Abstract: A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.

Abstract: A polyimide film which rarely undergoes the formation of bubbles, blisters or the like, even when heated to a high temperature; and a production method and a production apparatus for the polyimide film. The polyimide film production apparatus includes a support body, a cast furnace and a cure furnace, wherein the cure furnace is partitioned into multiple zones so that the temperature of a self-supporting film can be increased in a stepwise manner, and an infrared electric heater, which is disposed at a predetermined distance from the film, is arranged in a zone for heating the atmosphere of the self-supporting film to a temperature of 450° C. or higher on the upper surface side and/or the lower surface side of the self-supporting film. The polyimide production apparatus enables the production of a polyimide film which has a volatile content of 0.1 mass % or less after being heated at 450° C. for 20 minutes.

Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from ?0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.

Abstract: Provided is a method for producing a polyimide film on which a texture having an irregular profile is formed on the surface.

Abstract: An aromatic polyimide film having a TD linear expansion coefficient lower than that MD linear expansion coefficient is produced by an industrially advantageous process which is performed under such conditions that a self-supporting aromatic polyimide precursor film having a solvent content 25-45 wt % and an imidation ratio 5-40% is prepared and stretched in the transverse direction under heating initially at 80-240° C. and the stretched self-supporting aromatic polyimide precursor film is subsequently converted to a self-supporting aromatic polyimide film by heating the precursor film at 350-580° C.

Abstract: A single-layered thermally adhesive polyimide film; a method for producing the thermally adhesive polyimide film; and a method for producing a polyimide metal laminate produced using the thermally adhesive polyimide film. The single-layer thermally adhesive polyimide film is produced by polymerizing a tetracarboxylic acid dianhydride component and a diamine component, wherein the tetracarboxylic acid dianhydride component includes 2,3,3?,4?-biphenyltetracarboxylic acid dianhydride and 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride and the diamine component includes an aromatic diamine compound represented by the following formula (I) as a main component wherein X is O, CO, C(CH3)2, CH2, SO2, S, or a direct bond, and in cases of two or more modes of bonding, each is the same or different; and n is an integer of 0 to 4.

Abstract: A polyimide film which rarely undergoes the formation of bubbles, blisters or the like, even when heated to a high temperature; and a production method and a production apparatus for the polyimide film. The polyimide film production apparatus includes a support body, a cast furnace and a cure furnace, wherein the cure furnace is partitioned into multiple zones so that the temperature of a self-supporting film can be increased in a stepwise manner, and an infrared electric heater, which is disposed at a predetermined distance from the film, is arranged in a zone for heating the atmosphere of the self-supporting film to a temperature of 450° C. or higher on the upper surface side and/or the lower surface side of the self-supporting film. The polyimide production apparatus enables the production of a polyimide film which has a volatile content of 0.1 mass % or less after being heated at 450° C. for 20 minutes.

Abstract: A polyimide film having no foaming during heating or other problems, as well as a polyimide laminate-metal laminate in which the polyimide film and a metal layer are laminated. The polyimide film includes a polyimide layer (b), and a polyimide layer (a) laminated in contact with the polyimide layer (b), a side of the polyimide layer (b) which is not in contact with the polyimide layer (a) exhibits thermal fusion bondability, a side of the polyimide layer (a) which is not in contact with the polyimide layer (b) does not exhibit thermal fusion bondability, and the polyimide layer (a) includes a polyimide formed from a tetracarboxylic acid component containing 2,3,3?,4?-biphenyltetracarboxylic dianhydride and a diamine component.

Abstract: Provided are a method and apparatus for the production of a polyimide film, which allow a polyimide film having physical properties with in-plane uniformity to be produced with high productivity. In the method for the production of a polyimide film, a solvent content of a self-supporting film is measured by infrared spectroscopy, and based on the measurement result, one or more kinds selected from a drying condition of a cast of a polyimide precursor solution, a post-heating condition of the self-supporting film, and an amount of extrusion of a polyimide precursor solution from a die are controlled.

Abstract: A multilayered polyimide film including a polyimide layer (b), and a pigment-containing polyimide layer (a) stacked on one surface or both surfaces of the polyimide layer (b), wherein the polyimide layer (b) is formed of a polyimide including an aromatic tetracarboxylic acid unit containing a 3,3?,4,4?-biphenyltetracarboxylic acid unit in an amount of 70 to 100 mol %, and an aromatic diamine unit containing a p-phenylenediamine unit in an amount of 70 to 100 mol %.

Abstract: The present invention provides a polyimide film having an anisotropic thermal expansion coefficient, and comprising a polyimide layer (b) and a polyimide layer (a) on one side or both sides of the polyimide layer (b), wherein the polyimide layer (a) is a layer of a polyimide prepared from a monomer component comprising a diamine having the structure of the following formula (1): wherein R represents a monovalent group selected from the groups listed as the following formula (2): wherein R1 represents a hydrogen atom or a methyl group, and two R1 groups may be the same as, or different from each other.

Abstract: The present invention provides a polyimide film for metallizing, which has an anisotropic thermal expansion coefficient, and comprises a polyimide layer (b) and a polyimide layer (a) on one side or both sides of the polyimide layer (b); wherein the polyimide layer (b) is a layer of a polyimide prepared from an acid component comprising 3,3?,4,4?-biphenyltetracarboxylic dianhydride and a diamine component comprising p-phenylenediamine; and the polyimide layer (a) is a layer of a polyimide prepared from a monomer component comprising at least one selected from the group consisting of phenylenediamines and diaminodiphenyl ethers as a diamine component, and contains a surface treatment agent.

Abstract: An adhesion-enhanced polyimide film which includes a core layer composed of a polyimide (a) having high rigidity and a low linear expansion coefficient, at least one side of which has a thin-layer formed by heating a coated layer including a heat-resistant surface treatment agent and a polyimide precursor which yields a highly heat-resistant amorphous polyimide (B).

Abstract: An aromatic polyimide film having a TD linear expansion coefficient lower than that MD linear expansion coefficient is produced by an industrially advantageous process which is performed under such conditions that a self-supporting aromatic polyimide precursor film having a solvent content of 25-45 wt. % and an imidation ratio of 5-40% is prepared and stretched in the transverse direction under heating initially at 80-240° C. and the stretched self-supporting aromatic polyimide precursor film is subsequently converted to a self-supporting aromatic polyimide film by heating the precursor film at 350-580° C.

Abstract: A polyimide-metal laminate comprising a polyimide film and a metal layer for use as an electrode, which is formed on the side (Side B) of the polyimide film which was in contact with a support when producing a self-supporting film in the production of the polyimide film, is used to produce a CIS solar cell.

Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from ?0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.

Abstract: An adhesion-enhanced polyimide film which includes a core layer composed of a polyimide (a) having high rigidity and a low linear expansion coefficient, at least one side of which has a thin-layer formed by heating a coated layer including a heat-resistant surface treatment agent and a polyimide precursor which yields a highly heat-resistant amorphous polyimide (B).

Abstract: An aromatic polyimide film composed of a biphenyltetracarboxylic acid unit and a phenylenediamine unit, and having a thickness of 5-150 &mgr;m and an elongation of 45-90% shows, in combination with an electroconductive film, improved mechanical characteristics, when it has the following tensile modulus and a tear resistance measured by Elmendorf tearing tester: a tensile modulus of 750-1,300 kg/mm2 and a tear resistance of 350-1,500 g/mm in the case that the thickness is 50 &mgr;m or less; a tensile modulus of 650-1,200 kg/mm2 and a tear resistance of 550-1,500 g/mm in the case that the thickness is 50-100 &mgr;m; and a tensile modulus of 550-1,100 kg/mm2 and a tear resistance of 550-1,500 g/mm in the case that the thickness is 100 &mgr;m or more.