Patents by Inventor Takeshi Yahagi

Takeshi Yahagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder Material and Solder Material Production Method
    Publication number: 20240024991
    Abstract: A method of producing a solder material is provided. The method includes mixing a flux containing a solvent, a rosin-based resin, and an activator, with aggregated cellulose. The aggregated cellulose includes massive cellulose in which fibrous cellulose having a length of from 1 ?m or more to less than 1 mm, and fibrous cellulose having a length of from 1 nm or more to less than 1 ?m. The resulting mixture is mixed with a solder alloy to produce a solder material.
    Type: Application
    Filed: December 22, 2021
    Publication date: January 25, 2024
    Applicant: KOKI COMPANY LIMITED
    Inventors: Akane TANAKA, Takeshi YAHAGI
  • Flux
    Publication number: 20240001492
    Abstract: An aggregated cellulose is provided that includes massive cellulose and fibrous cellulose mixed together. The massive cellulose is fibrous and has a length of from 1 ?m or more to less than 1 mm. The fibrous cellulose has a length of from 1 nm or more to less than 1 ?m. The aggregated cellulose can contain from 400 ppm or more to 10,000 ppm or less of the massive cellulose. The aggregated cellulose can contain a solvent, a rosin-based resin, and an activator.
    Type: Application
    Filed: December 22, 2021
    Publication date: January 4, 2024
    Applicant: KOKI COMPANY LIMITED
    Inventors: Takeshi YAHAGI, Ryo KAMIO
  • Flux and solder paste
    Patent number: 11833622
    Abstract: A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: December 5, 2023
    Assignee: KOKI Company Limited
    Inventors: Takeshi Yahagi, Noriyoshi Uchida, Yuri Misumi
  • Resin composition for reinforcement and electronic component device
    Patent number: 11447626
    Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: September 20, 2022
    Assignee: KOKI COMPANY LIMITED
    Inventors: Takeshi Yahagi, Kazuhiro Yukikata, Koichi Sekiguchi, Yusuke Satoh, Tatsuya Baba, Mitsuyasu Furusawa
  • Flux and solder composition
    Patent number: 11407069
    Abstract: A flux containing terpene phenolic resin and having an acid value of 120 mgKOH/g or more is provided. The acid value can be 250 mgKOH/g or less. The terpene phenolic resin can be contained by 0.05 mass % or more and 30 mass % or less. The flux can contain the terpene phenolic resin and another resin component as a rosin component, and an amount of the terpene phenolic resin contained in the rosin component can be 0.1 mass % or more and 80 mass % or less.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: August 9, 2022
    Assignee: KOKI COMPANY LIMITED
    Inventors: Yuri Misumi, Takeshi Yahagi, Motohide Sasaki, Tatsuya Baba, Kazuma Karube
  • FLUX AND SOLDER PASTE
    Publication number: 20210291304
    Abstract: A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.
    Type: Application
    Filed: July 24, 2019
    Publication date: September 23, 2021
    Inventors: Takeshi YAHAGI, Noriyoshi UCHIDA, Yuri MISUMI
  • Solder paste containing solder powder and flux
    Patent number: 10933495
    Abstract: Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: March 2, 2021
    Assignee: KOKI COMPANY LIMITED
    Inventors: Motohide Sasaki, Takeshi Yahagi, Noriyoshi Uchida
  • Resin Composition for Reinforcement and Electronic Component Device
    Publication number: 20200325326
    Abstract: Containing an epoxy compound and a curing agent and containing a bisphenol E type epoxy resin as the epoxy compound in an amount of 25 mass % or more and 100 mass % or less relative to the total amount of the epoxy compound.
    Type: Application
    Filed: November 1, 2018
    Publication date: October 15, 2020
    Applicant: KOKI COMPANY LIMITED
    Inventors: Takeshi Yahagi, Kazuhiro Yukikata, Koichi Sekiguchi, Yusuke Satoh, Tatsuya Baba, Mitsuyasu Furusawa
  • Flux and Solder Composition
    Publication number: 20200094354
    Abstract: A flux containing terpene phenolic resin and having an acid value of 120 mgKOH/g or more is provided. The acid value can be 250 mgKOH/g or less. The terpene phenolic resin can be contained by 0.05 mass % or more and 30 mass % or less. The flux can contain the terpene phenolic resin and another resin component as a rosin component, and an amount of the terpene phenolic resin contained in the rosin component can be 0.1 mass % or more and 80 mass % or less.
    Type: Application
    Filed: January 15, 2018
    Publication date: March 26, 2020
    Inventors: Yuri Misumi, Takeshi Yahagi, Motohide Sasaki, Tatsuya Baba, Kazuma Karube
  • Flux and Solder Composition
    Publication number: 20180147675
    Abstract: Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.
    Type: Application
    Filed: October 25, 2016
    Publication date: May 31, 2018
    Inventors: Motohide Sasaki, Takeshi Yahagi, Noriyoshi Uchida