Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.

Abstract: A nonaqueous electrolyte solution including at least an electrolyte, and a nonaqueous solvent, wherein the nonaqueous electrolyte solution contains a compound represented by the following general formula (A): wherein R1 to R3 represent optionally substituted organic groups having 1 to 20 carbon atoms, and a cyclic carbonate compound having a fluorine atom in an amount of 0.01% by mass to 50.

Abstract: A nonaqueous electrolyte solution, which contains a compound represented by the following general formula (A), and (1) at least one compound selected from the group consisting of a nitrile compound, an isocyanate compound, a difluorophosphate, a fluorosulfonate, a lithium bis(fluorosulfonyl)imide and a compound represented by the following general formula (B), or (2) a cyclic carbonate compound having a fluorine atom in an amount of 0.01% by mass to 50.0% by mass based on the total amount of the nonaqueous electrolyte solution. (In formula (A), R1 to R3 may be mutually the same or different and represent optionally substituted organic groups having 1 to 20 carbon atoms.) (In formula (B), R4, R5 and R6 respectively and independently represent an alkyl group, alkenyl group or alkynyl group having 1 to 12 carbon atoms that may be substituted with a halogen atom, and n represents an integer of 0 to 6.

Abstract: In an electronic component, a first inductor and a second inductor are disposed side by side in a first direction, and in a region where the first inductor and the second inductor are adjacent to each other in the first direction, at least one of positions in a second direction of an upper surface of a first inductor pattern, and an upper surface of a second inductor pattern and positions in the second direction of a lower surface of the first inductor pattern and a lower surface of a second inductor pattern, are different.

Abstract: An electronic component includes an insulator and an inductor pattern and a capacitor pattern which are arranged in the insulator. The inductor pattern and the capacitor pattern are electrically connected between one end and the other end of the first inductor pattern.

Abstract: A band-pass filter includes a first inductor and a second inductor electromagnetically coupled to each other, a first ground terminal electrically connected to the first inductor, a second ground terminal electrically connected to the second inductor, and a stack for integrating the first inductor, the second inductor, the first ground terminal, and the second ground terminal. The first ground terminal and the second ground terminal are each connected to a ground and are not electrically connected to each other in the stack.

Abstract: An electronic component includes conductor layers and insulating resin layers which are alternately stacked on a substrate. One of the insulating resin layers positioned in the lowermost layer is smaller in thickness than the insulating resin layers, and the insulating resin layers are smaller in thermal expansion coefficient than the one of the insulating resin layers. Thus, an element that requires high processing accuracy, such as a capacitor, can be embedded in the insulating resin layer positioned in the lowermost layer and having a small thickness, and an element that requires a sufficient conductor thickness, such as an inductor, can be embedded in the insulating resin layers having a large thickness. In addition, since the insulating resin layers each have a small thermal expansion coefficient, the occurrence of warpage and peeling can be suppressed.

Abstract: Disclosed herein is an electronic component that includes an element body having a structure in which a plurality of conductor layers are stacked in a first direction on a surface of a substrate with insulating layers interposed therebetween, and a plurality of terminal electrodes provided on a mounting surface of the element body. The mounting surface extends in the first direction and in a second direction perpendicular to the first direction. The element body includes an inductor constituted by the plurality of conductor layers and has a coil axis extending in a third direction perpendicular to both the first and second directions.

Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Abstract: Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.

Abstract: Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

Abstract: Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Abstract: Provided is a burner tile that has good fire resistance, good heat resistance, good erosion resistance, and good thermal shock resistance. A burner tile 1E includes a molded inorganic fiber product and has a burner main hole 3E. The burner tile 1E includes an inner layer 120 including a combination of inorganic fiber rods 121 and 122 such that the inner layer 120 defines an inner circumferential surface of the main hole 3E, and an outer layer 130 formed by surrounding an outer circumferential surface of the inner layer 120 with the molded inorganic fiber product. Part of the burner tile 1E extending along the inner circumferential surface of the main hole 3E has a high bulk density achieved by highly concentrating an inorganic binder in the inorganic fiber in part including the inner circumferential surface.

Abstract: Disclosed herein is a directional coupler that includes a main line configured to transmit a high-frequency signal, a sub line electromagnetically coupled to the main line, and a ground pattern positioned at least partially between the main line and the sub line in a plan view. The sub line includes a low pass filter having an inductance pattern and a capacitor. The ground pattern has an opening that overlaps at least the inductance pattern in a plan view.

Abstract: Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.

Abstract: Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.

Abstract: Disclosed herein is a directional coupler that includes a main line configured to transmit a high-frequency signal, a sub line electromagnetically coupled to the main line, and a ground pattern positioned at least partially between the main line and the sub line in a plan view. The sub line includes a low pass filter having an inductance pattern and a capacitor. The ground pattern has an opening that overlaps at least the inductance pattern in a plan view.