Patents by Inventor Takeshi Ohtsuka
Takeshi Ohtsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11974042Abstract: A signal processing device includes an approximate curved surface conversion unit that includes a first stacked autoencoder pretrained on the basis of learning input data constituted by coordinate data acquired for each of multiple elements of an object, and that obtains approximate curved surface data indicating an approximate curved surface of the object in an intermediate layer of the first stacked autoencoder, on the basis of input data constituted by the coordinate data acquired for each of the elements, and a geometric modulation processing unit that includes a second stacked autoencoder having learned by machine learning on the basis of learning input data constituted by the approximate curved surface data and on the basis of training data constituted by a result obtained by coordinate conversion for each of the elements in a geometric modulation process performed for the object, and performs the geometric modulation process.Type: GrantFiled: April 20, 2021Date of Patent: April 30, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Hiroshi Arai, Yuriko Ohtsuka, Kenichiro Nishi, Takeshi Masuura, Norimitsu Okiyama, Yuji Matsui, Satoshi Takashima
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Patent number: 11967469Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.Type: GrantFiled: May 26, 2021Date of Patent: April 23, 2024Assignee: TDK CORPORATIONInventors: Hajime Kuwajima, Takashi Ohtsuka, Takeshi Oohashi, Yuichiro Okuyama
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Patent number: 9873787Abstract: A copolymer for improving heat resistance of a methacrylic resin which can achieve preservation of excellent transparency of the methacrylic resin and improvement in heat resistance, and can provide a molded product having excellent appearance, by adding the copolymer to the methacrylic resin, is provided. According to the present invention, a copolymer for improving heat resistance of a methacrylic resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.Type: GrantFiled: July 21, 2016Date of Patent: January 23, 2018Assignee: DENKA COMPANY LIMITEDInventors: Tetsuo Noguchi, Takeshi Ohtsuka, Masanori Matsumoto, Yuichi Shindo
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Publication number: 20160326360Abstract: A copolymer for improving heat resistance of a methacrylic resin which can achieve preservation of excellent transparency of the methacrylic resin and improvement in heat resistance, and can provide a molded product having excellent appearance, by adding the copolymer to the methacrylic resin, is provided. According to the present invention, a copolymer for improving heat resistance of a methacrylic resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.Type: ApplicationFiled: July 21, 2016Publication date: November 10, 2016Applicant: DENKA COMPANY LIMITEDInventors: Tetsuo NOGUCHI, Takeshi OHTSUKA, Masanori MATSUMOTO, Yuichi SHINDO
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Patent number: 9365713Abstract: Provided is a copolymer for improving heat resistance of aromatic vinyl-vinyl cyanide based resin which can achieve preservation of excellent transparency of the aromatic vinyl-vinyl cyanide based resin, improvement in heat resistance, and a molded product having excellent appearance, by adding the copolymer to the aromatic vinyl-vinyl cyanide based resin. A copolymer for improving heat resistance of an aromatic vinyl-vinyl cyanide based resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.Type: GrantFiled: October 10, 2013Date of Patent: June 14, 2016Assignee: DENKA COMPANY LIMITEDInventors: Tetsuo Noguchi, Takeshi Ohtsuka, Masanori Matsumoto, Yuichi Shindo
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Publication number: 20150284557Abstract: Provided is a copolymer for improving heat resistance of aromatic vinyl-vinyl cyanide based resin which can achieve preservation of excellent transparency of the aromatic vinyl-vinyl cyanide based resin, improvement in heat resistance, and a molded product having excellent appearance, by adding the copolymer to the aromatic vinyl-vinyl cyanide based resin. A copolymer for improving heat resistance of an aromatic vinyl-vinyl cyanide based resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.Type: ApplicationFiled: October 10, 2013Publication date: October 8, 2015Inventors: Tetsuo Noguchi, Takeshi Ohtsuka, Masanori Matsumoto, Yuichi Shindo
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Publication number: 20150203610Abstract: A copolymer for improving heat resistance of a methacrylic resin which can achieve preservation of excellent transparency of the methacrylic resin and improvement in heat resistance, and can provide a molded product having excellent appearance, by adding the copolymer to the methacrylic resin, is provided. According to the present invention, a copolymer for improving heat resistance of a methacrylic resin, including: 45 to 85 mass % of an aromatic vinyl monomer unit; 5 to 45 mass % of a (meth)acrylic acid ester monomer unit; and 10 to 20 mass % of an unsaturated dicarboxylic acid anhydride monomer unit; wherein the copolymer has a total light transmittance of 88% or more, the total light transmittance being measured in accordance with ASTM D1003 for a sample with 2 mm-thickness, is provided.Type: ApplicationFiled: July 29, 2013Publication date: July 23, 2015Inventors: Tetsuo Noguchi, Takeshi Ohtsuka, Masanori Matsumoto, Yuichi Shindo
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Patent number: 7624227Abstract: A drive device capable of preventing a drop in the data transfer rate, even when write instructions from a host device are given with commands having a short write data length. If the write end address of one of a plurality of ATA commands issued by a host device 2 is consecutive with the write start address of the next ATA command, a command analysis unit 11 has data writing to an SD card 1 by the consecutive commands performed in a single process. As a result, overheads when writing data to SD cards are incurred only once, allowing the transfer rate to be improved.Type: GrantFiled: October 28, 2004Date of Patent: November 24, 2009Assignee: Panasonic CorporationInventor: Takeshi Ohtsuka
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Patent number: 7525807Abstract: A semiconductor memory device according to the present invention comprises a housing including a card bus connector for connection to a host device and having a PC card shape having a thickness of 5.0 mm, four SD memory cards housed in the housing and a control circuit for controlling transmission/reception of a signal between the card bus connector and the respective SD memory cards. The semiconductor memory device is suitably used as a recording medium of a host device for which a higher data transfer rate and a larger memory capacity are demanded. Further, a semiconductor memory device, which is attachable and detachable relative to the host device and thereby portable, and relatively inexpensively obtainable, can be provided, and is directly insertable into a laptop personal computer to be used.Type: GrantFiled: December 11, 2003Date of Patent: April 28, 2009Assignee: Panasonic CorporationInventors: Haruo Ohta, Takeshi Ohtsuka
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Publication number: 20060282634Abstract: A drive device capable of preventing a drop in the data transfer rate, even when write instructions from a host device are given with commands having a short write data length. If the write end address of one of a plurality of ATA commands issued by a host device 2 is consecutive with the write start address of the next ATA command, a command analysis unit 11 has data writing to an SD card 1 by the consecutive commands performed in a single process. As a result, overheads when writing data to SD cards are incurred only once, allowing the transfer rate to be improved.Type: ApplicationFiled: October 28, 2004Publication date: December 14, 2006Inventor: Takeshi Ohtsuka
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Publication number: 20060221711Abstract: A semiconductor memory device according to the present invention comprises a hosing including a card bus connector for connection to a host device and having a PC card shape having the thickness of 5.0 mm, four SD memory cards (R: Registered trade mark) housed in the housing and a control circuit for controlling transmission/reception of a signal between the card bus connector and the respective SD memory cards (R: Registered trade mark). The semiconductor memory device is suitably used as a recording medium of the host device for which a higher data transfer rate and a larger memory capacity are demanded. Further, a semiconductor memory device, which is attachable and detachable relative to the host device and thereby portable, and relatively inexpensively obtainable, can be provided, and is directly insertable into a laptop personal computer to be used.Type: ApplicationFiled: December 11, 2003Publication date: October 5, 2006Inventors: Haruo Ohta, Takeshi Ohtsuka
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Publication number: 20060209196Abstract: A camera recorder that is capable of recording and reproducing a large volume of image data at a high speed and a data recording medium that can be used for the camera recorder are provided. The camera recorder includes a camera portion 1 and a recording portion 2 for recording image data picked up by the camera portion 1. The recording portion 2 includes an interface portion 3 for receiving the image data from the camera portion 1, a plurality of memory cards 50 to 53 for storing the image data, and a controlling portion 4 for controlling writing of the image data to the memory cards 50 to 53. The memory cards 50 to 53 are constituted by a flash memory, and the controlling portion 4 divides the image data received from the camera portion 1 via the interface portion 3 into blocks having a data size that is an integral multiple of a recording block of the flash memory, and records the image data to the memory cards 50 to 53 in parallel.Type: ApplicationFiled: November 28, 2003Publication date: September 21, 2006Inventors: Takeshi Ohtsuka, Keishi Okamoto, Katsuyuki Sakaniwa, Nobukatsu Okuda, Katsuji Kunisue