Patents by Inventor Takeshi Yuasa

Takeshi Yuasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210083353
    Abstract: To obtain a downsized dielectric filter suitable for a laminating structure, a dielectric filter is configured with use of a dielectric waveguide formed of a conductor pattern and vias in a laminating direction within a multilayer dielectric substrate, two strip lines formed in a planar direction of the multilayer dielectric substrate, and two strip line-waveguide converters each configured to perform transmission line conversion between the dielectric waveguide and each strip line. In this manner, it is possible to provide a dielectric filter for which an area to be occupied in the planar direction of the multilayer dielectric substrate is suppressed.
    Type: Application
    Filed: June 7, 2018
    Publication date: March 18, 2021
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hideharu YOSHIOKA, Akimichi HIROTA, Takeshi YUASA, Tomokazu HAMADA, Yasuo MORIMOTO
  • Patent number: 10813212
    Abstract: The multiband filter includes a printed circuit board, a first filter, a second filter having an outer dimension different from that of the first filter and passband frequencies higher than those of the first filter, an input terminal, an output terminal, a first inductor, a first capacitor, which are connected except the first capacitor by signal line conductor patterns to form a first transmission line, which connect the second filter, the input terminal, the output terminal, and the first capacitor to form a second transmission line, a part thereof in the first transmission line being arranged in an area on the printed circuit board, formed by the difference between the outer dimensions of the first and the second filters, to achieve desirable passbands and enough attenuation in a suppression band outside the passbands.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: October 20, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takeshi Yuasa, Takeshi Oshima, Hiroyuki Aoyama
  • Publication number: 20200259234
    Abstract: A coaxial line is provided which includes: a first columnar conductor disposed inside a multilayer substrate such that one end thereof is coupled to a first stripline and that the other end thereof is coupled to a second stripline; and one or more second columnar conductors penetrating the multilayer substrate such that one end thereof is coupled to a ground layer and that the other end thereof is coupled to a ground layer, the first columnar conductor acting as an inner conductor, and the second columnar conductors acting as outer conductors. Each of the first and second striplines is coupled to an open stub acting as resonators and a matching conductor acting as capacitance matching elements.
    Type: Application
    Filed: September 14, 2018
    Publication date: August 13, 2020
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Motomi WATANABE, Takeshi YUASA, Takuma NISHIMURA
  • Patent number: 10680307
    Abstract: A substrate is used as one tube wall of a hollow waveguide, the substrate including a strip line wired in an inner layer, a first ground surface formed on a front surface, and a second ground surface formed on a part of a back surface. As a result of such a configuration, a waveguide strip line transducer having the same dimension as the external dimension of the hollow waveguide can be obtained.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: June 9, 2020
    Assignee: Mitsubishi Electric Coporation
    Inventors: Motomi Watanabe, Shinji Arai, Tomohiro Takahashi, Takeshi Oshima, Takeshi Yuasa, Takuma Nishimura, Hidenori Yukawa
  • Patent number: 10588215
    Abstract: Disclosed is an inter-board connection structure including a signal line conductor (22) provided in an outer layer of a printed circuit board (100), a signal line conductor (24) extending in a direction from the signal line conductor (22) to a signal pad (21), and forming a capacitive component between itself and a signal pad (21), and a signal line conductor (23) branching and extending from a connecting portion between the signal line conductor (22) and the signal line conductor (24), and electrically connected to the signal pad (21).
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: March 10, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takeshi Yuasa, Takeshi Oshima
  • Publication number: 20200022249
    Abstract: Disclosed is an inter-board connection structure including a signal line conductor (22) provided in an outer layer of a printed circuit board (100), a signal line conductor (24) extending in a direction from the signal line conductor (22) to a signal pad (21), and forming a capacitive component between itself and a signal pad (21), and a signal line conductor (23) branching and extending from a connecting portion between the signal line conductor (22) and the signal line conductor (24), and electrically connected to the signal pad (21).
    Type: Application
    Filed: April 7, 2017
    Publication date: January 16, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takeshi YUASA, Takeshi OSHIMA
  • Publication number: 20190357348
    Abstract: The multiband filter includes a printed circuit board, a first filter, a second filter having an outer dimension different from that of the first filter and passband frequencies higher than those of the first filter, an input terminal, an output terminal, a first inductor, a first capacitor, which are connected except the first capacitor by signal line conductor patterns to form a first transmission line, which connect the second filter, the input terminal, the output terminal, and the first capacitor to form a second transmission line, a part thereof in the first transmission line being arranged in an area on the printed circuit board, formed by the difference between the outer dimensions of the first and the second filters, to achieve desirable passbands and enough attenuation in a suppression band outside the passbands.
    Type: Application
    Filed: November 8, 2016
    Publication date: November 21, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takeshi YUASA, Takeshi OSHIMA, Hiroyuki AOYAMA
  • Publication number: 20190157735
    Abstract: A substrate is used as one tube wall of a hollow waveguide, the substrate including a strip line wired in an inner layer, a first ground surface formed on a front surface, and a second ground surface formed on a part of a back surface. As a result of such a configuration, a waveguide strip line transducer having the same dimension as the external dimension of the hollow waveguide can be obtained.
    Type: Application
    Filed: June 5, 2017
    Publication date: May 23, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Motomi WATANABE, Shinji ARAI, Tomohiro TAKAHASHI, Takeshi OSHIMA, Takeshi YUASA, Takuma NISHIMURA, Hidenori YUKAWA
  • Patent number: 10072114
    Abstract: A modified conjugated diene polymer obtained by modifying a conjugated diene polymer that is obtained by polymerizing a conjugated diene compound or polymerizing a conjugated diene compound and an aromatic vinyl compound is produced by a production method comprising a first modification step wherein an unsaturated binding site at least either in the skeleton or at the side chain of the conjugated diene polymer is reacted with a first compound having a group 4 or 13 element of the periodic table.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: September 11, 2018
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Morita, Takahiro Kawai, Takeshi Yuasa, Koichiro Tani, Koji Okada, Ryoji Tanaka
  • Patent number: 9951167
    Abstract: A modified conjugated diene-based polymer is produced that is a modified product of a conjugated diene-based polymer obtained by polymerizing a conjugated diene compound, or polymerizing a conjugated diene compound and an aromatic vinyl compound, in the presence of an alkali metal compound or an alkaline-earth metal compound. The modified conjugated diene-based polymer is produced by a production method that includes a main chain modification step that reacts at least either an unsaturated bond or a functional group that is included in a terminal-modified polymer and is not situated at a terminal of the terminal-modified polymer, with a specific compound that includes a functional group that interacts with silica, the terminal-modified polymer being obtained by introducing a functional group that interacts with silica into at least one terminal of the conjugated diene-based polymer.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: April 24, 2018
    Assignee: JSR CORPORATION
    Inventors: Takahiro Kawai, Hiroyuki Morita, Takeshi Yuasa, Koichiro Tani, Koji Okada, Ryoji Tanaka, Masahiro Shibata, Shigeru Abe
  • Patent number: 9691722
    Abstract: A surface mount high-frequency circuit is configured such that a plurality of ground pads 41 and a plurality of external connection ground conductors 51 are discretely disposed to surround a signal line pad 42 and an external connection signal line conductor 52, and a plurality of interlayer connection ground conductors 31 and that a plurality of columnar ground conductors 12 are discretely disposed to surround an interlayer connection signal line conductor 32. Thus, it is possible to suppress radiation of an unnecessary signal to the outside using a simple production process that is completed by only a wafer process without separately preparing a component such as a shield cover case.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: June 27, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takeshi Yuasa, Kiyoshi Ishida, Yoshihiro Tsukahara, Kohei Nishiguchi
  • Publication number: 20170077049
    Abstract: A surface mount high-frequency circuit is configured such that a plurality of ground pads 41 and a plurality of external connection ground conductors 51 are discretely disposed to surround a signal line pad 42 and an external connection signal line conductor 52, and a plurality of interlayer connection ground conductors 31 and that a plurality of columnar ground conductors 12 are discretely disposed to surround an interlayer connection signal line conductor 32. Thus, it is possible to suppress radiation of an unnecessary signal to the outside using a simple production process that is completed by only a wafer process without separately preparing a component such as a shield cover case.
    Type: Application
    Filed: March 26, 2014
    Publication date: March 16, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takeshi YUASA, Kiyoshi ISHIDA, Yoshihiro TSUKAHARA, Kohei NISHIGUCHI
  • Patent number: 9527932
    Abstract: A method for producing a modified conjugated diene polymer, comprises polymerizing (i) a monomer comprising a conjugated diene compound, or (ii) a monomer comprising a conjugated diene compound and an aromatic vinyl compound, in the presence of: at least one compound selected from the group consisting of formulae (1) and (2), and an alkali metal compound or an alkaline earth metal compound. A1 is a functional group which has a hydrocarbylsilyl group in which three hydrogen atoms in a —SiH3 structure are each substituted by a hydrocarbyl group; has at least one atom selected from the group consisting of N, P and S; and has no active hydrogen and is bound to R1 by any one atom of the N, P and S. R1 and R2 are hydrocarbylene groups.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: December 27, 2016
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Morita, Takeshi Yuasa, Koichiro Tani, Naoya Nosaka, Ryouji Tanaka, Koji Okada
  • Patent number: 9368855
    Abstract: Openings are formed by removing part of a ground conductor, and a differential signal line including signal line conductors is configured with some of the openings. In addition, a metal block is mounted thereon to cover the opening to thus configure a waveguide using the metal block and ground conductor as wall surfaces. A planar circuit to waveguide transition according to the above can achieve traveling wave conversions from a waveguide mode to a slot mode, and from the slot mode to a differential mode without utilizing resonance, which makes it possible to align a dominant direction of an electric field by the three ones; thus, a wider bandwidth can be expected. Thus, the wider bandwidth can be achieved with a simple layer structure.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: June 14, 2016
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takeshi Yuasa, Tetsuya Oba, Akimichi Hirota, Tetsu Owada
  • Publication number: 20150252133
    Abstract: A modified conjugated diene polymer obtained by modifying a conjugated diene polymer that is obtained by polymerizing a conjugated diene compound or polymerizing a conjugated diene compound and an aromatic vinyl compound is produced by a production method comprising a first modification step wherein an unsaturated binding site at least either in the skeleton or at the side chain of the conjugated diene polymer is reacted with a first compound having a group 4 or 13 element of the periodic table.
    Type: Application
    Filed: September 18, 2013
    Publication date: September 10, 2015
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki Morita, Takahiro Kawai, Takeshi Yuasa, Koichiro Tani, Koji Okada, Ryoji Tanaka
  • Patent number: 9090754
    Abstract: A method for producing a modified conjugated diene polymer usable as a raw material of a crosslinked polymer which is used for use in tires and the like of automobiles and can enhance low fuel consumption performance of automobiles and the like is provided. A method for producing a modified conjugated diene polymer comprising a polymerization step in which a monomer including a conjugated diene compound or a monomer including a conjugated diene compound and an aromatic vinyl compound is polymerized in the presence of at least one compound selected from the group consisting of the following formulae (1) and (2) and an alkali metal compound or an alkaline earth metal compound to obtain a modified conjugated diene polymer. (In the formulae, A1 is a hydrocarbylsilyl group in which three H's (hydrogen atoms) in a “—SiH3” structure are each substituted by a hydrocarbyl group, and R1 and R2 are hydrocarbylene groups.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: July 28, 2015
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Morita, Takeshi Yuasa, Koichiro Tani, Naoya Nosaka, Ryouji Tanaka
  • Publication number: 20150183914
    Abstract: A modified conjugated diene-based polymer is produced that is a modified product of a conjugated diene-based polymer obtained by polymerizing a conjugated diene compound, or polymerizing a conjugated diene compound and an aromatic vinyl compound, in the presence of an alkali metal compound or an alkaline-earth metal compound. The modified conjugated diene-based polymer is produced by a production method that includes a main chain modification step that reacts at least either an unsaturated bond or a functional group that is included in a terminal-modified polymer and is not situated at a terminal of the terminal-modified polymer, with a specific compound that includes a functional group that interacts with silica, the terminal-modified polymer being obtained by introducing a functional group that interacts with silica into at least one terminal of the conjugated diene-based polymer.
    Type: Application
    Filed: July 18, 2013
    Publication date: July 2, 2015
    Applicant: JSR CORPORATION
    Inventors: Takahiro Kawai, Hiroyuki Morita, Takeshi Yuasa, Koichiro Tani, Koji Okada, Ryoji Tanaka, Masahiro Shibata, Shigeru Abe
  • Patent number: 8962760
    Abstract: Objects of the present invention are to provide a rubber composition that can obtain a rubber elastic body having small rolling resistance and excellent impact resilience and a method for producing the same, and to provide a tire having small rolling resistance and excellent impact resilience. The rubber composition of the present invention is obtained by kneading a conjugated diene polymer (A) having a group with bonding reactivity to silica only at one site of one molecule of the polymer, a polymer (B) having groups with bonding reactivity to silica at a plurality of sites of one molecule of the polymer, and a filler (C) containing silica.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: February 24, 2015
    Assignee: JSR Corporation
    Inventors: Takeshi Yuasa, Koji Okada
  • Publication number: 20150008991
    Abstract: Openings are formed by removing part of a ground conductor, and a differential signal line including signal line conductors is configured with some of the openings. In addition, a metal block is mounted thereon to cover the opening to thus configure a waveguide using the metal block and ground conductor as wall surfaces. A planar circuit to waveguide transition according to the above can achieve traveling wave conversions from a waveguide mode to a slot mode, and from the slot mode to a differential mode without utilizing resonance, which makes it possible to align a dominant direction of an electric field by the three ones; thus, a wider bandwidth can be expected. Thus, the wider bandwidth can be achieved with a simple layer structure.
    Type: Application
    Filed: January 17, 2013
    Publication date: January 8, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takeshi Yuasa, Tetsuya Oba, Akimichi Hirota, Tetsu Owada
  • Patent number: 8927656
    Abstract: Objects of the present invention are to provide a rubber composition that can obtain a rubber elastic body having small rolling resistance and excellent impact resilience and a method for producing the same, and to provide a tire having small rolling resistance and excellent impact resilience. The rubber composition of the present invention is obtained by kneading a conjugated diene polymer (A) having a group with bonding reactivity to silica only at one site of one molecule of the polymer, a polymer (B) having groups with bonding reactivity to silica at a plurality of sites of one molecule of the polymer, and a filler (C) containing silica.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: January 6, 2015
    Assignee: JSR Corporation
    Inventors: Takeshi Yuasa, Koji Okada