Abstract: A wiring body includes: a resin portion; and a conductor portion disposed on the resin portion and that has a mesh shape in which first conductor wires and second conductor wires intersect with one another. The conductor portion includes a wide portion disposed to correspond to an intersection portion where one of the first conductor wires intersects with one of the second conductor wires, and following Formula (1) is satisfied: 6<Sc/(La×Lb)?30 . . . (1) where Sc is an area of the wide portion, La is a width of one of the first conductor wires, and Lb is a width of one of the second conductor wires.

Abstract: A conductor-layer-equipped structure includes: a wiring body that includes a first resin layer, a first conductor layer provided on the first resin layer, and a second resin layer provided on the first resin layer so as to cover the first conductor layer; a cover glass that is in direct contact with one main surface of the wiring body or adheres to the one main surface of the wiring body via a first adhesion layer; and a liquid crystal panel that is in direct contact with the another main surface of the wiring body or adheres to the another main surface of the wiring body via a second adhesion layer. The first resin layer includes a material having optical isotropy. The second resin layer includes a material having optical isotropy. The material of the first resin layer and the material of the second resin layer have the same composition.

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer including a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer including a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Abstract: A wiring body includes a main body portion including a first layered portion. The first layered portion includes a resin portion and a conductor portion disposed on the resin portion. The wiring body further includes an overcoat portion disposed on the main body portion and that covers the conductor portion. Surface roughness of a first main surface of the main body portion is greater than surface roughness of a second main surface of the overcoat portion. The first main surface is on a side opposite to the overcoat portion, and the second main surface is on a side opposite to the main body portion.

Abstract: A wiring body includes: a first lead wire that is connected to a first electrode; and a second lead wire that is connected to a second electrode. The first lead wire includes: a first connection portion that is connected to the first electrode; and a first linear portion that has a first end portion connected to the first connection. The second lead wire includes: a second connection portion that is connected to the second electrode; and a second linear portion that has a second end portion connected to the second connection. The first linear portion includes: a first portion that is disposed on a side of the first end portion with respect to the second end portion in the first direction; and a second portion that is disposed on a side opposite to the first end portion with respect to the second end portion in the first direction.

Abstract: A conductor-layer-equipped structure includes: a wiring body that includes a first resin layer, a first conductor layer provided on the first resin layer, and a second resin layer provided on the first resin layer so as to cover the first conductor layer; a cover glass that is in direct contact with one main surface of the wiring body or adheres to the one main surface of the wiring body via a first adhesion layer; and a liquid crystal panel that is in direct contact with the another main surface of the wiring body or adheres to the another main surface of the wiring body via a second adhesion layer. The first resin layer includes a material having optical isotropy. The second resin layer includes a material having optical isotropy. The material of the first resin layer and the material of the second resin layer have the same composition.

Abstract: A wiring body includes a resin layer, an electrode layer provided on a surface of the resin layer at one side and including a first line-like conductor layer, and a lead wiring layer provided on the surface of the resin layer at the one side and including one second line-like conductor layer. The at least one second line-like conductor layer is formed integrally with the electrode layer. The lead wiring layer has a single-layer structure made of a material having same composition as that of a material of which the electrode layer is made, and a following Expression is satisfied: T1<T2. T1 is a thickness of the first line-like conductor layer, and T2 is a thickness of the second line-like conductor layer.

Abstract: A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1?H2|<T1/3 where H1 is a maximum height of the second conductor wire in a first region corresponding to the first conductor wire in a first predetermined sectional surface crossing the wiring body along the second conductor wire, H2 is a minimum height of the second conductor wire in a second region that is adjacent to the first region and has the same width as that of the first region in the first predetermined sectional surface, and T1 is a thickness of the first conductor wire in the first predetermined sectional surface.

Abstract: A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1?H2|<T1/3 where H1 is a maximum height of the second conductor wire in a first region corresponding to the first conductor wire in a first predetermined sectional surface crossing the wiring body along the second conductor wire, H2 is a minimum height of the second conductor wire in a second region that is adjacent to the first region and has the same width as that of the first region in the first predetermined sectional surface, and T1 is a thickness of the first conductor wire in the first predetermined sectional surface.

Abstract: A wiring body for a touch sensor includes a first resin layer, a first conductor layer provided on the first resin layer and including a first conductor line, a second resin layer covering the first conductor layer, and a second conductor layer provided above the first conductor layer via the second resin layer and including a second conductor line. The first and second conductor layers are electrically insulated by the second resin layer, a following Expression is satisfied: D1<D2. D1 is a thickness of the first resin layer in a first region corresponding to the first conductor line in a first predetermined cross-section that crosses the wiring body along the second conductor line, and D2 is a thickness of the second resin layer in the first region of the first predetermined cross-section.

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer that includes a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer that includes a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Abstract: A wiring body includes an adhesive layer, a first conductor layer disposed on the adhesive layer including a first terminal portion, a resin layer covering the first conductor layer except for at least the first terminal portion, and a second conductor layer disposed on the resin layer including a second terminal portion. The first terminal portion and the second terminal portion are shifted from each other along a thickness direction of the adhesive layer. The first terminal portion protrudes towards a side separated from the adhesive layer in the thickness direction. In a case where the first terminal portion is projected in a direction orthogonal to the thickness direction, at least a part of a projection portion of the first terminal portion overlaps with the resin layer.

Abstract: A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1?H2|<T1/3 where H1 is a maximum height of the second conductor wire in a first region corresponding to the first conductor wire in a first predetermined sectional surface crossing the wiring body along the second conductor wire, H2 is a minimum height of the second conductor wire in a second region that is adjacent to the first region and has the same width as that of the first region in the first predetermined sectional surface, and T1 is a thickness of the first conductor wire in the first predetermined sectional surface.