru Ito, Tomoki Hamajima
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Publication number: 20160297106Abstract: In the manufacture of prepreg using various types of resin varnish having different properties, prepreg having good appearance and desired properties is manufactured without decreasing productivity. A prepreg manufacturing apparatus is able to perform, in a base material feeding path, immersing a base material in resin varnish in a tray, scraping off the excess resin varnish on the base material with scraping rollers which are provided above the tray, and thereafter drying the base material with a drying device. The prepreg manufacturing apparatus is configured such that, on the base material feeding path, the distance from the liquid surface of the resin varnish in the tray to the scraping rollers and the distance from the scraping rollers to the drying device are adjustable.Type: ApplicationFiled: December 3, 2014Publication date: October 13, 2016Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., MGC ELECTROTECHNO CO., LTDInventors: Masanobu SOGAME, Takeshi NOBUKUNI, Hiroyuki MATSUMOTO, Fumihiko YASHIMA, Mitsunori KUBOKI
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Patent number: 9238720Abstract: This invention relates to a prepreg having a low thermal expansion coefficient in plane direction and a high rigidity, and more particularly to a prepreg comprising a glass cloth (A), and a resin composition including a cyanate ester resin (B), a non-halogen based epoxy resin (C) and an inorganic filler (D), wherein the glass cloth (A) is characterized that when the weight per 1 m2 is W (g/m2), the thickness is t (?m), the number of warp threads per inch is X (thread/inch), and the number of weft threads per inch is Y (thread/inch), the total of X and Y is 150 to 240, t is 17 to 35, and the value of W/t as the apparent density is 1.1 to 1.5, and that the volume fraction of the glass cloth (A) in the prepreg is 32% to 42%.Type: GrantFiled: February 16, 2010Date of Patent: January 19, 2016Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Masayoshi Ueno, Yoshihiro Kato, Takeshi Nobukuni
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Publication number: 20150351236Abstract: A method for manufacturing a metal foil-clad laminate in which the occurrence of voids and unevenness is suppressed compared with conventional ones even when a prepreg obtained from a curable resin composition containing a relatively large amount of an inorganic filler is used. A laminate and a metal foil-clad laminate has excellent moldability, a low thermal expansion coefficient, and high glass transition temperature and is excellent in the peel strength of the metal foil. A method comprises disposing one or more prepregs between metal foils so that the one or more prepregs are in contact with metal surfaces, and heating and pressurizing the one or more prepregs and the metal foils in a vacuum atmosphere to laminate the prepregs and the metal foils to obtain a metal foil-clad laminate; and further subjecting the metal foil-clad laminate to heating and pressurization treatment in a vacuum atmosphere.Type: ApplicationFiled: December 6, 2013Publication date: December 3, 2015Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., MGC ELECTROTECHNO CO., LTDInventors: Yoshihiro KATO, Takeshi NOBUKUNI, Hiroyuki MATSUMOTO, Mitsunori KUBOKI
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Publication number: 20140332159Abstract: This invention relates to a method for storing a naphthol aralkyl type cyanate ester resin solution, which is difficult to precipitate due to long term storage in a solution state, and particularly relates to a method for storing a naphthol aralkyl type cyanate ester resin solution (AB), which comprises: preparing (i) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A) and a maleimide compound (B), and a solvent, and; storing the resin solution (AB).Type: ApplicationFiled: July 25, 2014Publication date: November 13, 2014Inventors: Masayoshi UENO, Yoshihiro KATO, Takeshi NOBUKUNI
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Patent number: 8815986Abstract: This invention relates to a method for storing a naphthol aralkyl type cyanate ester resin solution, which is difficult to precipitate due to long term storage in a solution state, and particularly relates to a method for storing a naphthol aralkyl type cyanate ester resin solution (AB), which comprises: preparing (i) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A) and a maleimide compound (B), and a solvent, and; storing the resin solution (AB).Type: GrantFiled: March 24, 2010Date of Patent: August 26, 2014Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Masayoshi Ueno, Yoshihiro Kato, Takeshi Nobukuni
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Patent number: 8815401Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.Type: GrantFiled: July 11, 2008Date of Patent: August 26, 2014Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Yoshihiro Kato, Takeshi Nobukuni, Masayoshi Ueno
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Publication number: 20140227924Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.Type: ApplicationFiled: May 23, 2012Publication date: August 14, 2014Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takeshi Nobukuni, Yoshihiro Kato, Meguru Ito, Tomoki Hamajima
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Publication number: 20120018072Abstract: This invention relates to a method for storing a naphthol aralkyl type cyanate ester resin solution, which is difficult to precipitate due to long term storage in a solution state, and particularly relates to a method for storing a naphthol aralkyl type cyanate ester resin solution (AB), which comprises: preparing (i) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A) and a maleimide compound (B), and a solvent, and; storing the resin solution (AB).Type: ApplicationFiled: March 24, 2010Publication date: January 26, 2012Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Masayoshi Ueno, Yoshihiro Kato, Takeshi Nobukuni
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Publication number: 20120009836Abstract: This invention relates to a prepreg having a low thermal expansion coefficient in plane direction and a high rigidity, and more particularly to a prepreg comprising a glass cloth (A), and a resin composition including a cyanate ester resin (B), a non-halogen based epoxy resin (C) and an inorganic filler (D), wherein the glass cloth (A) is characterized that when the weight per 1 m2 is W (g/m2), the thickness is t (?m), the number of warp threads per inch is X (thread/inch), and the number of weft threads per inch is Y (thread/inch), the total of X and Y is 150 to 240, t is 17 to 35, and the value of W/t as the apparent density is 1.1 to 1.5, and that the volume fraction of the glass cloth (A) in the prepreg is 32% to 42%.Type: ApplicationFiled: February 16, 2010Publication date: January 12, 2012Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Masayoshi Ueno, Yoshihiro Kato, Takeshi Nobukuni
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Patent number: 7601429Abstract: A prepreg, for printed wiring boards, comprising a flame resistant resin composition containing a specific cyanate ester resin, a nonhalogen epoxy resin, boehmite which is hardly soluble in acids or alkalis and a silicone powder which is a flame retardant assistant, and a base material, which prepreg retains high-degree flame resistance without a halogen compound and has excellent resistance to chemical, high glass transition temperature, excellent soldering heat resistance and excellent heat resistance after moisture absorption, and a laminate or metal-foil-clad laminate obtained by curing the above prepreg.Type: GrantFiled: February 5, 2008Date of Patent: October 13, 2009Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Yoshihiro Kato, Masayoshi Ueno, Takeshi Nobukuni
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Publication number: 20090017316Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.Type: ApplicationFiled: July 11, 2008Publication date: January 15, 2009Inventors: Yoshihiro Kato, Takeshi Nobukuni, Masayoshi Ueno
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Publication number: 20080187763Abstract: A prepreg, for printed wiring boards, comprising a flame resistant resin composition containing a specific cyanate ester resin, a nonhalogen epoxy resin, boehmite which is hardly soluble in acids or alkalis and a silicone powder which is a flame retardant assistant, and a base material, which prepreg retains high-degree flame resistance without a halogen compound and has excellent resistance to chemical, high glass transition temperature, excellent soldering heat resistance and excellent heat resistance after moisture absorption, and a laminate or metal-foil-clad laminate obtained by curing the above prepreg.Type: ApplicationFiled: February 5, 2008Publication date: August 7, 2008Inventors: Yoshihiro Kato, Masayoshi Ueno, Takeshi Nobukuni
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Publication number: 20040067354Abstract: A tray for a vapor phase step in which a heat-resistant thermosetting resin is intimately bonded and impregnated to/into surfaces, including inner pore wall surfaces, of an inorganic continuously porous sintered body having a thickness of 0.5 to 10 mm and an open porosity of 5 to 50% and a thin film of a super heat-resistant thermoplastic resin is formed thereon, and a process for the production thereof.Type: ApplicationFiled: September 25, 2003Publication date: April 8, 2004Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuyuki Ohya, Takeshi Nobukuni, Norio Sayama
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Patent number: 6653207Abstract: A process for the production of an electric part, comprising performing a circuit-parts-forming step including the introduction of impurities on one surface (surface A) of a semiconductor substrate, then bonding the surface A to a holding substrate, performing a back surface treatment step essentially including a polishing of an exposed surface (surface B) of the semiconductor substrate to a thickness of 100 &mgr;m or less to obtain an electric-part-formed thinned substrate and separating the thinned substrate from the holding substrate, wherein a resin composition containing a swelling inorganic compound (WC) is used for an adhesion layer and in the separating step the thinned substrate is separated from the holding substrate after decreasing the adhesive strength of the thinned substrate and the holding substrate by swelling the swelling inorganic compound (WC).Type: GrantFiled: March 11, 2002Date of Patent: November 25, 2003Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kazuyuki Ohya, Kazuhiro Otsu, Takeshi Nobukuni
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Patent number: 6594892Abstract: A process for the production of a composite ceramic printed wiring board, comprising (1) making a penetration hole having a diameter of 0.1 to 0.8 mm in a ceramic board having an open porosity of at least 5% and a thickness of 0.1 to 10 mm, (2) fixing metal (M) to the penetration hole such that the metal (M) penetrates through the penetration hole, (3) impregnating a heat-resistant resin precursor (R) under vacuum, polymerizing the heat-resistant resin precursor (R) and polishing both surfaces of the resultant board to produce a resin composite ceramic substrate (MRA) having a conductive portion for conduction between both surfaces in a predetermined portion, and (4) forming printed wiring networks on one or both surfaces of the resin composite ceramic substrate (MRA).Type: GrantFiled: August 3, 2001Date of Patent: July 22, 2003Assignee: Mitsubishi Gas Chemical Co., Inc.Inventors: Kazuyuki Ohya, Norio Sayama, Takeshi Nobukuni
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Publication number: 20020132447Abstract: A process for the production of an electric part, comprising performing a circuit-parts-forming step including the introduction of impurities on one surface (surface A) of a semiconductor substrate, then bonding the surface A to a holding substrate, performing a back surface treatment step essentially including a polishing of an exposed surface (surface B) of the semiconductor substrate to a thickness of 100 &mgr;m or less to obtain an electric-part-formed thinned substrate and separating the thinned substrate from the holding substrate,Type: ApplicationFiled: March 11, 2002Publication date: September 19, 2002Inventors: Kazuyuki Ohya, Kazuhiro Otsu, Takeshi Nobukuni
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Publication number: 20020040522Abstract: A process for the production of a composite ceramic printed wiring board, comprisingType: ApplicationFiled: August 3, 2001Publication date: April 11, 2002Inventors: Kazuyuki Ohya, Norio Sayama, Takeshi Nobukuni