Patents by Inventor Takeshi Sunaga
Takeshi Sunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10186496Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.Type: GrantFiled: March 30, 2017Date of Patent: January 22, 2019Assignee: ROHM CO., LTD.Inventors: Akihiro Kimura, Takeshi Sunaga
-
Patent number: 10160883Abstract: There is provided a room-temperature-curable polyorganosiloxane composition having low viscosity and good coatability without any solvent and forming a cured coating film excellent in scratch resistance. The room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of a mixture of (A1) 10 to 80 parts by mass of a polyorganosiloxane having two or more alkoxy groups bonded to silicon atoms and a prescribed viscosity, and (A2) 90 to 20 parts by mass of a polyorganosiloxane represented by an average composition formula: R1aSi(OR2)bO{4?(a+b)}/2 (R1 and R2 represent prescribed group respectively, and a and b are prescribed positive numbers), having an Mw of 2,000 to 100,000 and a three-dimensional network structure, and being in a solid state or in a semisolid state at normal temperature; and (B) 0.1 to 15 parts by mass of an organic titanium compound.Type: GrantFiled: June 23, 2016Date of Patent: December 25, 2018Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Isao Iida, Takeshi Sunaga
-
Publication number: 20170207192Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.Type: ApplicationFiled: March 30, 2017Publication date: July 20, 2017Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA
-
Publication number: 20170162486Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.Type: ApplicationFiled: February 23, 2017Publication date: June 8, 2017Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
-
Patent number: 9653384Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.Type: GrantFiled: April 5, 2016Date of Patent: May 16, 2017Assignee: ROHM CO., LTD.Inventors: Akihiro Kimura, Takeshi Sunaga
-
Patent number: 9613927Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.Type: GrantFiled: June 25, 2015Date of Patent: April 4, 2017Assignee: Rohm Co., Ltd.Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
-
Publication number: 20160304745Abstract: There is provided a room-temperature-curable polyorganosiloxane composition having low viscosity and good coatability without any solvent and forming a cured coating film excellent in scratch resistance. The room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of a mixture of (A1) 10 to 80 parts by mass of a polyorganosiloxane having two or more alkoxy groups bonded to silicon atoms and a prescribed viscosity, and (A2) 90 to 20 parts by mass of a polyorganosiloxane represented by an average composition formula: R1aSi(OR2)bO{4?(a+b)}/2 (R1 and R2 represent prescribed group respectively, and a and b are prescribed positive numbers), having an Mw of 2,000 to 100,000 and a three-dimensional network structure, and being in a solid state or in a semisolid state at normal temperature; and (B) 0.1 to 15 parts by mass of an organic titanium compound.Type: ApplicationFiled: June 23, 2016Publication date: October 20, 2016Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Isao IIDA, Takeshi SUNAGA
-
Publication number: 20160218052Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.Type: ApplicationFiled: April 5, 2016Publication date: July 28, 2016Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA
-
Patent number: 9331041Abstract: A semiconductor device includes a semiconductor chip, and a terminal connected with the semiconductor chip. The terminal has a first surface and a second surface spaced from each other in a thickness direction. The semiconductor device also includes a sealing resin covering the semiconductor chip and the terminal. The sealing resin is so configured that the first surface of the terminal is exposed from the sealing resin. The terminal is formed with an opening to be filled with the sealing resin.Type: GrantFiled: August 7, 2013Date of Patent: May 3, 2016Assignee: ROHM CO., LTD.Inventors: Takeshi Sunaga, Akihiro Kimura
-
Patent number: 9324677Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.Type: GrantFiled: April 2, 2012Date of Patent: April 26, 2016Assignee: ROHM CO., LTD.Inventors: Akihiro Kimura, Takeshi Sunaga
-
Publication number: 20150294952Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.Type: ApplicationFiled: June 25, 2015Publication date: October 15, 2015Inventors: Akihiro KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
-
Patent number: 9093434Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.Type: GrantFiled: April 3, 2012Date of Patent: July 28, 2015Assignee: ROHM CO., LTD.Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
-
Publication number: 20140027891Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formedType: ApplicationFiled: April 3, 2012Publication date: January 30, 2014Applicant: ROHM CO., LTD.Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
-
Publication number: 20140021627Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.Type: ApplicationFiled: April 2, 2012Publication date: January 23, 2014Applicant: ROHM CO., LTD.Inventors: Akihiro Kimura, Takeshi Sunaga
-
Publication number: 20130320527Abstract: A semiconductor device includes a semiconductor chip, and a terminal connected with the semiconductor chip. The terminal has a first surface and a second surface spaced from each other in a thickness direction. The semiconductor device also includes a sealing resin covering the semiconductor chip and the terminal. The sealing resin is so configured that the first surface of the terminal is exposed from the sealing resin. The terminal is formed with an opening to be filled with the sealing resin.Type: ApplicationFiled: August 7, 2013Publication date: December 5, 2013Applicant: Rohm Co., Ltd.Inventors: Takeshi SUNAGA, Akihiro KIMURA
-
Publication number: 20080311376Abstract: The present invention improves abrasion resistance and persistence of anti-fogging properties of an anti-fogging article. The anti-fogging article of the present invention includes an article, a porous film formed on the surface thereof, and a hydrophilic film formed thereon. The porous film contains inorganic fine particles and a binder. The binder covers at least a part of surfaces of the inorganic fine particles and is interposed between the inorganic fine particles. The binder contains a metal oxide as its main component and a hydrophilic organic group other than an alkoxyl group. The hydrophilic film contains a hydrophilic organic polymer.Type: ApplicationFiled: July 29, 2005Publication date: December 18, 2008Applicant: NIPPON SHEET GLASS COMPANY LIMITEDInventors: Mizuho Matsuda, Kazutaka Kamitani, Takeshi Sunaga, Takeshi Yabuta
-
Coating resin composition containing hydrolyzable organosilane, acrylic resin and polyorganosiloxane
Patent number: 6329456Abstract: A coating resin composition is able to form a coating film having not only high hardness and weatherability but also high toughness, and can be cured both at room temperature and by heating curing, and further which is good at storage stability. The coating resin composition consists essentially of a silica-dispersed oligomer solution of organosilane prepared by partially hydrolyzing a hydrolyzable organosilane represented by a formula R1nSiX4−n, in colloidal silica dispersed in an organic solvent, water or a mixture thereof, and an acrylic resin which is a copolymer of acrylate or methacrylate represented by a formula, CH2═CR2(COOR3), and a curing catalyst. This composition is used by separating the components into two solutions and then mixing thereof as required. A resin-coated article comprises a cured resin layer of the coating resin composition on the surface of a substrate.Type: GrantFiled: May 17, 2000Date of Patent: December 11, 2001Assignees: Matsushita Electric Works, Ltd., Toshiba Silicone Co., Ltd.Inventors: Junko Okibe, Minoru Inoue, Motoaki Haruna, Ayumu Yasuda, Takeshi Sunaga, Yasuyo Iwabuchi, Norio Sato -
Patent number: 6090873Abstract: A coating resin composition is able to form a coating film having not only high hardness and weatherability but also high toughness, and can be cured both at room temperature and by heating curing, and further which is good at storage stability.The coating resin composition consists essentially of a silica-dispersed oligomer solution of organosilane prepared by partially hydrolyzing a hydrolyzable organosilane represented by a formula R.sup.1.sub.n SiX.sub.4-n, in colloidal silica dispersed in an organic solvent, water or a mixture thereof, and an acrylic resin which is a copolymer of acrylate or methacrylate represented by a formula, CH.sub.2 .dbd.CR.sup.2 (COOR.sup.3), and a curing catalyst. This composition is used by separating the components into two solutions and then mixing thereof as required. A resin-coated article comprises a cured resin layer of the coating resin composition on the surface of a substrate.Type: GrantFiled: December 20, 1996Date of Patent: July 18, 2000Assignees: Matsushita Electric Works, Ltd., Toshiba Silicone Co. Ltd.Inventors: Junko Okibe, Minoru Inoue, Motoaki Haruna, Ayumu Yasuda, Takeshi Sunaga, Yasuyo Iwabuchi, Norio Sato
-
Patent number: 5115069Abstract: A glycidoxy group-containing organosilicon compound represented by formula (I) ##STR1## wherein R which may be the same or different each represents an alkyl group, an aryl group, or an alkenyl group, and n is 0 or an integer of 1 to 1,000. The compound is useful for modification of interfacial properties of various synthetic resins such as epoxy resins, polyesters, polyurethanes, polyamides and polyimides.Type: GrantFiled: March 27, 1990Date of Patent: May 19, 1992Assignee: Toshiba Silicone Co., Ltd.Inventors: Hisao Motegi, Takeshi Sunaga, Michio Zenbayashi
-
Patent number: 5113000Abstract: An organosilicon compound represented by the general formula: ##STR1## where R.sup.1 represents a substituted or non-substituted monovalent hydrocarbon group, X represents a chloromethyl group, (meth)acryloxymethyl group, glycidoxymethyl group or aminomethyl group, Y represents a hydrolyzable group or hydroxyl group, n represents a number of 1, 2 or 3. The compound is useful, for example, for the improvement of adhesion between the organic and inorganic materials.Type: GrantFiled: December 5, 1990Date of Patent: May 12, 1992Assignee: Toshiba Silicone Co., Ltd.Inventors: Hisao Motegi, Takeshi Sunaga, Michio Zembayashi