Abstract: An the expander-compressor unit (100) includes a closed casing (1) in which an oil can be stored in its bottom part, a compression mechanism (2) disposed in an upper part of the closed casing (1), an expansion mechanism (3) disposed in a lower part of the closed casing (1), a shaft (5) for coupling the compression mechanism (2) and the an expansion mechanism (3) to each other, and an oil pump (6), disposed between the compression mechanism (2) and the expansion mechanism (3), for supplying the oil (26) filling a surrounding space of the expansion mechanism (3) to the compression mechanism (2).

Abstract: For achieving an improvement on recording/reproducing quality of information, with enabling more adequate tilt adjustment, even for an optical disc to be used under a circumstance having a large temperature change, an optical disc apparatus for conducting recording or reproducing of video information onto/from the optical disc 2, through buffers 17 and 18, while conducting a tilt adjustment through a learning of a tilt amount, comprises a temperature sensor 4 for detecting temperature within an optical pickup 1, wherein it is determined on whether a relearning of the tilt amount of the optical pickup, upon basis of a change of temperature detected, a movement amount of the optical pickup between the time when a previous learning is done and the time when a present learning is done, and a remaining memory capacity of the buffers.

Abstract: A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrate is inserted through a slot in the shroud and, within the shroud, engages against the flexible, resilient leads, thereby establishing an electrical contact.

Abstract: A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrate is inserted through a slot in the shroud and, within the shroud, engages against the flexible, resilient leads, thereby establishing an electrical contact.

Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.

Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.

Abstract: A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrate is inserted through a slot in the shroud and, within the shroud, engages against the flexible, resilient leads, thereby establishing an electrical contact.

Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.