Patents by Inventor Takeshi Watari
Takeshi Watari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12151696Abstract: A vehicle system, including: an on-board device mounted on a vehicle; and a control device configured to control the on-board device such that the vehicle travels in a target traveling state, wherein the control device includes: a predicting portion that predicts a state of the on-board device when the vehicle travels in the target traveling state; and a modifying portion that modifies the target traveling state when the control device determines based on the state of the on-board device predicted by the predicting portion that an operation of the on-board device needs to be limited.Type: GrantFiled: April 20, 2022Date of Patent: November 26, 2024Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yuji Watari, Masaya Sato, Ryo Irie, Takeshi Kanou
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Publication number: 20240218140Abstract: Provided is a method of manufacturing a resin member. The method includes irradiating a surface of a member containing a resin and a plant powder dispersed in the resin with laser light to change the plant powder or both the resin and the plant powder into diamond-like carbon in a surface layer region including the surface of the member.Type: ApplicationFiled: December 27, 2023Publication date: July 4, 2024Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Atsushi NAKANISHI, Yuta KINE, Takeshi WATARI, Takashi KURITA, Hiroshi SATOZONO
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Publication number: 20240208822Abstract: A graphene manufacturing method includes a step of preparing a workpiece including a base material made of a resin material and a plant powder dispersed in the base material, a step of irradiating a surface of the workpiece with a terahertz wave and an evaluation laser beam and detecting the terahertz wave from the surface, a step of irradiating a processing region of the surface with a processing laser beam to form graphene in the processing region, a step of irradiating the processing region with the terahertz wave and the evaluation laser beam and detecting the terahertz wave from the processing region, and a step of evaluating quality of the graphene in the processing region based on an intensity difference between the terahertz wave detected in the step and the terahertz wave detected in the step.Type: ApplicationFiled: December 19, 2023Publication date: June 27, 2024Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Atsushi NAKANISHI, Yuta KINE, Takeshi WATARI, Takashi KURITA
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Publication number: 20230330774Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes: a first step of expanding an area irradiated with the laser light toward a first side in the objective area; and a second step of expanding the area irradiated with the laser light toward a second side different from the first side in the objective area.Type: ApplicationFiled: July 5, 2021Publication date: October 19, 2023Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Yuki KABEYA, Takashi KURITA, Ryo YOSHIMURA, Takeshi WATARI
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Publication number: 20230330779Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes a processing step of scanning the objective area with an irradiation spot of the laser light while increasing a moving average in intensity of the laser light per unit area.Type: ApplicationFiled: July 5, 2021Publication date: October 19, 2023Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Yuki KABEYA, Takashi KURITA, Ryo YOSHIMURA, Takeshi WATARI
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Publication number: 20230226639Abstract: A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.Type: ApplicationFiled: June 4, 2021Publication date: July 20, 2023Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Takashi KURITA, Takeshi WATARI, Yuki KABEYA, Ryo YOSHIMURA
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Patent number: 11662483Abstract: A signal readout circuit is a circuit for reading out a signal from a photodetection element having a plurality of photodetection pixels each generating a detection signal according to light incidence, and includes N light incidence detection units (N is an integer of 2 or more) each for inputting the detection signal from each of N photodetection pixels and outputting a signal indicating the light incidence, and a total value detection unit for detecting a total value of the output signals from the N light incidence detection units. Each light incidence detection unit outputs the signal weighted differently corresponding to each photodetection pixel. A weight thereof is set such that the total values are different for respective photodetection pixels and all combination patterns of the photodetection pixels.Type: GrantFiled: July 6, 2020Date of Patent: May 30, 2023Assignee: HAMAMATSU PHOTONICS K.K.Inventor: Takeshi Watari
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Patent number: 11504803Abstract: A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.Type: GrantFiled: January 24, 2019Date of Patent: November 22, 2022Assignee: HAMAMATSU PHOTONICS K.KInventors: Yoshio Mizuta, Takashi Kurita, Takeshi Watari, Yuki Kabeya, Norio Kurita, Toshiyuki Kawashima
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Publication number: 20220268948Abstract: A signal readout circuit is a circuit for reading out a signal from a photodetection element having a plurality of photodetection pixels each generating a detection signal according to light incidence, and includes N light incidence detection units (N is an integer of 2 or more) each for inputting the detection signal from each of N photodetection pixels and outputting a signal indicating the light incidence, and a total value detection unit for detecting a total value of the output signals from the N light incidence detection units. Each light incidence detection unit outputs the signal weighted differently corresponding to each photodetection pixel. A weight thereof is set such that the total values are different for respective photodetection pixels and all combination patterns of the photodetection pixels.Type: ApplicationFiled: July 6, 2020Publication date: August 25, 2022Applicant: HAMAMATSU PHOTONICS K.K.Inventor: Takeshi WATARI
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Publication number: 20190232423Abstract: A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.Type: ApplicationFiled: January 24, 2019Publication date: August 1, 2019Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Yoshio MIZUTA, Takashi KURITA, Takeshi WATARI, Yuki KABEYA, Norio KURITA, Toshiyuki KAWASHIMA
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Patent number: 9953729Abstract: A radiation generating apparatus comprises a fuel storage unit 20 for storing a mixed liquid 61, a pressure application unit 10 for applying a pressure to the mixed liquid 61, a jet formation unit 30 for forming a jet 61a of the mixed liquid 61, a reaction unit 44 for forming the jet 61a of the mixed liquid 61 therein, a pressure adjustment unit 41 for setting a pressure in the reaction unit 44 lower than an internal pressure of the jet formation unit 30, and a light source unit 45 for irradiating a particle group 63a with laser light L1.Type: GrantFiled: August 8, 2012Date of Patent: April 24, 2018Assignee: HAMAMATSU PHOTONICS K.K.Inventors: Takeshi Watari, Katsunobu Nishihara, Masaru Takagi, Nakahiro Satoh, Toshiyuki Kawashima, Hirofumi Kan
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Publication number: 20140226772Abstract: A radiation generating apparatus comprises a fuel storage unit 20 for storing a mixed liquid 61, a pressure application unit 10 for applying a pressure to the mixed liquid 61, a jet formation unit 30 for forming a jet 61a of the mixed liquid 61, a reaction unit 44 for forming the jet 61a of the mixed liquid 61 therein, a pressure adjustment unit 41 for setting a pressure in the reaction unit 44 lower than an internal pressure of the jet formation unit 30, and a light source unit 45 for irradiating a particle group 63a with laser light L1.Type: ApplicationFiled: August 8, 2012Publication date: August 14, 2014Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Takeshi Watari, Katsunobu Nishihara, Masaru Takagi, Nakahiro Satoh, Toshiyuki Kawashima, Hirofumi Kan