Abstract: Provided is a production method of an FRP precursor. The method includes: a pre-coating step of applying a resin varnish having a filler content of 5 vol % or less in a solid content thereof, to a sheet-shaped aggregate, and a melt-pasting step of melt-pasting a pair of resin films, each having a filler content of 30 vol % or more, to both surfaces of the aggregate, after the pre-coating step.

Abstract: A tool state learning device has a storage unit for storing an arbitrary image captured by an imaging device imaging a machined surface of an arbitrary workpiece cut using an arbitrary tool, and a teacher data acquisition unit for acquiring, as input data, an arbitrary image stored in the storage unit, and acquiring, as a label, the state of the tool annotated according to prescribed levels indicating the degree of wear of the tool on the basis of the arbitrary image. The tool state learning device also has a tool state learning unit for using the acquired label and input data to perform supervised learning, and generating a learned model in which a machined surface image of the machined surface of a workpiece imaged by the imaging device is inputted and the state of the tool that cut the machined surface of the workpiece is outputted.

Abstract: A measurement apparatus detects a person and an umbrella based on acquired image data, and measures the number of persons based on a detected result.

Abstract: Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material. 0.12<{(a1+a2)/2}/B??(1) 0.8?a1/a2?1.

Abstract: In the method for adhering a resin film with an aggregate under an atmospheric pressure in which workability is excellent and spouting of the resin from an edge portion of the aggregate can be suppressed, the present invention provides a method for producing an FRP precursor with excellent resin filling property into bulk voids of the aggregate as well as a method for producing an FRP. Specifically, provided is the method for producing the FRP precursor by adhering a thermosetting resin film to one surface of an aggregate that is in a form of a sheet under an atmospheric pressure, wherein the method includes a process in which the thermosetting resin film and the aggregate are press-adhered by heating by means of a pressure roll having a temperature in a range of +5° C. to +35° C. relative to a temperature at which a minimum melt viscosity of the film is exhibited.

Abstract: A cover film having at least a substrate layer and a sealant resin layer, wherein the sealant resin layer is formed to contact one surface of the substrate layer or is formed on an intermediate resin layer contacting one surface of the substrate layer, and the sealant resin layer contacting the substrate layer or the intermediate resin layer contacting the substrate layer contains an epoxidized fatty acid or a derivative thereof. The epoxidized fatty acid or a derivative thereof in the sealant resin layer contacting the substrate layer or in the intermediate resin layer contacting the substrate layer is preferably at a content of 0.5 parts by mass or less with respect to 100 parts by mass of a resin component constituting the intermediate resin layer contacting the substrate layer and/or the sealant resin layer contacting the substrate layer.

Abstract: Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.

Abstract: Provided are a method for producing an FRP precursor and a device for producing an FRP precursor, wherein the method and the device have a good productivity, and under a normal pressure, enable filling of a resin into a bulk gap of an aggregate as well as prevent the resin from spouting out from an edge portion thereof. The method for producing the FRP precursor is to produce the FRP precursor by melt-adhering each of a pair of thermosetting resin films 54 to each of both surfaces 40a and 40b of an aggregate 40 that is in a form of a sheet, the method comprising: an aggregate's surface heating process to heat aggregate's both surfaces, i.e.

Abstract: In the method for adhering a resin film with an aggregate under an atmospheric pressure in which workability is excellent and spouting of the resin from an edge portion of the aggregate can be suppressed, the present invention provides a method for producing an FRP precursor with excellent resin filling property into bulk voids of the aggregate as well as a method for producing an FRP. Specifically, provided is the method for producing the FRP precursor by adhering a thermosetting resin film to one. surface of an aggregate that is in a form of a sheet under an atmospheric pressure, wherein the method includes a process in which the thermosetting resin film and the aggregate are press-adhered by heating by means of a pressure roll having a temperature in a range of +5° C. to +35° C. relative to a temperature at which a minimum melt viscosity of the film is exhibited.

Abstract: Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.

Abstract: Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material. 0.12<{(a1+a2)/2}/B??(1) 0.8?a1/a2?1.

Abstract: Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.

Abstract: Provided are: an FRP precursor capable of providing a metal-clad laminate having small surface waviness and reduced number of a light spot, even if thickness of a metal foil is 40 ?m or less; a laminated plate including the FRP precursor; a metal-clad laminate having a metal foil on the laminated plate; a printed circuit board having a circuit pattern formed on the metal-clad laminate; a semiconductor package including the printed circuit board; and methods for producing them. The FRP precursor has the surface waviness of 12 ?m or less on both surfaces thereof.

Abstract: Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.

Abstract: Provided are a method for producing an FRP precursor and a device for producing an FRP precursor, wherein the method and the device have a good productivity, and under a normal pressure, enable filling of a resin into a bulk gap of an aggregate as well as prevent the resin from spouting out from an edge portion thereof. The method for producing the FRP precursor is to produce the FRP precursor by melt-adhering each of a pair of thermosetting resin films 54 to each of both surfaces 40a and 40b of an aggregate 40 that is in a form of a sheet, the method comprising: an aggregate's surface heating process to heat aggregate's both surfaces, i.e.

Abstract: Provided are a method for producing an FRP precursor and a device for producing an FRP precursor, wherein the said FRP precursor is excellent in impregnability of a thermosetting resin as well as in heat resistance of the FRP precursor to be obtained. The method for producing the FRP precursor, wherein each of one pair of thermosetting resin films 54 are adhered to each of both surfaces 40a and 40b of an aggregate 40 in a form of a sheet, comprises: an attaching process to attach an organic solvent 13a to the both surfaces 40a and 40b of the aggregate 40; a film press-adhering process wherein under a normal pressure, each of the aggregate-side film surfaces 54a of the pair of the films 54 and 54 is press-adhered to each of the both surfaces 40a and 40b of the soaked aggregate 40 to obtain the FRP precursor 60; and an attached amount adjusting process to adjust amount of the organic solvent 13a that is attached to the soaked aggregate 40.

Abstract: The invention aims at providing a container for refill that enables transfer of the contents with one action and successfully secure the self-supporting property of the container for allowing the safe transfer. The opening portion (2A) of body (2) of a cup-shaped container is provided internally with a hopper (3) tapering toward the opening portion (2A). Ribs (12) are integrally provided between the outside of the hopper (3) and the inside of a ring (3A) and arranged circumferentially at predetermined intervals. Height H from the top surface of the rib (12) to the opening (3C) of hopper (3) is approximately a quarter or more of diameter ? of the opening (3C) of hopper (3).

Abstract: A cleaning device including a cleaning blade configured to clean a surface of a cleaning target that is moving. A leading edge which is formed between lower and leading surfaces of the cleaning blade is obtuse-angled with respect to the lower surface and is in contact with the surface of the cleaning target during use. The leading surface of the cleaning blade is curved outward when the cleaning blade is not in contact with the cleaning target.

Abstract: Provided are an adhesive sheet having a conductive die attach film that is superior in semiconductor chip-holding efficiency and pick-up efficiency and an electronic component prepared by using the adhesive sheet. An adhesive sheet, including a base film, an adhesive layer laminated on one face of the base film and a die attach film containing a conductive filler laminated on the adhesive layer, wherein the adhesive layer is shaped from a bonding composition containing a multifunctional isocyanate curing agent: 0.5 to 20 parts by mass with respect to a (meth)acrylic ester copolymer having a carboxyl group-containing monomer's copolymerization rate of less than 0.5%:100 parts by mass.

Abstract: The invention relates to a lid with barrier property having highly improved barrier property, sealing ability for cups, and ease of opening in comparison with the conventional products. The innermost layer is a resin layer including a polyethylene sealant layer, and a metal foil layer is attached to the outside of the resin layer of the innermost layer via an adhesive layer. The innermost layer is provided with a plurality of weakened portions extending radially from the center. The weakened portions facilitate tearing the innermost layer and also the metal foil layer, thereby facilitating opening of the lid.