Abstract: A wireless tag includes: an antenna; an integrated circuit configured to be electrically connected to the antenna; a package configured to integrally subject the antenna and the integrated circuit to packaging; and a boundary portion configured to be located between a first portion including the integrated circuit in the package and a second portion not including the integrated circuit, wherein the boundary portion is configured so as to be more easily torn apart than a portion other than the boundary portion in the package.

Abstract: A management device includes: a memory configured to store a program including a procedure; and a processor configure to execute the program, the procedure including: acquiring a result obtained by communicating with a first wireless tag attached to each openable storage container in which location information is defined, a communicable range of the first wireless tag changing between a state where the storage container is unopened and a state where the storage container is opened, and managing information indicating an opened state of the storage container and the location information with associating the opened state of the storage container and the location information with each other, on the basis of the result of the communication with the first wireless tag.

Abstract: A wireless tag includes: an antenna; an integrated circuit configured to be electrically connected to the antenna; a package configured to integrally subject the antenna and the integrated circuit to packaging; and a boundary portion configured to be located between a first portion including the integrated circuit in the package and a second portion not including the integrated circuit, wherein the boundary portion is configured so as to be more easily torn apart than a portion other than the boundary portion in the package.

Abstract: A nonvolatile memory is accessed by a memory control circuit and stores temperature information indicating a temperature measured by a temperature sensor. A power supply control circuit supplies a first power supply voltage to the temperature sensor in response to a request for temperature measurement received via an antenna, and supplies a second power supply voltage to the nonvolatile memory and the memory control circuit after the temperature sensor measures the temperature. While the temperature sensor is measuring the temperature, the nonvolatile memory and the memory control circuit do not operate and thus do not generate heat. Therefore, the temperature sensor can accurately measure the temperature without being influenced from the heat generation caused by the operation of circuits in an RFID transponder.

Abstract: A nonvolatile memory is accessed by a memory control circuit and stores temperature information indicating a temperature measured by a temperature sensor. A power supply control circuit supplies a first power supply voltage to the temperature sensor in response to a request for temperature measurement received via an antenna, and supplies a second power supply voltage to the nonvolatile memory and the memory control circuit after the temperature sensor measures the temperature. While the temperature sensor is measuring the temperature, the nonvolatile memory and the memory control circuit do not operate and thus do not generate heat. Therefore, the temperature sensor can accurately measure the temperature without being influenced from the heat generation caused by the operation of circuits in an RFID transponder.

Abstract: A non-contact integrated circuit (IC) tag accepts a plurality of frequency bands and provides sufficient performance in a compact size by freely arranging a plurality of antennas therein such that the antennas occupy a minimum area and by preventing interference between the antennas with an insulator.

Abstract: The invention relates to a method for manufacturing a III-V system compound semiconductor device, provides such a new C dopant as alkyl halide (CH.sub.2 I.sub.2 for example) containing carbon (C), iodine (I), and hydrogen (H) for giving a highly p-type conductivity to a GaAs crystal layer, an InGaAs crystal layer or the like as an object of it, and includes a process of forming a p-type III-V system compound semiconductor layer as using a compound containing carbon (C) as a dopant material for giving a p-type conductivity and further containing iodine (I) and hydrogen (H) as impurity.

Abstract: The invention relates to a method for manufacturing a III-V system compound semiconductor device, provides such a new C dopant as alkyl halide (CH.sub.2 I.sub.2 for example) containing carbon (C), iodine (I), and hydrogen (H) for giving a highly p-type conductivity to a GaAs crystal layer, an InGaAs crystal layer or the like as an object of it, and includes a process of forming a p-type III-V system compound semiconductor layer as using a compound containing carbon (C) as a dopant material for giving a p-type conductivity and further containing iodine (I) and hydrogen (H) as impurity.

Abstract: In a spread-spectrum communication apparatus using a convolver as a correlator, demodulating processes in a receiver apparatus using a carrier and a PN code are performed under a non-synchronous condition.