Abstract: Provided is a method of manufacturing a resin member. The method includes irradiating a surface of a member containing a resin and a plant powder dispersed in the resin with laser light to change the plant powder or both the resin and the plant powder into diamond-like carbon in a surface layer region including the surface of the member.

Abstract: An interference light generation method involves placing a base material in an optical path of a first laser beam LA, manufacturing a filter by irradiating the base material with a plurality of first light fluxes L1 obtained by splitting the first laser beam LA to form a plurality of openings P corresponding to irradiation positions of the plurality of first light fluxes L1 in the base material, and generating interference light Ls by splitting a second laser beam LB into a plurality of second light fluxes L2 having the same optical axis as the plurality of first light fluxes L1 while each of the plurality of openings P of the filter is maintained on the optical axis of the plurality of first light fluxes L1 corresponding to the plurality of openings P, and causing the plurality of second light fluxes L2 having passed through each of the plurality of openings P to interfere with each other.

Abstract: According to this laser processing method, an inspection beam Lb is radiated to a planned irradiation spot K of processing laser light Lw on a surface Sa of an object S, pre-processing spot data D1 about a pre-processing surface state of the object is acquired, an optimum parameter D2 of the processing laser light Lw is estimated using an estimation program that outputs a result of estimating the optimum parameter of the processing laser light Lw in accordance with an input of the pre-processing spot data D1, and the planned irradiation spot K is irradiated with the processing laser light Lw on the basis of an optimum parameter estimation result D2.

Abstract: This laser peening method includes a placing step of placing an extension jig relative a workpiece W to form an extended surface formed by the extension jig in a region outside a surface Wa of the workpiece in a front view of a machining region K, a forming step of forming a water film P formed by a laminar flow over an irradiation position M2 of a laser beam L and at least a part of the extended surface by discharged water Pw directed to a target position M1, and a machining step of scanning the irradiation position M2 of the laser beam L and the target position M1 of the discharged water Pw with respect to the surface Wa of the workpiece W and irradiating the machining region K with the laser beam L through the water film P.

Abstract: Provided is a method of manufacturing a resin member. The method includes irradiating a surface of a member containing a resin and a plant powder dispersed in the resin with laser light to change the plant powder or both the resin and the plant powder into diamond-like carbon in a surface layer region including the surface of the member.

Abstract: A graphene manufacturing method includes a step of preparing a workpiece including a base material made of a resin material and a plant powder dispersed in the base material, a step of irradiating a surface of the workpiece with a terahertz wave and an evaluation laser beam and detecting the terahertz wave from the surface, a step of irradiating a processing region of the surface with a processing laser beam to form graphene in the processing region, a step of irradiating the processing region with the terahertz wave and the evaluation laser beam and detecting the terahertz wave from the processing region, and a step of evaluating quality of the graphene in the processing region based on an intensity difference between the terahertz wave detected in the step and the terahertz wave detected in the step.

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes a processing step of scanning the objective area with an irradiation spot of the laser light while increasing a moving average in intensity of the laser light per unit area.

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes: a first step of expanding an area irradiated with the laser light toward a first side in the objective area; and a second step of expanding the area irradiated with the laser light toward a second side different from the first side in the objective area.

Abstract: A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.

Abstract: A signal readout circuit is a circuit for reading out a signal from a photodetection element having a plurality of photodetection pixels each generating a detection signal according to light incidence, and includes N light incidence detection units (N is an integer of 2 or more) each for inputting the detection signal from each of N photodetection pixels and outputting a signal indicating the light incidence, and a total value detection unit for detecting a total value of the output signals from the N light incidence detection units. Each light incidence detection unit outputs the signal weighted differently corresponding to each photodetection pixel. A weight thereof is set such that the total values are different for respective photodetection pixels and all combination patterns of the photodetection pixels.

Abstract: A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.

Abstract: A signal readout circuit is a circuit for reading out a signal from a photodetection element having a plurality of photodetection pixels each generating a detection signal according to light incidence, and includes N light incidence detection units (N is an integer of 2 or more) each for inputting the detection signal from each of N photodetection pixels and outputting a signal indicating the light incidence, and a total value detection unit for detecting a total value of the output signals from the N light incidence detection units. Each light incidence detection unit outputs the signal weighted differently corresponding to each photodetection pixel. A weight thereof is set such that the total values are different for respective photodetection pixels and all combination patterns of the photodetection pixels.

Abstract: A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.

Abstract: A radiation generating apparatus comprises a fuel storage unit 20 for storing a mixed liquid 61, a pressure application unit 10 for applying a pressure to the mixed liquid 61, a jet formation unit 30 for forming a jet 61a of the mixed liquid 61, a reaction unit 44 for forming the jet 61a of the mixed liquid 61 therein, a pressure adjustment unit 41 for setting a pressure in the reaction unit 44 lower than an internal pressure of the jet formation unit 30, and a light source unit 45 for irradiating a particle group 63a with laser light L1.

Abstract: A radiation generating apparatus comprises a fuel storage unit 20 for storing a mixed liquid 61, a pressure application unit 10 for applying a pressure to the mixed liquid 61, a jet formation unit 30 for forming a jet 61a of the mixed liquid 61, a reaction unit 44 for forming the jet 61a of the mixed liquid 61 therein, a pressure adjustment unit 41 for setting a pressure in the reaction unit 44 lower than an internal pressure of the jet formation unit 30, and a light source unit 45 for irradiating a particle group 63a with laser light L1.