Abstract: An information processing device includes; a memory; and a processor coupled to the memory and configured to: optimize performance of a mixture of a plurality of substances; in an energy function formula for weighting each of a plurality of physical properties in the mixture and performing a calculation to optimize the performance of the mixture, collectively incorporate a plurality of the physical properties that has a relationship correlated with one characteristic among the plurality of the physical properties into the energy function formula as the one characteristic; and simplify the energy function formula.

Abstract: A loop heat pipe includes an evaporator configured to vaporize a working fluid, a condenser configured to liquefy the working fluid, a liquid line connecting the evaporator and the condenser, and a vapor line connecting the evaporator and the condenser. The evaporator, the condenser, the liquid line, and the vapor line are formed by stacking a lowermost metallic layer, an uppermost metallic layer, and an intermediate layer set formed of a plurality of metallic layers, which is provided between the uppermost metallic layer and the lowermost metallic layer. The evaporator, the liquid line, the condenser, and the vapor line form a loop-shaped flow path through which the working fluid flows, and a portion of the flow path is formed in the intermediate layer set.

Abstract: A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

Abstract: A mixture physical property identification method for a computer to execute a process includes, creating a prediction term for predicting at least one physical property of a mixture of a plurality of candidate substances; and identifying the physical property of the mixture, when the first learning datasets and the corresponding datasets do not demonstrate the certain correlation, obtaining virtual datasets based on an integration model, and setting at least some of the virtual datasets as second learning datasets, and comparing the first learning datasets with corresponding datasets corresponding to the first learning datasets in a second prediction model based on the second learning datasets, when the first learning datasets and the corresponding datasets demonstrate the certain correlation, the prediction term is created based on regression coefficients of the respective candidate substances obtained from the second prediction model.

Abstract: An information processing device includes; a memory; and a processor coupled to the memory and configured to: optimize performance of a mixture of a plurality of substances; in an energy function formula for weighting each of a plurality of physical properties in the mixture and performing a calculation to optimize the performance of the mixture, collectively incorporate a plurality of the physical properties that has a relationship correlated with one characteristic among the plurality of the physical properties into the energy function formula as the one characteristic; and simplify the energy function formula.

Abstract: A loop heat pipe includes an evaporator configured to vaporize a working fluid, a condenser configured to liquefy the working fluid, a liquid line connecting the evaporator and the condenser, and a vapor line connecting the evaporator and the condenser. The evaporator, the condenser, the liquid line, and the vapor line are formed by stacking a lowermost metallic layer, an uppermost metallic layer, and an intermediate layer set formed of a plurality of metallic layers, which is provided between the uppermost metallic layer and the lowermost metallic layer. The evaporator, the liquid line, the condenser, and the vapor line form a loop-shaped flow path through which the working fluid flows, and a portion of the flow path is formed in the intermediate layer set.

Abstract: A loop heat pipe includes an evaporator configured to evaporate a liquid phase working fluid to generate vapor, the evaporator including first and second inner surfaces that face each other; a comb-like porous body including a plurality of comb teeth, the comb-like porous body being disposed inside the evaporator; a plurality of grooves disposed on one of the first inner surface and second inner surface so as to overlap the plurality of comb teeth; a vapor transport line configured to transport the vapor of the working fluid; a condenser configured to liquefy the vapor of the working fluid; and a liquid transport line configured to transport the liquified vapor as a liquid phase working fluid, wherein each of the liquid transport line and the vapor transport line connects the evaporator and the condenser, such that the vapor transport line and the liquid transport line form a loop-like flow passage.

Abstract: Disclosed loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid line connecting the evaporator and the condenser; a porous body provided in a columnar shape in the liquid line; and a vapor line connecting the evaporator and the condenser, and forming a loop together with the liquid line.

Abstract: A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

Abstract: A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

Abstract: A loop heat pipe includes an evaporator configured to evaporate a liquid phase working fluid to generate vapor, the evaporator including first and second inner surfaces that face each other; a comb-like porous body including a plurality of comb teeth, the comb-like porous body being disposed inside the evaporator; a plurality of grooves disposed on one of the first inner surface and second inner surface so as to overlap the plurality of comb teeth; a vapor transport line configured to transport the vapor of the working fluid; a condenser configured to liquefy the vapor of the working fluid; and a liquid transport line configured to transport the liquified vapor as a liquid phase working fluid, wherein each of the liquid transport line and the vapor transport line connects the evaporator and the condenser, such that the vapor transport line and the liquid transport line form a loop-like flow passage.

Abstract: A loop heat pipe includes an evaporator; a condenser; a first pipe configured to connect the evaporator and the condenser and in which vapor-phase working fluid flows; and a second pipe configured to connect the condenser and the evaporator and in which liquid-phase working fluid flows, wherein the evaporator, the condenser, the first pipe, and the second pipe is joined to a first tabular and a second tabular, respectively, the first tabular includes a first recessed section in a region to be formed as the evaporator and a region to be formed as a condensation pipe configuring the condenser and the second tabular includes a second recessed section in the region to be formed as the evaporator, the region to be formed as the condensation pipe.

Abstract: A loop heat-pipe includes an evaporator; a condenser; a first line which connects the evaporator to the condenser and in which working fluid of vapor phase flows; and a second line which connects the condenser to the evaporator and in which working fluid of liquid phase flows, wherein each of the evaporator, the condenser, the first line, and the second line is bonded to a first and second plate, the first plate includes in a region for the evaporator: first protrusions that extend in a length direction, and second protrusions that extend in a width direction, which intersects with the length direction; the second plate includes in a region for the evaporator: either or both of third protrusions extending in the length direction and fourth protrusions extending in the width direction, and recesses partitioned by either or both of the third protrusions and the fourth protrusions.

Abstract: A loop heat pipe includes an evaporator; a condenser; a first pipe configured to connect the evaporator and the condenser and in which vapor-phase working fluid flows; and a second pipe configured to connect the condenser and the evaporator and in which liquid-phase working fluid flows, wherein the evaporator, the condenser, the first pipe, and the second pipe is joined to a first tabular and a second tabular, respectively, the first tabular includes a first recessed section in a region to be formed as the evaporator and a region to be formed as a condensation pipe configuring the condenser and the second tabular includes a second recessed section in the region to be formed as the evaporator, the region to be formed as the condensation pipe.

Abstract: A loop heat-pipe includes an evaporator; a condenser; a first line which connects the evaporator to the condenser and in which working fluid of vapor phase flows; and a second line which connects the condenser to the evaporator and in which working fluid of liquid phase flows, wherein each of the evaporator, the condenser, the first line, and the second line is bonded to a first and second plate, the first plate includes in a region for the evaporator: first protrusions that extend in a length direction, and second protrusions that extend in a width direction, which intersects with the length direction; the second plate includes in a region for the evaporator: either or both of third protrusions extending in the length direction and fourth protrusions extending in the width direction, and recesses partitioned by either or both of the third protrusions and the fourth protrusions.

Abstract: A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

Abstract: A semiconductor device includes: a first semiconductor element; a first substrate provided on the first semiconductor element and including a cavity with reduced pressure; coolant held inside the cavity; a second semiconductor element provided on the first substrate; and a heat spreading member thermally connected to the first substrate and provided with a hole communicated with the cavity.

Abstract: Recesses are formed on one surface of a substrate. A conductive film covers an inner surface of each of the recesses. This conductive film contacts a bump of a semiconductor device to be inspected and is electrically connected to the bump. It is therefore possible to prevent damages of the bump to be caused by contact of a probe pin.

Abstract: A loop heat pipe system includes a loop heat pipe (LHP), a temperature sensor, a heater and a controller. The temperature sensor measures temperature of a working fluid portion of the LHP in which the working fluid has different phases depending on whether or not the LHP is in a disable status not to start up a heat transportation, in which a liquid phase of the working fluid does not exist in an evaporator of the LHP. The heater heats a heating target part of a vapor line. The controller, in order to start up the LHP, turns on the heater, monitors temperature of the heating target part using the temperature sensor, and turns off the heater when detecting a change in the monitored temperature, caused by condensation of a vapor phase of the working fluid.

Abstract: Disclosed loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid line connecting the evaporator and the condenser; a porous body provided in a columnar shape in the liquid line; and a vapor line connecting the evaporator and the condenser, and forming a loop together with the liquid line.