Patents by Inventor Takeshi Shinagawa

Takeshi Shinagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Air-conditioning system
    Patent number: 7607888
    Abstract: An air-conditioning system able to suppress an increase in size of the joint of an air-conditioner case and improve a sealing ability of the joint, wherein a split case member 11 has an engagement projection 112 provided with a recess 113 and a split case member 12 has an engagement groove 122 provided with a projection 123, the engagement projection 112 and engagement groove 122 being mated to engage the recess 113 and projection 123. Even without providing a plurality of sets of engagement projections 112 and engagement grooves 122, the sealing ability can be improved. Further, the sealing ability can be improved even without making the size of the engagement location larger.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: October 27, 2009
    Assignee: DENSO Corporation
    Inventors: Ryoji Hori, Shuichi Tamaki, Hirofumi Sugai, Takeshi Shinagawa
  • Air-conditioning system
    Publication number: 20070105421
    Abstract: An air-conditioning system able to suppress an increase in size of the joint of an air-conditioner case and improve a sealing ability of the joint, wherein a split case member 11 has an engagement projection 112 provided with a recess 113 and a split case member 12 has an engagement groove 122 provided with a projection 123, the engagement projection 112 and engagement groove 122 being mated to engage the recess 113 and projection 123. Even without providing a plurality of sets of engagement projections 112 and engagement grooves 122, the sealing ability can be improved. Further, the sealing ability can be improved even without making the size of the engagement location larger.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 10, 2007
    Applicant: DENSO Corporation
    Inventors: Ryoji Hori, Shuichi Tamaki, Hirofumi Sugai, Takeshi Shinagawa
  • Semiconductor device with an insulating film separating conductive layers and method of maufacturing semiconductor device
    Patent number: 5652449
    Abstract: A semiconductor device comprises a lower conductive layer formed on a semiconductor substrate, a first insulation film layer formed at least on side faces of the lower conductive layer, a second insulation film layer formed around the lower conductive layer on which the first insulation film layer has been formed, a contact hole formed on the second insulation film layer in the vicinity of a side face of the lower conductive layer, and an upper conductive layer formed in the contact hole and over the second insulation film. The first insulation film layer is of a three-film structure comprising a first oxide film, a nitride film and a second oxide film.
    Type: Grant
    Filed: November 23, 1990
    Date of Patent: July 29, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takeshi Shinagawa, Seiichi Mori