Abstract: A binding machine includes a body part, a feeding unit configured to feed a wire, a first guide extending in a first direction from an end portion on one side of the body part, configured to guide the wire fed by the feeding unit, and having a first induction part provided on a tip end-side in the first direction, a second guide spaced from the first guide with an interval, in which a binding object is inserted, in a second direction orthogonal to the first direction, and configured to guide the wire fed by the feeding unit, and a twisting unit configured to twist the wire. The first induction part is constituted by a surface inclined in a direction in which the interval between the first guide and the second guide decreases from a tip end-side toward a base end-side of the first induction part in the first direction.

Abstract: A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 ?m to 200 ?m and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.

Abstract: A multilayer ceramic electronic component includes external terminal electrodes that are formed by direct plating on the first and second side surfaces of a ceramic body including stacked ceramic layers and inner conductors. The external terminal electrodes include base plating films formed so as to cover the exposed portions of inner conductors. Voids are provided that are open to the side surfaces of the ceramic body so as to be adjacent to the ends in the width direction of the exposed portions of the inner conductors. A plating metal defining the base plating films enters the voids and is electrically connected to the inner conductors in the ceramic body.

Abstract: A dispersing apparatus that can efficiently disperse agglomerated particles in a slurry at a lower energy, a method for preparing a ceramic slurry containing ceramic particles that have been dispersed with the dispersing apparatus, a reliable monolithic ceramic electronic component manufactured using ceramic green sheets formed of the ceramic slurry, and a method for manufacturing the monolithic ceramic electronic component. A slurry containing agglomerated particles is passed through a dispersing section to produce a tensile stress, and the tensile stress is applied to the agglomerated particles in the slurry, thereby dispersing the agglomerated particles. The dispersing section includes a nozzle, a first channel thorough which a jet generated through the nozzle passes, and a cylindrical second channel through which the jet coming through the first channel passes to produce a tensile stress.

Abstract: The present invention provides a spacer sheet for a complex type semiconductor device provided between the semiconductor packages of a complex type semiconductor device formed by laminating plural semiconductor packages, comprising through holes of an array corresponding to electrodes which can be provided onto a substrate of one semiconductor package and which are formed in order to connect and wire one semiconductor package with the other semiconductor package and a space part corresponding to a principal part of the above one semiconductor package mounted on the substrate or a principal part of the other semiconductor package opposed to the substrate and a production process for a complex type semiconductor device in which the above spacer sheet is used.

Abstract: The present invention relates to a complex type semiconductor device formed by laminating plural semiconductor packages, wherein it comprises: an upper semiconductor package which comprises a substrate for wiring and connecting provided with electrodes for conducting packages on a lower surface in the upper semiconductor package and a principal part of the upper semiconductor package disposed on an upper surface and/or a lower surface of the above substrate and which constitutes a relatively upper part, a lower semiconductor package which comprises a substrate for wiring and connecting provided with electrodes for conducting packages on an upper surface in the lower semiconductor package and a principal part of the lower semiconductor package disposed on an upper surface and/or a lower surface of the above substrate and which constitutes a relatively lower part, a spacer sheet which comprises a space part corresponding to the principal part of the upper semiconductor package and/or the principal part of th

Abstract: A multilayer ceramic electronic component includes external terminal electrodes that are formed by direct plating on the first and second side surfaces of a ceramic body including stacked ceramic layers and inner conductors. The external terminal electrodes include base plating films formed so as to cover the exposed portions of inner conductors. Voids are provided that are open to the side surfaces of the ceramic body so as to be adjacent to the ends in the width direction of the exposed portions of the inner conductors. A plating metal defining the base plating films enters the voids and is electrically connected to the inner conductors in the ceramic body.

Abstract: A dispersing apparatus that can efficiently disperse agglomerated particles in a slurry at a lower energy, a method for preparing a ceramic slurry containing ceramic particles that have been dispersed with the dispersing apparatus, a reliable monolithic ceramic electronic component manufactured using ceramic green sheets formed of the ceramic slurry, and a method for manufacturing the monolithic ceramic electronic component. A slurry containing agglomerated particles is passed through a dispersing section to produce a tensile stress, and the tensile stress is applied to the agglomerated particles in the slurry, thereby dispersing the agglomerated particles. The dispersing section includes a nozzle, a first channel thorough which a jet generated through the nozzle passes, and a cylindrical second channel through which the jet coming through the first channel passes to produce a tensile stress.

Abstract: A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.

Abstract: A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point lowering element such as Bi, In, or Zn, and an element for improving impact resistance such as Sb may be added.