Patents by Inventor Takeshi Yoshinori

Takeshi Yoshinori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230364969
    Abstract: A thermal management system includes refrigeration cycle equipment and a heating medium circuit. The heating medium circuit includes a high-temperature-side circuit connecting with the heating medium channel of the high-temperature-side water-refrigerant heat exchange portion, a low-temperature-side circuit connecting with a heating medium channel of a low-temperature-side water-refrigerant heat exchange portion, and a heat transfer portion connecting the high-temperature-side circuit and the low-temperature-side circuit. The low-temperature-side circuit includes a first heat exchange portion, a second heat exchange portion, a heating medium bypass channel, and a low-temperature-side circuit switching portion.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 16, 2023
    Inventors: Takahiro MAEDA, Shota TERACHI, Kenshiro MATSUI, Takeshi YOSHINORI, Shinya KASAMATSU
  • Publication number: 20210280925
    Abstract: In a device temperature regulator, an evaporator cools a target device by a latent heat of evaporation of a working fluid that absorbs heat from the target device and is evaporated. A first condenser includes a first heat exchange passage that condenses the working fluid evaporated in the evaporator by a heat exchange with an outside first medium. A second condenser includes a second heat exchange passage that condenses the working fluid evaporated in the evaporator by a heat exchange with an outside second medium. A gas-phase passage causes the working fluid evaporated in the evaporator to flow to the first condenser and the second condenser. Furthermore, a first liquid-phase passage causes the working fluid condensed in the first condenser to flow to the evaporator, and a second liquid-phase passage causes the working fluid condensed in the second condenser to flow to the evaporator.
    Type: Application
    Filed: August 2, 2017
    Publication date: September 9, 2021
    Inventors: Takeshi YOSHINORI, Takashi YAMANAKA, Yoshiki KATO, Masayuki TAKEUCHI, Koji MIURA, Yasumitsu OMI
  • Patent number: 11029098
    Abstract: A device temperature regulator includes a forward passage in which a forward flow passage is formed to cause a working fluid to flow to a heat absorber from a heat radiator, and a backward passage in which a backward flow passage is formed to cause the working fluid to flow to the heat radiator from the heat absorber. In addition, the device temperature regulator includes a bubble generator, which generates a bubble in the working fluid collecting in the heat absorber and having a liquid phase, and a controller that causes the bubble generator to generate the bubble in a precondition is satisfied.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: June 8, 2021
    Assignee: DENSO CORPORATION
    Inventors: Masayuki Takeuchi, Yasumitsu Omi, Takashi Yamanaka, Yoshiki Kato, Takeshi Yoshinori, Koji Miura
  • Patent number: 10996002
    Abstract: An evaporator evaporates a working fluid by heat from a battery. The evaporator includes at least one evaporation channel connected to the battery in a thermally conductive manner. The evaporator includes a supply channel connected to an upstream end of the evaporation channel, and supplies the working fluid in liquid phase from the supply channel to the evaporation channel. The evaporator includes an outflow channel connected with a downstream end of the evaporation channel, and discharges the working fluid. The outflow channel is disposed above the supply channel, and the supply channel is disposed at a position more insulated from the heat of the battery than the evaporation channel is.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: May 4, 2021
    Assignee: DENSO CORPORATION
    Inventors: Yasumitsu Omi, Takeshi Yoshinori, Masayuki Takeuchi, Koji Miura
  • Patent number: 10950909
    Abstract: A device temperature regulator is provided with a gas passage part that guides a gaseous working fluid evaporated in a device heat exchanger to a condenser, and a liquid passage part that guides a liquid working fluid condensed in the condenser to the device heat exchanger. The device temperature regulator is provided with a supply amount regulator that increases or decreases a supply amount of the liquid working fluid supplied to the device heat exchanger. The supply amount regulator decreases the supply amount of the liquid working fluid to the device heat exchanger such that a liquid surface is formed in a state where the gaseous working fluid is positioned at a lower side lower than a heat exchanging portion exchanging heat with a temperature regulation target device in the device heat exchanger, when a condition for keeping the temperature regulation target device at a temperature is satisfied.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: March 16, 2021
    Assignee: DENSO CORPORATION
    Inventors: Koji Miura, Takashi Yamanaka, Yasumitsu Omi, Yoshiki Kato, Masayuki Takeuchi, Takeshi Yoshinori
  • Patent number: 10906141
    Abstract: A method for manufacturing a device temperature controller includes filling an inside of a circuit with working fluid by connecting a filling port of the circuit to a container that stores gas phase working fluid. The circuit constitutes a thermosiphon heat pipe and allows the working fluid to circulate in the circuit. In the filling, the working fluid inside the circuit is cooled by a cooling source. An inside temperature of the circuit is decreased to be lower than an inside temperature of the container, and thereby an inside pressure of the circuit is decreased to be lower than an inside pressure of the container.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: February 2, 2021
    Assignee: DENSO CORPORATION
    Inventors: Yasumitsu Omi, Takashi Yamanaka, Yoshiki Kato, Takeshi Yoshinori, Masayuki Takeuchi, Koji Miura
  • Patent number: 10910684
    Abstract: A first thermosiphon circuit includes a first evaporator configured to cool a first target device by a latent heat of evaporation of a working fluid that absorbs a heat from the first target device, and a first passage communicating with the first evaporator. A second thermosiphon circuit includes a second evaporator configured to cool a second target device by a latent heat of evaporation of a working fluid that absorbs a heat from the second target device, and a second passage communicating with the second evaporator. A main condenser includes a first heat exchanger provided in the first passage and a second heat exchanger provided in the second passage, and is configured to allow the working fluid flowing through the first heat exchanger, the working fluid flowing through the second heat exchanger, and a predetermined cold energy supply medium to exchange heat with each other.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: February 2, 2021
    Assignee: DENSO CORPORATION
    Inventors: Yasumitsu Omi, Takeshi Yoshinori, Masayuki Takeuchi, Koji Miura
  • Publication number: 20200343603
    Abstract: A cooling device includes: an evaporator configured to cool a battery pack by evaporating a heat medium by heat exchange between the battery pack and the heat medium, the battery pack including a plurality of battery cells arranged in an arrangement direction; a condenser disposed above the evaporator and configured to radiate heat of the heat medium to an external fluid by condensing the heat medium by heat exchange between the heat medium and the external fluid; a gas-phase passage configured to guide the heat medium in a gas phase from the evaporator to the condenser; and a liquid-phase passage configured to guide the heat medium in a liquid phase from the condenser to the evaporator, wherein a cooling amount at an end of the evaporator in the arrangement direction is lower than a cooling amount at a center of the evaporator in the arrangement direction.
    Type: Application
    Filed: April 23, 2020
    Publication date: October 29, 2020
    Inventors: Satoko TOFUKUJI, Yusuke SUZUKI, Takeshi YOSHINORI, Yasumitsu OOMI, Kouji MIURA
  • Publication number: 20200338963
    Abstract: A cooling device includes: an evaporator cooling a cooling object by evaporating a heat medium in a liquid phase by a heat exchange between the cooling object and the heat medium; a condenser, disposed above the evaporator, radiating a heat of the heat medium to an external fluid by condensing the heat medium in a gas phase by a heat exchange between the heat medium and the external fluid; a gas-phase passage for guiding the gas-phase heat medium from the evaporator to the condenser; and a liquid-phase passage for guiding the liquid-phase heat medium from the condenser to the evaporator. Further, the gas-phase passage includes a rising portion on one side of the cooling device in a predetermined direction orthogonal to a vertical direction and at least a part of the rising portion rises above surroundings.
    Type: Application
    Filed: April 20, 2020
    Publication date: October 29, 2020
    Inventors: Yusuke SUZUKI, Yoshiyuki YAMASHITA, Takeshi YOSHINORI, Yasumitsu OMI, Koji MIURA
  • Publication number: 20200259231
    Abstract: A cooling device for a vehicle is configured as a thermosiphon that performs heat transfer by a working fluid sealed in a sealed container to cool a target object. The cooling device includes an evaporator and an outdoor condenser. The evaporator forms a part of the sealed container, and evaporates the working fluid by absorbing heat of the target device. The outdoor condenser forms a part of the sealed container, and is disposed above the evaporator. The outdoor condenser is located adjacent to a cabin space with respect to a vehicle body around the cabin space. The outdoor condenser is fixed to the vehicle body or a member provided adjacent to the cabin space with respect to the vehicle body, and condenses the working fluid by radiating heat of the working fluid vaporized in the evaporator to an outside air.
    Type: Application
    Filed: April 7, 2020
    Publication date: August 13, 2020
    Inventors: Yasumitsu OMI, Koji MIURA, Takeshi YOSHINORI, Masayuki TAKEUCHI
  • Publication number: 20200254845
    Abstract: A cooler cools a target equipment by evaporation latent heat of working fluid. A cold-heat heat exchanger condenses the working fluid by radiating heat of the working fluid using cold heat of low-temperature and low-pressure refrigerant circulating in a refrigeration cycle. An air-cooled heat exchanger condenses the working fluid by radiating heat of the working fluid using cold heat of outside air. The cooler, the cold-heat heat exchanger, and the air-cooled heat exchanger are connected by a gas pipe and a liquid pipe. An outside air temperature detector detects an outside air temperature. A saturation temperature detector detects a saturation temperature of the working fluid circulating in a thermosiphon circuit. A heat radiation controller controls an amount of heat radiated from the working fluid flowing through the cold-heat heat exchanger so that the saturation temperature of the working fluid becomes higher than the outside air temperature.
    Type: Application
    Filed: April 28, 2020
    Publication date: August 13, 2020
    Inventors: Koji MIURA, Yasumitsu OMI, Takeshi YOSHINORI, Masayuki TAKEUCHI
  • Publication number: 20200096260
    Abstract: An evaporator evaporates a working fluid by heat from a battery. The evaporator includes at least one evaporation channel connected to the battery in a thermally conductive manner. The evaporator includes a supply channel connected to an upstream end of the evaporation channel, and supplies the working fluid in liquid phase from the supply channel to the evaporation channel. The evaporator includes an outflow channel connected with a downstream end of the evaporation channel, and discharges the working fluid. The outflow channel is disposed above the supply channel, and the supply channel is disposed at a position more insulated from the heat of the battery than the evaporation channel is.
    Type: Application
    Filed: April 1, 2019
    Publication date: March 26, 2020
    Inventors: Yasumitsu OMI, Takeshi YOSHINORI, Masayuki TAKEUCHI, Koji MIURA
  • Publication number: 20200088471
    Abstract: A thermosiphon applied to a moving body includes a condenser and a plurality of coolers. Each of the plurality of coolers includes a first flow channel forming member, a second flow channel forming member, and a third flow channel forming member. The second flow channel forming member defines a refrigerant inlet that is located below a center portion of a supply flow channel defined by the first flow channel forming member in a vertical direction. The plurality of coolers are arranged along a traveling direction of the moving body and the supply flow channel is fluidly connected in series with each other.
    Type: Application
    Filed: November 22, 2019
    Publication date: March 19, 2020
    Inventors: Yasumitsu OMI, Takeshi YOSHINORI, Koji MIURA, Masayuki TAKEUCHI
  • Publication number: 20190363411
    Abstract: A device heat exchanger is capable of exchanging heat between a target device and a working fluid. A condenser may be disposed above the device heat exchanger in the gravitational direction, a gas phase passage communicates the condenser with an upper connection portion of the device heat exchanger, and a liquid phase passage communicates the condenser with a lower connection portion of the device heat exchanger. A fluid passage communicates the upper connection portion of the device heat exchanger with the lower connection portion of the device heat exchanger, without including the condenser on a route of the fluid passage. A heating portion is capable of heating the liquid-phase working fluid flowing through the fluid passage, and a controller operates the heating portion when heating the target device and stops an operation of the heating portion when cooling the target device.
    Type: Application
    Filed: August 9, 2019
    Publication date: November 28, 2019
    Inventors: Masayuki TAKEUCHI, Yasumitsu OMI, Takeshi YOSHINORI, Koji MIURA
  • Publication number: 20190226767
    Abstract: A first thermosiphon circuit includes a first evaporator configured to cool a first target device by a latent heat of evaporation of a working fluid that absorbs a heat from the first target device, and a first passage communicating with the first evaporator. A second thermosiphon circuit includes a second evaporator configured to cool a second target device by a latent heat of evaporation of a working fluid that absorbs a heat from the second target device, and a second passage communicating with the second evaporator. A main condenser includes a first heat exchanger provided in the first passage and a second heat exchanger provided in the second passage, and is configured to allow the working fluid flowing through the first heat exchanger, the working fluid flowing through the second heat exchanger, and a predetermined cold energy supply medium to exchange heat with each other.
    Type: Application
    Filed: April 3, 2019
    Publication date: July 25, 2019
    Inventors: Yasumitsu OMI, Takeshi YOSHINORI, Masayuki TAKEUCHI, Koji MIURA
  • Publication number: 20190214695
    Abstract: A device temperature controller includes a heat absorber that absorbs heat from a temperature control target device to evaporate working fluid in liquid phase, and a condenser disposed above the heat absorber to condense the working fluid which has been evaporated into gas phase at the heat absorber. The device temperature controller includes a gas passage portion that guides the working fluid which has been evaporated into gas phase at the heat absorber to the condenser, and a liquid passage portion that guides the working fluid which has been condensed into liquid phase at the condenser to the heat absorber. At least a part of the gas passage portion and at least a part of the liquid passage portion are in contact with each other.
    Type: Application
    Filed: March 13, 2019
    Publication date: July 11, 2019
    Inventors: Koji MIURA, Yasumitsu OMI, Takeshi YOSHINORI, Masayuki TAKEUCHI, Takashi YAMANAKA, Yoshiki KATO
  • Publication number: 20190204014
    Abstract: An evaporator includes a fluid chamber in which a working fluid flows. A condenser includes a gas-phase portion in which the working fluid evaporated in the evaporator flows and a liquid-phase portion in which the working fluid from the gas-phase portion, condensed by heat exchange with an external medium, flows. A gas-phase passage causes the working fluid evaporated in the evaporator to flow to the condenser. A liquid-phase passage causes the working fluid condensed in the condenser to flow to the evaporator. A bypass passage has one end connected to the liquid-phase portion of the condenser or the liquid-phase passage and another end connected to the gas-phase portion of the condenser or the gas-phase passage. A flow rate of a liquid-phase working fluid per unit volume in the bypass passage is smaller than a flow rate of a liquid-phase working fluid per unit volume in the liquid-phase portion of the condenser or the liquid-phase passage.
    Type: Application
    Filed: August 2, 2017
    Publication date: July 4, 2019
    Inventors: Takeshi YOSHINORI, Takashi YAMANAKA, Yoshiki KATO, Masayuki TAKEUCHI, Koji MIURA, Yasumitsu OMI
  • Publication number: 20190198954
    Abstract: A device temperature regulator is provided with a device heat exchanger that functions as an evaporator at the time of cooling a temperature regulation target device and that functions as a heat radiator at the time of warming up the temperature regulation target device, and a condenser that condenses a gaseous working fluid. The device temperature regulator is provided with a heater that heats the working fluid collecting in a device fluid circuit, and a liquid amount regulator that regulates a liquid amount of the working fluid collecting in the device heat exchanger. The device heat exchanger includes a heat exchange portion that exchanges heat with the temperature regulation target device. The liquid amount regulator regulates the liquid amount of the liquid working fluid collecting in the device heat exchanger.
    Type: Application
    Filed: March 6, 2019
    Publication date: June 27, 2019
    Inventors: Koji MIURA, Yasumitsu OMI, Masayuki TAKEUCHI, Takeshi YOSHINORI, Takashi YAMANAKA, Yoshiki KATO
  • Publication number: 20190193213
    Abstract: A method for manufacturing a device temperature controller includes filling an inside of a circuit with working fluid by connecting a filling port of the circuit to a container that stores gas phase working fluid. The circuit constitutes a thermosiphon heat pipe and allows the working fluid to circulate in the circuit. In the filling, the working fluid inside the circuit is cooled by a cooling source. An inside temperature of the circuit is decreased to be lower than an inside temperature of the container, and thereby an inside pressure of the circuit is decreased to be lower than an inside pressure of the container.
    Type: Application
    Filed: March 6, 2019
    Publication date: June 27, 2019
    Inventors: Yasumitsu OMI, Takashi YAMANAKA, Yoshiki KATO, Takeshi YOSHINORI, Masayuki TAKEUCHI, Koji MIURA
  • Publication number: 20190186843
    Abstract: A device temperature regulator includes a forward passage in which a forward flow passage is formed to cause a working fluid to flow to a heat absorber from a heat radiator, and a backward passage in which a backward flow passage is formed to cause the working fluid to flow to the heat radiator from the heat absorber. In addition, the device temperature regulator includes a bubble generator, which generates a bubble in the working fluid collecting in the heat absorber and having a liquid phase, and a controller that causes the bubble generator to generate the bubble in a precondition is satisfied.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 20, 2019
    Inventors: Masayuki TAKEUCHI, Yasumitsu OMI, Takashi YAMANAKA, Yoshiki KATO, Takeshi YOSHINORI, Koji MIURA