Patents by Inventor Takeshi Ukawa

Takeshi Ukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6231979
    Abstract: A self-bonding insulated wire has a bonding outermost layer formed from a resin composition prepared by adding at least two, but less than 10 parts by weight of a high-melting nylon resin having a melting point of 200° C. to 300° C., such as nylon 66 or 46, to 100 parts by weight of a copolyamide resin having a melting point of 105° C. to 150° C. The polyamide resin contains a lower molar ratio of terminal carboxyl groups than terminal amino groups.
    Type: Grant
    Filed: July 21, 1998
    Date of Patent: May 15, 2001
    Assignee: Kaneka Corporation
    Inventors: Seiichi Nagamine, Shigeo Nishita, Takeshi Ukawa, Kazushige Tamura