Patents by Inventor Takeshi Wakiya
Takeshi Wakiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11884782Abstract: Provided is a resin particle that can be uniformly brought into contact with an adherend, can effectively enhance adhesion to a conductive portion and impact resistance when electrodes are electrically connected to each other using a conductive particle having the conductive portion formed on a surface thereof, and further can effectively reduce connection resistance. In the resin particle according to the present invention, an exothermic peak is observed when differential scanning calorimetry is performed by heating the resin particle at a temperature rising rate of 5° C./min from 100° C. to 350° C. in an air atmosphere.Type: GrantFiled: March 18, 2020Date of Patent: January 30, 2024Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Hiroyuki Morita, Takeshi Wakiya
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Patent number: 11867694Abstract: The present invention relates to latex particles for measurement reagents, said latex particles having a coefficient of variation in particle diameters of 10% or less and an average particle diameter of 250 to 1000 nm. Each of the latex particles contains 20% by weight or more of a compound having a refractive index of 1.60 or more. The depth of a supernatant is 5 mm or less when a liquid dispersion having a solid matter concentration of 1% by weight, which is prepared by dispersing the latex particles in ultrapure water, is placed in a tubular 10-ml measuring cylinder having a body inner diameter of 10.8 mm and is then allowed to leave for 10 days. According to the particles, a measurement of a measurement sample can be performed at a high sensitivity even when the concentration of a substance to be tested in the measurement sample is low.Type: GrantFiled: May 24, 2018Date of Patent: January 9, 2024Assignee: SEKISUI MEDICAL CO., LTD.Inventors: Satoru Sugimoto, Takeshi Wakiya, Shinichiro Kitahara, Maasa Yaji, Yuya Inaba
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Publication number: 20230323163Abstract: There are provided optical bonding particles capable of improving the visibility and controlling gaps with high accuracy. The optical bonding particles according to the present invention include silicone particles and coating particles or a coating layer disposed on the surface of the silicone particles, and in the optical bonding particles, the absolute value of the difference between the refractive index of the silicone particles and the refractive index of the coating particles or the refractive index of the coating layer is 0.03 or less.Type: ApplicationFiled: October 15, 2020Publication date: October 12, 2023Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Saori UEDA, Takashi FUKUDA, Yasuyuki YAMADA, Takeshi WAKIYA
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Publication number: 20230167214Abstract: The present invention provides a resin composition for sintering, an inorganic fine particle-dispersed slurry composition containing the resin composition for sintering, and an inorganic fine particle-dispersed sheet formed using the resin composition for sintering or inorganic fine particle-dispersed slurry composition. The present invention relates to a resin composition for sintering, containing a binder resin, the binder resin including a (meth)acrylic resin (A), the (meth)acrylic resin (A) having at least one selected from the group consisting of a sulfone group, an alkyl sulfonyl group, an aromatic sulfonyl group, a sulfine group, an imidazoline group, a carboxy group, an amide group, an amino group, and a hydroxy group at at least one molecular end of the main chain and having a weight average molecular weight (Mw) of 1,000,000 or more, an amount of a water-soluble surfactant in the resin composition for sintering being 0 parts by weight or more and 0.Type: ApplicationFiled: December 10, 2020Publication date: June 1, 2023Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Kenji YAMAUCHI, Takeshi WAKIYA, Tatsuya MATSUKUBO, Kanako TAMAGAWA, Jo OTSUKA, Yumi KANEKO
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Publication number: 20230159720Abstract: The present invention provides a thermally expandable microcapsule that has excellent heat resistance and compression resistance and that enables the production of a foam molded article that is less likely to undergo deterioration or appearance defects over a long period of time, as well as a foamable masterbatch and a foam molded article each produced using the thermally expandable microcapsule. Provided is a thermally expandable microcapsule including a shell and a volatile expansion agent as a core agent encapsulated by the shell, the shell containing a black material and a polymer compound.Type: ApplicationFiled: April 30, 2021Publication date: May 25, 2023Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Hiroyuki MORITA, Takeshi WAKIYA, Tatsuya MATSUKUBO, Yumi KANEKO, Shuhei OBINATA
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Publication number: 20230140786Abstract: There is provided an adhesive capable of improving the visibility and controlling gaps with high accuracy. The adhesive according to the present invention is an adhesive containing a curable component and a gap material, in which the 10% K value of the gap material is 10000 N/mm2 or less, and the absolute value of the difference between the refractive index of a cured product obtained by curing the curable component at 23° C. for 1 hour and the refractive index of the gap material is 0.1 or less.Type: ApplicationFiled: October 15, 2020Publication date: May 4, 2023Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Saori UEDA, Takashi FUKUDA, Yasuyuki YAMADA, Takeshi WAKIYA
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Publication number: 20230118882Abstract: Disclosed is a sensitized magnetic responsive particle including: a magnetic responsive particle having a core particle and at least one magnetic layer disposed on the core particle, the magnetic layer containing microparticles of a magnetic metal and/or an oxide thereof; and a substance that specifically interacts with an analyte, the substance being supported on the magnetic responsive particle, wherein, assuming that a volume and a weight of the core particle are respectively vc and wc, and that a volume and a weight of the magnetic responsive particle are respectively ve and we, the magnetic material density [(we?wc)/(ve?vc)] satisfies the following expression 1: 2.0?(we?wc)/(ve?vc) ??Expression 1 The magnetic responsive particle has a high magnetic collection property in spite of a small particle size. When the magnetic responsive particle is used, a reagent for an immunoassay having excellent magnetic separability and capable of realizing high sensitivity can be provided.Type: ApplicationFiled: March 24, 2021Publication date: April 20, 2023Applicant: SEKISUI MEDICAL CO., LTD.Inventors: Maasa YAJI, Yuya INABA, Shinichiro KITAHARA, Takeshi WAKIYA, Mai YAMAGAMI, Shuhei OBINATA
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Publication number: 20230106977Abstract: The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm2 or more and 2,500 N/mm2 or less, and a 30% K value at 25° C. of 100 N/mm2 or more and 1,500 N/mm2 or less.Type: ApplicationFiled: March 26, 2021Publication date: April 6, 2023Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Kouki OOKURA, Takeshi WAKIYA
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Publication number: 20220213279Abstract: Provided is a resin particle that can be uniformly brought into contact with an adherend, can effectively enhance adhesion to a conductive portion and impact resistance when electrodes are electrically connected to each other using a conductive particle having the conductive portion formed on a surface thereof, and further can effectively reduce connection resistance. In the resin particle according to the present invention, an exothermic peak is observed when differential scanning calorimetry is performed by heating the resin particle at a temperature rising rate of 5° C./min from 100° C. to 350° C. in an air atmosphere.Type: ApplicationFiled: March 18, 2020Publication date: July 7, 2022Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Hiroyuki MORITA, Takeshi WAKIYA
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Publication number: 20220187287Abstract: Disclosed is a sensitized magnetic responsive particle including: a magnetic responsive particle having a core particle and at least one magnetic layer that is disposed on the core particle and includes microparticles of a magnetic metal and/or an oxide thereof; and a substance that is supported on the magnetic responsive Particle and interacts specifically with an analyte, wherein the coefficient of variation in the weight-average particle size of the magnetic responsive particles is 15% or less. The magnetic responsive particle provided has excellent magnetic separability.Type: ApplicationFiled: March 25, 2020Publication date: June 16, 2022Applicant: SEKISUI MEDICAL CO., LTD.Inventors: Maasa YAJI, Yuya INABA, Shinichiro KITAHARA, Mitsuaki YAMAMOTO, Takeshi WAKIYA, Mai YAMAGAMI, Shuhei OBINATA
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Patent number: 11274248Abstract: A lanthanoid-containing inorganic material fine particle having a function of converting a wavelength of light to a shorter wavelength, the lanthanoid-containing inorganic material fine particle including: a core particle; and a shell layer, the core particle containing a lanthanoid having a light-absorbing function and a lanthanoid having a light-emitting function, the shell layer including at least an outer shell containing a rare earth element, the total amount of the lanthanoid having a light-absorbing function and the lanthanoid having a light-emitting function in the outer shell being 2 mol % or less based on the amount of the rare earth element contained in the outer shell, the outer shell having a thickness of 2 to 20 nm, the core particle and the shell layer having no interface at a contact face to form a continuous body.Type: GrantFiled: January 24, 2017Date of Patent: March 15, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Taku Sasaki, Takeshi Wakiya, Kenji Oohashi
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Patent number: 11027374Abstract: Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?m or more and 15 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.Type: GrantFiled: November 18, 2016Date of Patent: June 8, 2021Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mai Yamagami, Satoshi Haneda, Takeshi Wakiya, Yasuyuki Yamada, Saori Ueda, Masao Sasadaira
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Patent number: 11024439Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.Type: GrantFiled: November 18, 2016Date of Patent: June 1, 2021Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mai Yamagami, Satoshi Haneda, Takeshi Wakiya, Yasuyuki Yamada, Saori Ueda, Masao Sasadaira
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Patent number: 11020825Abstract: A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.Type: GrantFiled: November 18, 2016Date of Patent: June 1, 2021Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mai Yamagami, Satoshi Haneda, Takeshi Wakiya, Yasuyuki Yamada, Saori Ueda, Masao Sasadaira
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Patent number: 11017916Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?m or more and 15 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 50% or less.Type: GrantFiled: November 18, 2016Date of Patent: May 25, 2021Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Mai Yamagami, Satoshi Haneda, Takeshi Wakiya, Yasuyuki Yamada, Saori Ueda, Masao Sasadaira
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Publication number: 20210061820Abstract: Metal complex particle including a magnetic material and a particle size adjusting composition containing a hydrophobic polymer, with the magnetic material including a metal complex consisting of a metal ion and a ligand and having both magnetism and fluorescence, and a content of the particle size adjusting composition in the metal complex particle being less than 60 w %.Type: ApplicationFiled: December 28, 2018Publication date: March 4, 2021Applicants: SEKISUI CHEMICAL CO., LTD., SEKISUI MEDICAL CO., LTD.Inventors: Mai YAMAGAMI, Shuhei OBINATA, Takeshi WAKIYA, Maasa YAJI
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Publication number: 20210054271Abstract: A lanthanoid-containing inorganic material fine particle having a function of converting a wavelength of light to a shorter wavelength, the lanthanoid-containing inorganic material fine particle including: a core particle; and a shell layer, the core particle containing a lanthanoid having a light-absorbing function and a lanthanoid having a light-emitting function, the shell layer including at least an outer shell containing a rare earth element, the total amount of the lanthanoid having a light-absorbing function and the lanthanoid having a light-emitting function in the outer shell being 2 mol % or less based on the amount of the rare earth element contained in the outer shell, the outer shell having a thickness of 2 to 20 nm, the core particle and the shell layer having no interface at a contact face to form a continuous body.Type: ApplicationFiled: January 24, 2017Publication date: February 25, 2021Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Taku SASAKI, Takeshi WAKIYA, Kenji OOHASHI
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Publication number: 20200181486Abstract: The present invention provides fluorescent particles for a diagnostic agent which contain a synthetic polymer and at least 10 mass %, on a total particle mass basis, of an aggregation-induced emission material, and have on the surface thereof a binding partner which binds with an analyte. These fluorescent particles for a diagnostic agent are non-toxic, have improved visibility and reproducibility, and support a binding partner for an analyte.Type: ApplicationFiled: August 31, 2017Publication date: June 11, 2020Applicants: SEKISUI CHEMICAL CO., LTD., SEKISUI MEDICAL CO., LTD.Inventors: Tadashi IWAMOTO, Satoru SUGIMOTO, Takeshi WAKIYA, Shinichiro KITAHARA, Maasa YAJI
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Publication number: 20200080996Abstract: The present invention relates to latex particles for measurement reagents, said latex particles having a coefficient of variation in particle diameters of 10% or less and an average particle diameter of 250 to 1000 nm. Each of the latex particles contains 20% by weight or more of a compound having a refractive index of 1.60 or more. The depth of a supernatant is 5 mm or less when a liquid dispersion having a solid matter concentration of 1% by weight, which is prepared by dispersing the latex particles in ultrapure water, is placed in a tubular 10-ml measuring cylinder having a body inner diameter of 10.8 mm and is then allowed to leave for 10 days. According to the particles, a measurement of a measurement sample can be performed at a high sensitivity even when the concentration of a substance to be tested in the measurement sample is low.Type: ApplicationFiled: May 24, 2018Publication date: March 12, 2020Applicants: SEKISUI CHEMICAL CO., LTD., SEKISUI MEDICAL CO., LTD.Inventors: Satoru SUGIMOTO, Takeshi WAKIYA, Shinichiro KITAHARA, Maasa YAJI, Yuya INABA
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Publication number: 20190226988Abstract: This analyte concentration measuring method including: preparing a mixed solution by mixing a sample solution containing an analyte, with a solution containing aggregation-induced emission fluorescent material-containing particles that have a binding partner which binds with the analyte and that agglutinate and fluoresce when the analyte binds to the binding partner; measuring the fluorescence intensity generated from the aggregation-induced emission fluorescent material-containing particles in the mixed solution; and comparing a fluorescence intensity calibration curve for analyte concentration with the fluorescence intensity, and associating the fluorescence intensity with the analyte concentration in the mixed solution. Employing agglutinating-luminescent-material-containing particles enables measurements to be carried out with a satisfactory detection sensitivity while suppressing background fluorescence.Type: ApplicationFiled: August 31, 2017Publication date: July 25, 2019Applicants: SEKISUI CHEMICAL CO., LTD., SEKISUI MEDICAL CO., LTD.Inventors: Tadashi IWAMOTO, Satoru SUGIMOTO, Takeshi WAKIYA, Shinichiro KITAHARA, Maasa YAJI