Abstract: A therapeutic instrument (20), includes: a support member (25) having a tongue-shaped supporting portion (50) for supporting a sheet-like therapeutic agent; a nozzle member (23) having a cylindrical portion (30) in which the supporting portion (50) supporting the therapeutic agent can be housed, and having an opening (34) through which the supporting portion (50) can be loaded and unloaded in/from a tip of the cylindrical portion (30); a syringe unit (22) that acts a positive pressure in the cylindrical portion (30) for pushing-out the therapeutic agent housed in the cylindrical portion (30) together with the supporting portion (50) to outside the cylindrical portion (30) through the opening (34); and a water flow forming part including a plurality of protrusions (53) formed on a surface of the supporting portion (50) so as to form a water flow at a place where the supporting portion (50) and the therapeutic agent are facing each other, when a medical water is fed into the cylindrical portion (30) in a state

Abstract: A therapeutic instrument (20), includes: a support member (25) having a tongue-shaped supporting portion (50) for supporting a sheet-like therapeutic agent; a nozzle member (23) having a cylindrical portion (30) in which the supporting portion (50) supporting the therapeutic agent can be housed, and having an opening (34) through which the supporting portion (50) can be loaded and unloaded in/from a tip of the cylindrical portion (30); a syringe unit (22) that acts a positive pressure in the cylindrical portion (30) for pushing-out the therapeutic agent housed in the cylindrical portion (30) together with the supporting portion (50) to outside the cylindrical portion (30) through the opening (34); and a water flow forming part including a plurality of protrusions (53) formed on a surface of the supporting portion (50) so as to form a water flow at a place where the supporting portion (50) and the therapeutic agent are faced each other, when a medical water is fed into the cylindrical portion (30) in a state i

Abstract: The main sensor 15 measures the distance Lm to the surface of the pad 2a, and the sub-sensor 16 measures the distance Ls to the surface of the reference block 12. What is actually taken as the measured value is the value of (Lm+Ls). The reference block 12 is used in order to give a reference position for measuring the surface position of the pad 2a. Accordingly, correct measurements can be performed even if the position of the movable element 9 should fluctuate, for example, as a result of deformation of the guiding and holding plate 7 or guide 8. When the motor 11 is caused to rotate, the ball screw 10 rotates, so that the movable element 9 moves leftward and rightward, and the distance to the pad 2a is measured. From the measured data of this distance, the circular-conical vertical angle, groove depth, thickness, and the like of the pad 2a are determined.

Abstract: The main sensor 15 measures the distance Lm to the surface of the pad 2a, and the sub-sensor 16 measures the distance Ls to the surface of the reference block 12. What is actually taken as the measured value is the value of (Lm+Ls). The reference block 12 is used in order to give a reference position for measuring the surface position of the pad 2a. Accordingly, correct measurements can be performed even if the position of the movable element 9 should fluctuate, for example, as a result of deformation of the guiding and holding plate 7 or guide 8. When the motor 11 is caused to rotate, the ball screw 10 rotates, so that the movable element 9 moves leftward and rightward, and the distance to the pad 2a is measured.

Abstract: The main sensor 15 measures the distance Lm to the surface of the pad 2a, and the sub-sensor 16 measures the distance Ls to the surface of the reference block 12. What is actually taken as the measured value is the value of (Lm+Ls). The reference block 12 is used in order to give a reference position for measuring the surface position of the pad 2a. Accordingly, correct measurements can be performed even if the position of the movable element 9 should fluctuate, for example, as a result of deformation of the guiding and holding plate 7 or guide 8. When the motor 11 is caused to rotate, the ball screw 10 rotates, so that the movable element 9 moves leftward and rightward, and the distance to the pad 2a is measured. From the measured data of this distance, the circular-conical vertical angle, groove depth, thickness, and the like of the pad 2a are determined.

Abstract: The main sensor 15 measures the distance Lm to the surface of the pad 2a, and the sub-sensor 16 measures the distance Ls to the surface of the reference block 12. What is actually taken as the measured value is the value of (Lm+Ls). The reference block 12 is used in order to give a reference position for measuring the surface position of the pad 2a. Accordingly, correct measurements can be performed even if the position of the movable element 9 should fluctuate, for example, as a result of deformation of the guiding and holding plate 7 or guide 8. When the motor 11 is caused to rotate, the ball screw 10 rotates, so that the movable element 9 moves leftward and rightward, and the distance to the pad 2a is measured.

Abstract: Methods and apparatus for applying a uniform polishing pressure on a wafer are disclosed. According to one aspect of the present invention, a chemical mechanical planarization polishing apparatus includes a polishing pad, a wafer holder, and a force control system. The wafer holder supports a wafer to be polished using the polishing pad. The polishing pad is arranged to move relative to the wafer holder such that an area of contact between the wafer holder and the polishing pad varies. The force control system including a controller and a plurality of actuators that apply forces to the polishing pad. The controller controls the forces as the area of contact varies to substantially maintain a first polishing pressure on the wafer arranged to be supported by the wafer holder.

Abstract: A tool assembly affording a wider range of adjustment of machining diameter, comprises a boring bar and a tool cartridge supporting a cutting tip and attached to the boring bar. The tool cartridge chassis is pivotably attached via a pin within a recess formed in boring bar; an adjustment screw is provided to a first side of the pivot axis, the screw being threaded into the cartridge chassis and situated in abutment with a surface of the bar. A compression spring is provided to a second side of the pivot axis, interposed between the boring bar and the cartridge chassis. Appreciable pivotal motion can be imparted to the cartridge chassis by loosening or tightening the adjustment screw. Adjustments can be made automatically by providing a draw-bar.

Abstract: A tool assembly affording a wider range of adjustment of machining diameter, comprises a boring bar and a tool cartridge supporting a cutting tip and attached to the boring bar. The tool cartridge chassis is pivotably attached via a pin within a recess formed in boring bar; an adjustment screw is provided to a first side of the pivot axis, the screw being threaded into the cartridge chassis and situated in abutment with a surface of the bar. A compression spring is provided to a second side of the pivot axis, interposed between the boring bar and the cartridge chassis. Appreciable pivotal motion can be imparted to the cartridge chassis by loosening or tightening the adjustment screw. Adjustments can be made automatically by providing a draw-bar.