Patents by Inventor Takeshi Ohtsuka

Takeshi Ohtsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974042
    Abstract: A signal processing device includes an approximate curved surface conversion unit that includes a first stacked autoencoder pretrained on the basis of learning input data constituted by coordinate data acquired for each of multiple elements of an object, and that obtains approximate curved surface data indicating an approximate curved surface of the object in an intermediate layer of the first stacked autoencoder, on the basis of input data constituted by the coordinate data acquired for each of the elements, and a geometric modulation processing unit that includes a second stacked autoencoder having learned by machine learning on the basis of learning input data constituted by the approximate curved surface data and on the basis of training data constituted by a result obtained by coordinate conversion for each of the elements in a geometric modulation process performed for the object, and performs the geometric modulation process.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: April 30, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hiroshi Arai, Yuriko Ohtsuka, Kenichiro Nishi, Takeshi Masuura, Norimitsu Okiyama, Yuji Matsui, Satoshi Takashima
  • Patent number: 11967469
    Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 23, 2024
    Assignee: TDK CORPORATION
    Inventors: Hajime Kuwajima, Takashi Ohtsuka, Takeshi Oohashi, Yuichiro Okuyama
  • Patent number: 9873787
    Abstract: A copolymer for improving heat resistance of a methacrylic resin which can achieve preservation of excellent transparency of the methacrylic resin and improvement in heat resistance, and can provide a molded product having excellent appearance, by adding the copolymer to the methacrylic resin, is provided. According to the present invention, a copolymer for improving heat resistance of a methacrylic resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: January 23, 2018
    Assignee: DENKA COMPANY LIMITED
    Inventors: Tetsuo Noguchi, Takeshi Ohtsuka, Masanori Matsumoto, Yuichi Shindo
  • Publication number: 20160326360
    Abstract: A copolymer for improving heat resistance of a methacrylic resin which can achieve preservation of excellent transparency of the methacrylic resin and improvement in heat resistance, and can provide a molded product having excellent appearance, by adding the copolymer to the methacrylic resin, is provided. According to the present invention, a copolymer for improving heat resistance of a methacrylic resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.
    Type: Application
    Filed: July 21, 2016
    Publication date: November 10, 2016
    Applicant: DENKA COMPANY LIMITED
    Inventors: Tetsuo NOGUCHI, Takeshi OHTSUKA, Masanori MATSUMOTO, Yuichi SHINDO
  • Patent number: 9365713
    Abstract: Provided is a copolymer for improving heat resistance of aromatic vinyl-vinyl cyanide based resin which can achieve preservation of excellent transparency of the aromatic vinyl-vinyl cyanide based resin, improvement in heat resistance, and a molded product having excellent appearance, by adding the copolymer to the aromatic vinyl-vinyl cyanide based resin. A copolymer for improving heat resistance of an aromatic vinyl-vinyl cyanide based resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: June 14, 2016
    Assignee: DENKA COMPANY LIMITED
    Inventors: Tetsuo Noguchi, Takeshi Ohtsuka, Masanori Matsumoto, Yuichi Shindo
  • Publication number: 20150284557
    Abstract: Provided is a copolymer for improving heat resistance of aromatic vinyl-vinyl cyanide based resin which can achieve preservation of excellent transparency of the aromatic vinyl-vinyl cyanide based resin, improvement in heat resistance, and a molded product having excellent appearance, by adding the copolymer to the aromatic vinyl-vinyl cyanide based resin. A copolymer for improving heat resistance of an aromatic vinyl-vinyl cyanide based resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.
    Type: Application
    Filed: October 10, 2013
    Publication date: October 8, 2015
    Inventors: Tetsuo Noguchi, Takeshi Ohtsuka, Masanori Matsumoto, Yuichi Shindo
  • Publication number: 20150203610
    Abstract: A copolymer for improving heat resistance of a methacrylic resin which can achieve preservation of excellent transparency of the methacrylic resin and improvement in heat resistance, and can provide a molded product having excellent appearance, by adding the copolymer to the methacrylic resin, is provided. According to the present invention, a copolymer for improving heat resistance of a methacrylic resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.
    Type: Application
    Filed: July 29, 2013
    Publication date: July 23, 2015
    Inventors: Tetsuo Noguchi, Takeshi Ohtsuka, Masanori Matsumoto, Yuichi Shindo
  • Patent number: 7624227
    Abstract: A drive device capable of preventing a drop in the data transfer rate, even when write instructions from a host device are given with commands having a short write data length. If the write end address of one of a plurality of ATA commands issued by a host device 2 is consecutive with the write start address of the next ATA command, a command analysis unit 11 has data writing to an SD card 1 by the consecutive commands performed in a single process. As a result, overheads when writing data to SD cards are incurred only once, allowing the transfer rate to be improved.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: November 24, 2009
    Assignee: Panasonic Corporation
    Inventor: Takeshi Ohtsuka
  • Patent number: 7525807
    Abstract: A semiconductor memory device according to the present invention comprises a housing including a card bus connector for connection to a host device and having a PC card shape having a thickness of 5.0 mm, four SD memory cards housed in the housing and a control circuit for controlling transmission/reception of a signal between the card bus connector and the respective SD memory cards. The semiconductor memory device is suitably used as a recording medium of a host device for which a higher data transfer rate and a larger memory capacity are demanded. Further, a semiconductor memory device, which is attachable and detachable relative to the host device and thereby portable, and relatively inexpensively obtainable, can be provided, and is directly insertable into a laptop personal computer to be used.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: April 28, 2009
    Assignee: Panasonic Corporation
    Inventors: Haruo Ohta, Takeshi Ohtsuka
  • Publication number: 20060282634
    Abstract: A drive device capable of preventing a drop in the data transfer rate, even when write instructions from a host device are given with commands having a short write data length. If the write end address of one of a plurality of ATA commands issued by a host device 2 is consecutive with the write start address of the next ATA command, a command analysis unit 11 has data writing to an SD card 1 by the consecutive commands performed in a single process. As a result, overheads when writing data to SD cards are incurred only once, allowing the transfer rate to be improved.
    Type: Application
    Filed: October 28, 2004
    Publication date: December 14, 2006
    Inventor: Takeshi Ohtsuka
  • Publication number: 20060221711
    Abstract: A semiconductor memory device according to the present invention comprises a hosing including a card bus connector for connection to a host device and having a PC card shape having the thickness of 5.0 mm, four SD memory cards (R: Registered trade mark) housed in the housing and a control circuit for controlling transmission/reception of a signal between the card bus connector and the respective SD memory cards (R: Registered trade mark). The semiconductor memory device is suitably used as a recording medium of the host device for which a higher data transfer rate and a larger memory capacity are demanded. Further, a semiconductor memory device, which is attachable and detachable relative to the host device and thereby portable, and relatively inexpensively obtainable, can be provided, and is directly insertable into a laptop personal computer to be used.
    Type: Application
    Filed: December 11, 2003
    Publication date: October 5, 2006
    Inventors: Haruo Ohta, Takeshi Ohtsuka
  • Publication number: 20060209196
    Abstract: A camera recorder that is capable of recording and reproducing a large volume of image data at a high speed and a data recording medium that can be used for the camera recorder are provided. The camera recorder includes a camera portion 1 and a recording portion 2 for recording image data picked up by the camera portion 1. The recording portion 2 includes an interface portion 3 for receiving the image data from the camera portion 1, a plurality of memory cards 50 to 53 for storing the image data, and a controlling portion 4 for controlling writing of the image data to the memory cards 50 to 53. The memory cards 50 to 53 are constituted by a flash memory, and the controlling portion 4 divides the image data received from the camera portion 1 via the interface portion 3 into blocks having a data size that is an integral multiple of a recording block of the flash memory, and records the image data to the memory cards 50 to 53 in parallel.
    Type: Application
    Filed: November 28, 2003
    Publication date: September 21, 2006
    Inventors: Takeshi Ohtsuka, Keishi Okamoto, Katsuyuki Sakaniwa, Nobukatsu Okuda, Katsuji Kunisue