Patents by Inventor Takeshi Yatsuka
Takeshi Yatsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10154585Abstract: An object of the present invention is to provide a conductive coating film formed on a polyimide-based insulating substrate by using a metal powder paste which can exhibit a good conductivity and good adhesion to the insulating substrate. By forming a resin cured layer having a solvent-soluble content of not more than 20% by weight and a thickness of not more than 5 ?m on a polyimide-based insulating substrate; forming a metal powder-containing coating layer on the resin cured layer by using a metal powder paste; and then subjecting the resulting coating layer to heat treatment with superheated steam, it is possible to obtain a conductive coating film which can exhibit a good conductivity and good adhesion to the insulating substrate.Type: GrantFiled: May 17, 2012Date of Patent: December 11, 2018Assignees: TODA KOGYO CORPORATION, TOYOBO CO., LTD.Inventors: Takeshi Yatsuka, Chiho Ito, Yasuo Kakihara, Hirotoshi Kizumoto, Koji Shoki
-
Publication number: 20150380123Abstract: An object of the present invention is to provide a conductive coating film formed of a copper paste on an insulating substrate which has a good conductivity and a good adhesion property to the insulating substrate. The process for producing a conductive coating film according to the present invention comprising the steps of applying a copper paste comprising copper particles, a binder resin and a solvent as main components onto an insulating substrate to form a coating film on the substrate, and then drying the coating film to obtain a copper powder-containing coating film; treating the copper powder-containing coating film with an organic acid or an organic acid salt; and subjecting the thus treated copper powder-containing coating film to heat treatment with superheated steam. According to the present invention, it is possible to obtain a conductive coating film having a good conductivity and a good adhesion property to the insulating substrate.Type: ApplicationFiled: February 25, 2014Publication date: December 31, 2015Inventors: Takeshi YATSUKA, Chiho ITO, Yasuo KAKIHARA
-
Patent number: 9221979Abstract: There are provided copper particles and a copper paste for a copper powder-containing coating film which can be subjected to electroless metal plating without using an expensive catalyst such as palladium, and a process for producing a conductive coating film by subjecting a copper powder-containing coating film formed by using the copper paste to electroless metal plating or heat treatment with superheated steam. The present invention relates to a process for producing a conductive coating film comprising the step of forming a coating film on an insulating substrate using copper particles having an average particle diameter of 0.Type: GrantFiled: May 17, 2012Date of Patent: December 29, 2015Assignee: TODA KOGYO CORPORATIONInventors: Chiho Ito, Takeshi Yatsuka, Yasuo Kakihara
-
Publication number: 20140203222Abstract: There are provided copper particles and a copper paste for a copper powder-containing coating film which can be subjected to electroless metal plating without using an expensive catalyst such as palladium, and a process for producing a conductive coating film by subjecting a copper powder-containing coating film formed by using the copper paste to electroless metal plating or heat treatment with superheated steam. The present invention relates to a process for producing a conductive coating film comprising the step of forming a coating film on an insulating substrate using copper particles having an average particle diameter of 0.Type: ApplicationFiled: May 17, 2012Publication date: July 24, 2014Applicant: TODA KOGYO CORPORATIONInventors: Chiho Ito, Takeshi Yatsuka, Yasuo Kakihara
-
Publication number: 20140141238Abstract: An object of the present invention is to provide a conductive coating film formed on a polyimide-based insulating substrate by using a metal powder paste which can exhibit a good conductivity and good adhesion to the insulating substrate. By forming a resin cured layer having a solvent-soluble content of not more than 20% by weight and a thickness of not more than 5 ?m on a polyimide-based insulating substrate; forming a metal powder-containing coating layer on the resin cured layer by using a metal powder paste; and then subjecting the resulting coating layer to heat treatment with superheated steam, it is possible to obtain a conductive coating film which can exhibit a good conductivity and good adhesion to the insulating substrate.Type: ApplicationFiled: May 17, 2012Publication date: May 22, 2014Applicants: TOYOBO CO., LTD., TODA KOGYO CORPORATIONInventors: Takeshi Yatsuka, Chiho Ito, Yasuo Kakihara, Hirotoshi Kizumoto, Koji Shoki
-
Publication number: 20100069599Abstract: [Object] To provide a thermosetting resin used for the manufacture of layered products for fibrous use, electrical products and automobile parts or, particularly, used for multilayered circuit board and flat cables, being suitable for a latent thermosetting adhesive which shows, upon adhesion, the fluidity necessary for the adhesion but quickly hardens by heat or light and also being excellent in resistance to heat upon soldering; to provide a resin expressing an excellent flame-retarding property in spite of non-use of halogen, and expressing latent hardening properties to quickly harden by heat and light; and to provide an adhesive and a resist agent comprising the same.Type: ApplicationFiled: November 8, 2007Publication date: March 18, 2010Applicant: Toyo Boseki Kabushiki KaishaInventors: Takeshi Yatsuka, Katsuya Shimeno, Takahiro Hattori, Shintaro Nanbara, Shoko Nagata, Yasunari Hotta
-
Patent number: 6743512Abstract: There is provided an adhesive for inorganic vapor-deposited film which is characterized in containing a compounded product and/or a reacted product of polyurethane resin or polyester resin having a branch in a molecule with a silane coupling agent. When the said adhesive is directly coated on an inorganic vapor-deposited film and adhered with a heat-sealing resin, a good adhesion is achieved. Also, when a packaging bag prepared by using the above is torn, a good tearing property is achieved.Type: GrantFiled: March 14, 2002Date of Patent: June 1, 2004Assignee: Toyo Boseki Kabushiki KaishaInventors: Masaki Murata, Mitsuo Nishida, Katsuya Emoto, Takeshi Yatsuka
-
Patent number: 6657016Abstract: A polyester resin composition comprising 50 equivalents/ton or more of an aromatic ring in the resin and at least one thermosetting resin selected from the group consisting of melamine resin, urea resin, benzoguanamine resin and phenol resin. The aromatic ring in the polyester resin has a phenolic hydroxyl group and at least one of ortho-position and para-position of the aromatic ring to the phenolic hydroxyl group is a hydrogen atom. The resin composition has excellent toughness at ambient temperature and heat resistance.Type: GrantFiled: March 14, 2002Date of Patent: December 2, 2003Assignee: Toyo Boseki Kabushiki KaishaInventor: Takeshi Yatsuka
-
Publication number: 20030176595Abstract: A polyester resin composition comprising 50 equivalents/ton or more of an aromatic ring in the resin and at least one thermosetting resin selected from the group consisting of melamine resin, urea resin. benzoguanamine resin and phenol resin. The aromatic ring in the polyester resin has a phenolic hydroxyl group and at least one of ortho-position and para-position of the aromatic ring to the phenolic hydroxyl group is a hydrogen atom. The resin composition has excellent toughness at ambient temperature and heat resistance.Type: ApplicationFiled: March 14, 2002Publication date: September 18, 2003Inventor: Takeshi Yatsuka
-
Patent number: 6545119Abstract: A magnetic recording medium possessing a magnetic layer formed by application onto a non-magnetic support, of a magnetic coating containing magnetic particles dispersed in a binder which contains a polyurethane resin, together with carbon black particles at 5% by weight or higher, based on the weight of the magnetic particles.Type: GrantFiled: March 7, 2000Date of Patent: April 8, 2003Assignee: Toyo Boseki Kabushiki KaishaInventors: Hirotoshi Kizumoto, Takeshi Yatsuka, Chikara Sugitawa, Kuniyuki Doi
-
Publication number: 20030022022Abstract: A magnetic recording medium possessing a magnetic layer formed by application onto a non-magnetic support, of a magnetic coating containing magnetic particles dispersed in a binder which contains a polyurethane resin, together with carbon black particles at 5% by weight or higher, based on the weight of the magnetic particles.Type: ApplicationFiled: March 7, 2000Publication date: January 30, 2003Inventors: Hirotoshi Kizumoto, Takeshi Yatsuka, Chikara Sugitawa, Kuniyuki Doi
-
Publication number: 20020168515Abstract: There is provided an adhesive for inorganic vapor-deposited film which is characterized in containing a compounded product and/or a reacted product of polyurethane resin or polyester resin having a branch in a molecule with a silane coupling agent.Type: ApplicationFiled: March 14, 2002Publication date: November 14, 2002Inventors: Masaki Murata, Mitsuo Nishida, Katsuya Emoto, Takeshi Yatsuka
-
Patent number: 5750248Abstract: A magnetic paint including magnetic powder, a binder and organic solvents is provided. The magnetic paint is prepared by first dispersing the magnetic powder and an amount of the binder in the range from about 20% to about 80% by weight based on the weight of the total binder in a poor solvent of the binder so as to obtain a first dispersion, dispersing after adding a good solvent of the binder and the rest of the binder into the first dispersion, and then dispersing the mixture so as to a second dispersion. About 25% by weight or more of the binder based on the weight of the total binder is adsorbed to the magnetic powder.Type: GrantFiled: February 29, 1996Date of Patent: May 12, 1998Assignee: Toyo Boseki Kabushiki KaishaInventor: Takeshi Yatsuka
-
Patent number: 5415941Abstract: A magnetic recording medium comprise a non-magnetic support and a magnetic layer formed thereon which is made of a composition comprising ferromagnetic particles and a resinous binder. The resinous binder comprises a polyurethane resin containing at least a high molecular polyol (A) and a diisocyanate (B) as its constituents. The high molecular polyol (A) comprises a polyol (a.sub.1) having a glass-transition temperature of 20.degree. C. or more and having a number average molecular weight in the range of 500 to 10,000, and the polyurethane resin has at least one hydroxyl group at its molecular terminals and the urethane bond concentration of the polyurethane resin is in the range of 500 to 1,500 equivalents/10.sup.6 g.Type: GrantFiled: December 19, 1991Date of Patent: May 16, 1995Assignee: Toyo Boseki Kabushiki KaishaInventors: Yasunobu Sugyo, Haruhiko Narusawa, Takeshi Yatsuka
-
Patent number: 5413862Abstract: According to the present invention, a magnetic recording medium having a non-magnetic support and a magnetic layer formed thereon is provided. The magnetic layer is formed from a composition containing as its main components ferromagnetic particles and a resinous binder. The binder resin contains a polyurethane resin containing as its components a high molecular weight polyol (A) with a molecular weight of 500 or more and an organic diisocyanate (B). The high molecular weight polyol (A) contains as its components an aromatic polyester diol (A-1) having a metal sulfonate group in an amount of 20 to 600 equivalents/10.sup.6 g and a polyol (A-2) which has no metal sulfonate group and is in a liquid state at 20.degree. C. The ratio between the aromatic polyester diol (A-1) and the polyol (A-2) is in the range of 10:1 to 1:4. A urethane group is contained in the polyurethane resin in an amount of 600 to 1500 equivalents/10.sup.6 g.Type: GrantFiled: April 28, 1993Date of Patent: May 9, 1995Assignee: Toyo Boseki Kabushiki KaishaInventors: Hiroshi Murata, Takeshi Yatsuka
-
Patent number: 5411810Abstract: The present invention relates to a viscoelastic resin composition for a vibration damping material and a vibration damping material using the same. The viscoelastic resin composition includes as its main components: Low Tg resin (A) with a glass transition temperature of -60.degree. C. to 0.degree. C. and a number average molecular weight of 5000 to 50000, the Low Tg resin (A) being a polyester containing an acid component having 50 to 90 mol % of aromatic dicarboxylic acid and 10 to 50 mol % of dimer acid, and a glycol component having at least 30 mol % of glycol with an alkyl group as its side chain and the glycol having at least four carbon atoms; and High Tg resin (B) which is at least one selected from the group consisting of amorphous polyester resins, phenoxy resins, and epoxy resins, the epoxy resins having a number average molecular weight of at least 1000, the respective resins having a glass transition temperature in the range of 0.degree. C. to 80.degree. C.Type: GrantFiled: June 28, 1993Date of Patent: May 2, 1995Assignee: Toyo Boseki Kabushiki KaishaInventors: Hiroshi Hirakouchi, Masanori Nakamura, Takeshi Yatsuka, Nobuo Kadowaki
-
Patent number: 5288813Abstract: There is disclosed a viscoelastic resin composition for vibration damping material containing as essential components a polyester resin having a molecular weight of 5,000 to 50,000 and an acid value of 50 to 500 equivalents/10.sup.6 g, at least 80 mol % of the polycarboxylic acid component of which is an aromatic dicarboxylic acid and, at least 30 mol % of the polyol component of which is a compound of the formula (I):H--(OR.sub.2).sub.n --O--A--R.sub.1 --A--O--(R.sub.2 O).sub.n --H(I)wherein R.sub.1 is oxygen or a straight or branched chain C.sub.1-6 alkylene group; R.sub.2 is a straight or branched C.sub.1-6 alkylene group; A is a group of the formula: ##STR1## (wherein R.sub.3 is hydrogen or a C.sub.1-6 alkyl group); and n is an integer of 1 to 6, an acid anhydride compound having at least two acid anhydride groups in a molecule, and an epoxy compound having at least two epoxy groups in a molecule.Type: GrantFiled: August 22, 1991Date of Patent: February 22, 1994Assignees: Toyo Boseki Kabushiki Kaisha, Nippon Steel CorporationInventors: Hiroshi Hirakouchi, Masanori Nakamura, Takeshi Yatsuka, Nobuo Kadowaki, Hiroshi Endoh, Yoshimasa Zama
-
Patent number: 5278275Abstract: A polyurethane resin composition containing a polyurethane resin composed of a high molecular weight polyol having a molecular weight of not less than 500, an organic polyisocyanate and optionally a compound having at least 2 active hydrogen-containing groups is disclosed. Not less than 30% by weight of the high molecular weight polyol is a polyester polyol, and the polyester polyol contains at least one tricyclic molecular skeleton in the molecular chain thereof in an amount of not less than 20 mole % based on total acid or glycol components.Type: GrantFiled: June 28, 1991Date of Patent: January 11, 1994Assignee: Toyo Boseki Kabushiki KaishaInventors: Takeshi Yatsuka, Haruo Asai, Haruhiko Narusawa, Yasunobu Sugyo, Hiroshi Fujimoto
-
Patent number: 5183863Abstract: Disclosed herein is a viscoelastic resin composition for vibration-damping material which comprises (A) at least one amorphous polyester resin of low specific gravity in which more than 40 mol % of the dibasic acid moiety is of aromatic type, (B) at least one amorphous polyester resin of high specific gravity in which more than 80 mol % of the dibasic acid moiety is of aromatic type, and (C) at least one hardener selected from the group consisting of polyisocyanate compounds, epoxy group-containing compounds, and acid anhydrides, said consitutents (A) and (B) being in the ratio of from 90:10 to 30:70 by weight and differing from each other in specific gravity (at 30.degree. C.) by 0.06 to 0.15 and also in molecular weight by more than 10000, with that of either of them being higher than 5000. This resin composition gives a vibration-damping material which exhibits improved vibration-damping properties, adhesive strength, formability, and heat resistance after forming.Type: GrantFiled: May 29, 1992Date of Patent: February 2, 1993Assignees: Toyo Boseki Kabushiki Kaisha, Nippon Steel CorporationInventors: Masanori Nakamura, Hiroshi Hirakouchi, Takeshi Yatsuka, Nobuo Kadowaki, Hiroshi Endoh
-
Patent number: 5009960Abstract: A magnetic recording medium is disclosed which comprises a non-magnetic support and a magnetic coating layer formed thereon, the magnetic coating layer being formed by applying a magnetic coating composition comprising a resinous binder and magnetic particles dispersed therein, wherein the coating composition contains, as a resinous binder, a modified polyurethane resin obtained by reacting a polyurethane resin (A) with a bicyclic amide acetal (B), the polyurethane resin (A) having carboxyl groups in an amount of 50 to 2,000 equivalents/10.sup.6 g and the equivalent ratio of the bicyclic amide acetal (B) to the carboxyl groups of the polyurethane resin (A) being within the range of 0.5 to 2.0.Type: GrantFiled: November 6, 1989Date of Patent: April 23, 1991Assignee: Ashland Oil, Inc.Inventors: Takeshi Yatsuka, Hiroshi Murata, Yutaka Mizumura, Nobukazu Kotera