Abstract: A group of solar cell elements is obtained by connecting a plurality of solar cell elements in series or in parallel by metal foil members, which is characterized in that an insulating tape is adhered in parallel with the metal foil members on and across the back surfaces of the plurality of solar cell elements arranged next to each other. The insulating tape is characterized by comprising a base member of a resin, for example polyethylene terephthalate (PET). A solar cell module is characterized in that the above group of solar cell elements is covered with a polymeric organic resin. Further, a method for producing the solar cell module comprises a step of adjacently arranging a plurality of solar cell elements, a step of adhering an insulating tape on the back surfaces of the plurality of solar cell elements, a step of connecting the plurality of solar cell elements in series or in parallel by metal foil members, and a step of covering the elements with a polymeric organic resin.

Abstract: In a photovoltaic device comprising a conductive base plate having four side edges, at least one conductive foil having a higher conductivity than the conductive base plate is provided in contact with the conductive base plate along at least one side edge of the conductive base plate. The conductive foil is preferably provided on the non-light-receiving surface of the photovoltaic device, and comprises copper as a main ingredient. The conductive foil preferably has a thickness in the range of 70 .mu.m to 150 .mu.m and is provided along each of two side edges of the conductive base plate facing each other. The conductive base plate is a base plate made of stainless steel. In the photovoltaic device and a manufacture method thereof, the conductive foil and the conductive base plate are connected together by ultrasonic welding.

Abstract: A periphery exposing apparatus for exposing a periphery of a wafer having a curved circumferential peripheral portion and a linear portion comprises a spin chuck for rotatably supporting the wafer, a light source disposed above the spin chuck for exposing the wafer periphery, and a detector for detecting the line or portion. When the linear portion is being exposed, the light source is moved along the linear portion, rather than circularly around the periphery.

Abstract: A positioning assembly comprises a base having a pair of taller projections and a pair of shorter projections on its surface. The positioning assembly is placed between a pair of belts which form a conveying assembly, so that the taller projections receive a sheet material which is conveyed along the belts. The positioning assembly is positioned at a middle position in which the taller projections project above the belts, whereby the taller projections receive the material. Receiving the material, the positioning assembly is elevated to a high position where all the projections including the shorter one project above the belts, whereby the material is held on the base. The material is processed with being rotated at the high position. Then the positioning assembly is lowered to a low position where all the projections are below the belts, whereby the material is delivered again onto the belts to be conveyed to the next process.

Abstract: An apparatus to mount wafers for sublimation plating on a rotary type wafer holding dome having more than one wafer mounting seat of window type on its circumference comprising a wafer cassette that holds many sheets of wafers piled up with spacing and holding pieces in-between and is driven up-and-down at the same intervals as wafer mounting, a rotary arm having a sucker on the top end with the said wafer mounting seats on its rotation locus, and a conveyor mechanism to receive a piece of wafer at the end of the wafer cassette and to transfer the wafer to a position on the other rotation locus at the top end of the said rotary arm.